GB1165565A - Improvements in or relating to the Formation of Electrically Insulating Layers. - Google Patents

Improvements in or relating to the Formation of Electrically Insulating Layers.

Info

Publication number
GB1165565A
GB1165565A GB4858366A GB4858366A GB1165565A GB 1165565 A GB1165565 A GB 1165565A GB 4858366 A GB4858366 A GB 4858366A GB 4858366 A GB4858366 A GB 4858366A GB 1165565 A GB1165565 A GB 1165565A
Authority
GB
United Kingdom
Prior art keywords
layer
stripes
support
polymer
solvent bath
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4858366A
Inventor
Kenneth Charles Arthur Bingham
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
INTERNAT COMPUTERS Ltd FORMERL
Fujitsu Services Ltd
Original Assignee
INTERNAT COMPUTERS Ltd FORMERL
Fujitsu Services Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by INTERNAT COMPUTERS Ltd FORMERL, Fujitsu Services Ltd filed Critical INTERNAT COMPUTERS Ltd FORMERL
Priority to GB4858366A priority Critical patent/GB1165565A/en
Publication of GB1165565A publication Critical patent/GB1165565A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H05K3/048—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer using a lift-off resist pattern or a release layer pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0079—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0582—Coating by resist, i.e. resist used as mask for application of insulating coating or of second resist

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

1,165,565. Printed circuits. INTERNATIONAL COMPUTERS Ltd. 9 Oct., 1967 [29 Oct., 1966], No. 48583/66. Heading H1R. In a method of forming a patterned electrically insulating layer on a support (e.g. a substrate carrying a printed circuit) the support is first coated with a positive photo resist layer which is masked, exposed to light, and developed leaving a resist pattern e.g. stripes 8 (Fig. 5) on the support 1. An insulating layer 9 of polymer is then formed thereon in a vacuum chamber 10 (Fig. 7). Monomer vapour from a source 12 is introduced into the chamber and electrons from an electron gun 13 polymerize the monomer vapour to form the required layer 9. The support is then immersed in a solvent bath to remove the resist stripes lying beneath the polymer layer so that portions of the polymer layer deposited on the stripes fall away leaving stripes 2 (Fig. 1) of insulation. The solvent bath may be agitated ultrasonically (Fig. 8, not shown). If required electrically conductive layers (e.g. a layer of chromium and a layer of gold) having the same pattern as the polymer layer 9 and in alignment therewith may be formed thereover by vapour deposition in the vacuum chamber before dissolving the resist pattern in the solvent bath. The polymer may be dimethyl polysiloxane.
GB4858366A 1966-10-29 1966-10-29 Improvements in or relating to the Formation of Electrically Insulating Layers. Expired GB1165565A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB4858366A GB1165565A (en) 1966-10-29 1966-10-29 Improvements in or relating to the Formation of Electrically Insulating Layers.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB4858366A GB1165565A (en) 1966-10-29 1966-10-29 Improvements in or relating to the Formation of Electrically Insulating Layers.

Publications (1)

Publication Number Publication Date
GB1165565A true GB1165565A (en) 1969-10-01

Family

ID=10449128

Family Applications (1)

Application Number Title Priority Date Filing Date
GB4858366A Expired GB1165565A (en) 1966-10-29 1966-10-29 Improvements in or relating to the Formation of Electrically Insulating Layers.

Country Status (1)

Country Link
GB (1) GB1165565A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0349161A2 (en) * 1988-06-27 1990-01-03 AT&T Corp. Printed wiring board fabrication method
EP1935633A1 (en) * 2006-12-21 2008-06-25 AGC Flat Glass Europe SA Translucent Panel for connecting components

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0349161A2 (en) * 1988-06-27 1990-01-03 AT&T Corp. Printed wiring board fabrication method
EP0349161A3 (en) * 1988-06-27 1990-05-09 American Telephone And Telegraph Company Printed wiring board fabrication method
EP1935633A1 (en) * 2006-12-21 2008-06-25 AGC Flat Glass Europe SA Translucent Panel for connecting components
WO2008080834A1 (en) * 2006-12-21 2008-07-10 Agc Flat Glass Europe Sa Translucent panel for connecting electronic components
EA016719B1 (en) * 2006-12-21 2012-07-30 Агк Гласс Юроп Translucent panel for connecting electronic components

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee