GB1233404A - - Google Patents
Info
- Publication number
- GB1233404A GB1233404A GB1233404DA GB1233404A GB 1233404 A GB1233404 A GB 1233404A GB 1233404D A GB1233404D A GB 1233404DA GB 1233404 A GB1233404 A GB 1233404A
- Authority
- GB
- United Kingdom
- Prior art keywords
- target
- anode
- magnetic field
- filament
- plasma
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 abstract 2
- 239000007789 gas Substances 0.000 abstract 2
- 238000004544 sputter deposition Methods 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
- 229910052786 argon Inorganic materials 0.000 abstract 1
- 230000000694 effects Effects 0.000 abstract 1
- 230000005684 electric field Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 239000013077 target material Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/46—Sputtering by ion beam produced by an external ion source
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
- C23C14/354—Introduction of auxiliary energy into the plasma
- C23C14/355—Introduction of auxiliary energy into the plasma using electrons, e.g. triode sputtering
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Physical Vapour Deposition (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Plasma Technology (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR111571A FR1534917A (fr) | 1967-06-22 | 1967-06-22 | Perfectionnements à l'obtention de dépôts par pulvérisation cathodique |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1233404A true GB1233404A (enrdf_load_stackoverflow) | 1971-05-26 |
Family
ID=8633649
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB1233404D Expired GB1233404A (enrdf_load_stackoverflow) | 1967-06-22 | 1968-06-20 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US3616452A (enrdf_load_stackoverflow) |
| CH (1) | CH473908A (enrdf_load_stackoverflow) |
| FR (1) | FR1534917A (enrdf_load_stackoverflow) |
| GB (1) | GB1233404A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2599587C1 (ru) * | 2015-05-27 | 2016-10-10 | Российская Федерация от имени которой выступает Государственная корпорация по атомной энергии "Росатом" | Устройство для нанесения диффузионных покрытий |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH551497A (de) * | 1971-10-06 | 1974-07-15 | Balzers Patent Beteilig Ag | Anordnung zur zerstaeubung von stoffen mittels einer elektrischen niederspannungsentladung. |
| US4038171A (en) * | 1976-03-31 | 1977-07-26 | Battelle Memorial Institute | Supported plasma sputtering apparatus for high deposition rate over large area |
| US4175029A (en) * | 1978-03-16 | 1979-11-20 | Dmitriev Jury A | Apparatus for ion plasma coating of articles |
| US4440108A (en) * | 1982-09-24 | 1984-04-03 | Spire Corporation | Ion beam coating apparatus |
| JPH02163368A (ja) * | 1988-12-15 | 1990-06-22 | Matsushita Electric Ind Co Ltd | スパッタリング装置 |
| US6238533B1 (en) | 1995-08-07 | 2001-05-29 | Applied Materials, Inc. | Integrated PVD system for aluminum hole filling using ionized metal adhesion layer |
| US5962923A (en) | 1995-08-07 | 1999-10-05 | Applied Materials, Inc. | Semiconductor device having a low thermal budget metal filling and planarization of contacts, vias and trenches |
| US7253109B2 (en) | 1997-11-26 | 2007-08-07 | Applied Materials, Inc. | Method of depositing a tantalum nitride/tantalum diffusion barrier layer system |
| EP1034566A1 (en) * | 1997-11-26 | 2000-09-13 | Applied Materials, Inc. | Damage-free sculptured coating deposition |
| US6348764B1 (en) * | 2000-08-17 | 2002-02-19 | Taiwan Semiconductor Manufacturing Company, Ltd | Indirect hot cathode (IHC) ion source |
| US20060049041A1 (en) * | 2004-08-20 | 2006-03-09 | Jds Uniphase Corporation | Anode for sputter coating |
| EP1630260B1 (en) * | 2004-08-20 | 2011-07-13 | JDS Uniphase Inc. | Magnetic latch for a vapour deposition system |
| US7879209B2 (en) * | 2004-08-20 | 2011-02-01 | Jds Uniphase Corporation | Cathode for sputter coating |
| US8500973B2 (en) * | 2004-08-20 | 2013-08-06 | Jds Uniphase Corporation | Anode for sputter coating |
| US7954219B2 (en) * | 2004-08-20 | 2011-06-07 | Jds Uniphase Corporation | Substrate holder assembly device |
| US7785456B2 (en) * | 2004-10-19 | 2010-08-31 | Jds Uniphase Corporation | Magnetic latch for a vapour deposition system |
| SE529375C2 (sv) * | 2005-07-22 | 2007-07-24 | Sandvik Intellectual Property | Anordning för förbättrad plasmaaktivitet i PVD-reaktorer |
-
1967
- 1967-06-22 FR FR111571A patent/FR1534917A/fr not_active Expired
-
1968
- 1968-06-20 CH CH918768A patent/CH473908A/fr not_active IP Right Cessation
- 1968-06-20 GB GB1233404D patent/GB1233404A/en not_active Expired
- 1968-06-21 US US739029A patent/US3616452A/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2599587C1 (ru) * | 2015-05-27 | 2016-10-10 | Российская Федерация от имени которой выступает Государственная корпорация по атомной энергии "Росатом" | Устройство для нанесения диффузионных покрытий |
Also Published As
| Publication number | Publication date |
|---|---|
| FR1534917A (fr) | 1968-08-02 |
| CH473908A (fr) | 1969-06-15 |
| US3616452A (en) | 1971-10-26 |
| DE1765625B2 (de) | 1976-01-29 |
| DE1765625A1 (de) | 1972-04-13 |
Similar Documents
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|---|---|---|
| GB1233404A (enrdf_load_stackoverflow) | ||
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed [section 19, patents act 1949] | ||
| PCNP | Patent ceased through non-payment of renewal fee |