GB1265458A - - Google Patents

Info

Publication number
GB1265458A
GB1265458A GB1265458DA GB1265458A GB 1265458 A GB1265458 A GB 1265458A GB 1265458D A GB1265458D A GB 1265458DA GB 1265458 A GB1265458 A GB 1265458A
Authority
GB
United Kingdom
Prior art keywords
chips
wafer
foil
beam leads
electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of GB1265458A publication Critical patent/GB1265458A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H01L21/3043—Making grooves, e.g. cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body (electrodes)
    • H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body (electrodes) consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Dicing (AREA)
  • Weting (AREA)
GB1265458D 1969-10-16 1970-10-15 Expired GB1265458A (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19691952216 DE1952216A1 (de) 1969-10-16 1969-10-16 Verfahren zum Trennen von aus einem Halbleitergrundkoerper herzustellenden Halbleiterchips

Publications (1)

Publication Number Publication Date
GB1265458A true GB1265458A (enExample) 1972-03-01

Family

ID=5748393

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1265458D Expired GB1265458A (enExample) 1969-10-16 1970-10-15

Country Status (9)

Country Link
US (1) US3668774A (enExample)
JP (1) JPS4926741B1 (enExample)
AT (1) AT311421B (enExample)
CH (1) CH514936A (enExample)
DE (1) DE1952216A1 (enExample)
FR (1) FR2064378B1 (enExample)
GB (1) GB1265458A (enExample)
NL (1) NL7015236A (enExample)
SE (1) SE358511B (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5463970A (en) * 1977-10-31 1979-05-23 Nakamasa Ezawa Soap box for washing and arranging hair
DE19613561C2 (de) * 1996-04-04 2002-04-11 Micronas Gmbh Verfahren zum Vereinzeln von in einem Körper miteinander verbundenen, elektrisch getesteten elektronischen Elementen

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3513022A (en) * 1967-04-26 1970-05-19 Rca Corp Method of fabricating semiconductor devices
USB355026I5 (enExample) * 1967-11-13
US3590478A (en) * 1968-05-20 1971-07-06 Sony Corp Method of forming electrical leads for semiconductor device

Also Published As

Publication number Publication date
SE358511B (enExample) 1973-07-30
FR2064378A1 (enExample) 1971-07-23
NL7015236A (enExample) 1971-04-20
AT311421B (de) 1973-11-12
FR2064378B1 (enExample) 1974-09-06
DE1952216A1 (de) 1971-04-29
JPS4926741B1 (enExample) 1974-07-11
US3668774A (en) 1972-06-13
CH514936A (de) 1971-10-31

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PLNP Patent lapsed through nonpayment of renewal fees