GB1231849A - - Google Patents

Info

Publication number
GB1231849A
GB1231849A GB6070368A GB1231849DA GB1231849A GB 1231849 A GB1231849 A GB 1231849A GB 6070368 A GB6070368 A GB 6070368A GB 1231849D A GB1231849D A GB 1231849DA GB 1231849 A GB1231849 A GB 1231849A
Authority
GB
United Kingdom
Prior art keywords
voids
film
substrate
tracks
bridging
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB6070368A
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of GB1231849A publication Critical patent/GB1231849A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4685—Manufacturing of cross-over conductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
GB6070368A 1968-12-20 1968-12-20 Expired GB1231849A (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB6070368 1968-12-20

Publications (1)

Publication Number Publication Date
GB1231849A true GB1231849A (enExample) 1971-05-12

Family

ID=10485943

Family Applications (1)

Application Number Title Priority Date Filing Date
GB6070368A Expired GB1231849A (enExample) 1968-12-20 1968-12-20

Country Status (1)

Country Link
GB (1) GB1231849A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2480673A1 (fr) * 1980-04-22 1981-10-23 Bosch Gmbh Robert Couches portantes, et procede pour leur fabrication, en particulier pour des detecteurs sur des moteurs a combustion interne
EP0400173A1 (de) * 1989-05-31 1990-12-05 Siemens Aktiengesellschaft Verfahren zur Erzeugung wenigstens einer Leiterbahnkreuzung

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2480673A1 (fr) * 1980-04-22 1981-10-23 Bosch Gmbh Robert Couches portantes, et procede pour leur fabrication, en particulier pour des detecteurs sur des moteurs a combustion interne
EP0400173A1 (de) * 1989-05-31 1990-12-05 Siemens Aktiengesellschaft Verfahren zur Erzeugung wenigstens einer Leiterbahnkreuzung

Similar Documents

Publication Publication Date Title
US4389481A (en) Method of making planar thin film transistors, transistor arrays
DE3485039D1 (de) Planare verkettete schaltung fuer integrierte schaltkreise.
KR880004724A (ko) 금속 기판 및 그 제조 방법
IT8322982A0 (it) Dispositivo elettronico includente una piastrina comprendente un substrato ed una struttura di collegamento elettrico formata su una superfice maggiore del substrato e costituita da unapellicola elettricamente isolante e da uno strato di collegamento metallico.
GB1268317A (en) Improvements in or relating to the manufacture of conductor plates
ES539842A0 (es) Procedimiento de fabricacion de circuitos impresos
GB1231849A (enExample)
GB1262245A (en) Production of circuit boards
GB1379558A (en) Methods of manufacture of multilayer circuit structures
DE3688255D1 (de) Verfahren zur herstellung von mehrschichtleiterplatten.
DE3377454D1 (en) Method and apparatus for the selective and self-adjusting deposition of metal layers and application of this method
JPS6489350A (en) Package for containing semiconductor element
SE8702704D0 (sv) Sett for tillverkning av ett monsterkort samt anordning for anvendning vid genomforande av settet
GB1256344A (en) Photographic manufacture of printed circuits
JPS5258491A (en) Semiconductor device
US4762732A (en) Process for forming silver conductors on a substrate
GB1287791A (en) A microcircuit and manufacture of same
GB1102832A (en) Improvements in or relating to the manufacture of thin film modules
ES349772A1 (es) Metodo de obtencion de circuitos semiconductores.
JPS5257972A (en) Method of plating conductive layer on circuit substrate
GB1255334A (en) Integrated circuits
GB1222332A (en) A method of producing an etched printed circuit board
JPS5379273A (en) Method of mounting lead pins to electronic circuit substrate
DE1765945A1 (de) Verfahren zum Herstellen einer gedruckten Schaltung mit in mehreren Ebenen verlaufenden flaechenhaften Leiterzuegen
GB1165565A (en) Improvements in or relating to the Formation of Electrically Insulating Layers.

Legal Events

Date Code Title Description
CSNS Application of which complete specification have been accepted and published, but patent is not sealed