GB1190554A - Improvements in or relating to Electrical Circuit Structures. - Google Patents

Improvements in or relating to Electrical Circuit Structures.

Info

Publication number
GB1190554A
GB1190554A GB5421466A GB5421466A GB1190554A GB 1190554 A GB1190554 A GB 1190554A GB 5421466 A GB5421466 A GB 5421466A GB 5421466 A GB5421466 A GB 5421466A GB 1190554 A GB1190554 A GB 1190554A
Authority
GB
United Kingdom
Prior art keywords
conductors
polyimide film
gold
apertures
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB5421466A
Inventor
Kenneth Charles Arthur Bingham
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Services Ltd
Original Assignee
Fujitsu Services Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Services Ltd filed Critical Fujitsu Services Ltd
Priority to GB5421466A priority Critical patent/GB1190554A/en
Priority to DE19671640569 priority patent/DE1640569A1/en
Priority to DE19676608208 priority patent/DE6608208U/en
Publication of GB1190554A publication Critical patent/GB1190554A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/467—Adding a circuit layer by thin film methods
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
    • H05K1/0289—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns having a matrix lay-out, i.e. having selectively interconnectable sets of X-conductors and Y-conductors in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

1,190,554. Circuit assemblies. INTERNATIONAL COMPUTERS Ltd. 15 Nov., 1967 [3 Dec., 1966], No. 54214/66. Heading H1R. In a circuit assembly in which electrical components are interconnected by a conductor arrangement including a plurality of conductor layers interleaved with electrically insulating layers at least one of the insulating layers is formed from a hard polyimide film. A substrate 1 of sintered alumina ceramic, glass, silicon or insulated aluminium has a set of supply conductors 3 for connecting power supplies to integrated circuit chips 2 formed thereon by depositing a coating of gold in a glass matrix through a silk screen and then firing the coating. An insulating layer 4 of a glaze or polyimide film is then deposited over the conductors 3 and substrate 1 and is so patterned to produce a matrix of apertures 5. The return path of the supply currents is completed by the deposition of a ground plane 6 produced by screen printng on the vacuum deposition of gold so that the ground plane 6 is provided with apertures corresponding to apertures 5 and projections 7. After the deposition of a further insulation layer 18, similar to layer 4, over the ground plane 6 a set of parallel signal conductors are formed by the vacuum deposition of gold through an apertured mask. A further insulating layer consisting of a thin film of polyimide is then formed over the signal conductors 8 by applying a coating of the polyamic acid dissolved in dimethyl formamide, centrifuging the coated structure, drying and then curing to form a hard film. A mask of photo-resists having a series of slots corresponding to the required sets of second signal conductors 10 is positioned over the polyimide film and stripes of aluminium or chromium followed by gold are then vacuum deposited after which the photoresist mask is removed. The polyimide film is then selectively etched away leaving the second set of conductors 10 insulated from the first conductor 8 by the remaining portions 9 of the polyimide film. Various circuit arrangements are produced by cutting the conductors 8, 10 by a spark machining operation, electron or laser beam scanning, etching, scribing on using a condenser discharge. Connections between conductor sections are made by conducting links 15, 16 deposited by a photo resist and vacuum deposition method. The chips 2 may be inserted in the apertures 5 either before or after the conductors 8, 10.
GB5421466A 1966-12-03 1966-12-03 Improvements in or relating to Electrical Circuit Structures. Expired GB1190554A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
GB5421466A GB1190554A (en) 1966-12-03 1966-12-03 Improvements in or relating to Electrical Circuit Structures.
DE19671640569 DE1640569A1 (en) 1966-12-03 1967-11-21 Electrical circuit arrangement
DE19676608208 DE6608208U (en) 1966-12-03 1967-11-21 ELECTRIC CIRCUIT BOARD

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB5421466A GB1190554A (en) 1966-12-03 1966-12-03 Improvements in or relating to Electrical Circuit Structures.

Publications (1)

Publication Number Publication Date
GB1190554A true GB1190554A (en) 1970-05-06

Family

ID=10470303

Family Applications (1)

Application Number Title Priority Date Filing Date
GB5421466A Expired GB1190554A (en) 1966-12-03 1966-12-03 Improvements in or relating to Electrical Circuit Structures.

Country Status (2)

Country Link
DE (2) DE1640569A1 (en)
GB (1) GB1190554A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1988002210A1 (en) * 1986-09-15 1988-03-24 Baysage Pty. Ltd. Electrical isolation device
WO2022007157A1 (en) * 2020-07-06 2022-01-13 北京显芯科技有限公司 Driving circuit, lcd display screen and electronic device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3241531A1 (en) * 1982-11-10 1984-05-10 Wilhelm Weidtmann Gmbh & Co Kg, 5620 Velbert Swivel device for windows and doors, especially turn-and-tilt windows, doors or the like

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1988002210A1 (en) * 1986-09-15 1988-03-24 Baysage Pty. Ltd. Electrical isolation device
WO2022007157A1 (en) * 2020-07-06 2022-01-13 北京显芯科技有限公司 Driving circuit, lcd display screen and electronic device

Also Published As

Publication number Publication date
DE1640569A1 (en) 1970-12-17
DE6608208U (en) 1971-07-15

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee