GB1276682A - Semiconductor device and its manufacturing method - Google Patents

Semiconductor device and its manufacturing method

Info

Publication number
GB1276682A
GB1276682A GB44372/69A GB4437269A GB1276682A GB 1276682 A GB1276682 A GB 1276682A GB 44372/69 A GB44372/69 A GB 44372/69A GB 4437269 A GB4437269 A GB 4437269A GB 1276682 A GB1276682 A GB 1276682A
Authority
GB
United Kingdom
Prior art keywords
chips
plate
soldered
substrate
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB44372/69A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of GB1276682A publication Critical patent/GB1276682A/en
Expired legal-status Critical Current

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    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12043—Photo diode
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    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
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    • H01L2924/156—Material
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    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
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    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
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    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
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    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
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    • H01L2924/1904—Component type
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    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires
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    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
GB44372/69A 1968-09-11 1969-09-08 Semiconductor device and its manufacturing method Expired GB1276682A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP43064967A JPS51292B1 (enrdf_load_stackoverflow) 1968-09-11 1968-09-11

Publications (1)

Publication Number Publication Date
GB1276682A true GB1276682A (en) 1972-06-07

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GB44372/69A Expired GB1276682A (en) 1968-09-11 1969-09-08 Semiconductor device and its manufacturing method

Country Status (4)

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JP (1) JPS51292B1 (enrdf_load_stackoverflow)
DE (1) DE1945899B2 (enrdf_load_stackoverflow)
FR (1) FR2017780A1 (enrdf_load_stackoverflow)
GB (1) GB1276682A (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2270207A (en) * 1992-08-27 1994-03-02 Dsk Technology International L Cooling of electronics equipment
EP1930944A3 (en) * 2006-12-05 2009-01-07 Delphi Technologies, Inc. Wafer applied thermal-mechanical interface
CN108995505A (zh) * 2015-03-20 2018-12-14 翰昂汽车零部件有限公司 电动压缩机变频器冷却装置及设有其的变频器组装体
CN114365279A (zh) * 2019-09-13 2022-04-15 株式会社电装 半导体装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3521572A1 (de) * 1985-06-15 1986-12-18 Brown, Boveri & Cie Ag, 6800 Mannheim Leistungshalbleitermodul mit keramiksubstrat
US10403594B2 (en) * 2018-01-22 2019-09-03 Toyota Motor Engineering & Manufacturing North America, Inc. Hybrid bonding materials comprising ball grid arrays and metal inverse opal bonding layers, and power electronics assemblies incorporating the same

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2270207A (en) * 1992-08-27 1994-03-02 Dsk Technology International L Cooling of electronics equipment
EP1930944A3 (en) * 2006-12-05 2009-01-07 Delphi Technologies, Inc. Wafer applied thermal-mechanical interface
CN108995505A (zh) * 2015-03-20 2018-12-14 翰昂汽车零部件有限公司 电动压缩机变频器冷却装置及设有其的变频器组装体
CN108995505B (zh) * 2015-03-20 2022-04-12 翰昂汽车零部件有限公司 电动压缩机变频器冷却装置及设有其的变频器组装体
CN114365279A (zh) * 2019-09-13 2022-04-15 株式会社电装 半导体装置

Also Published As

Publication number Publication date
DE1945899A1 (de) 1970-03-26
FR2017780A1 (enrdf_load_stackoverflow) 1970-05-22
JPS51292B1 (enrdf_load_stackoverflow) 1976-01-07
DE1945899B2 (de) 1972-04-20

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