GB1231849A - - Google Patents

Info

Publication number
GB1231849A
GB1231849A GB1231849DA GB1231849A GB 1231849 A GB1231849 A GB 1231849A GB 1231849D A GB1231849D A GB 1231849DA GB 1231849 A GB1231849 A GB 1231849A
Authority
GB
United Kingdom
Prior art keywords
voids
film
substrate
tracks
bridging
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of GB1231849A publication Critical patent/GB1231849A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4685—Manufacturing of cross-over conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5381—Crossover interconnections, e.g. bridge stepovers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0105—Tin [Sn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
GB1231849D 1968-12-20 1968-12-20 Expired GB1231849A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB6070368 1968-12-20

Publications (1)

Publication Number Publication Date
GB1231849A true GB1231849A (de) 1971-05-12

Family

ID=10485943

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1231849D Expired GB1231849A (de) 1968-12-20 1968-12-20

Country Status (1)

Country Link
GB (1) GB1231849A (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2480673A1 (fr) * 1980-04-22 1981-10-23 Bosch Gmbh Robert Couches portantes, et procede pour leur fabrication, en particulier pour des detecteurs sur des moteurs a combustion interne
EP0400173A1 (de) * 1989-05-31 1990-12-05 Siemens Aktiengesellschaft Verfahren zur Erzeugung wenigstens einer Leiterbahnkreuzung

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2480673A1 (fr) * 1980-04-22 1981-10-23 Bosch Gmbh Robert Couches portantes, et procede pour leur fabrication, en particulier pour des detecteurs sur des moteurs a combustion interne
EP0400173A1 (de) * 1989-05-31 1990-12-05 Siemens Aktiengesellschaft Verfahren zur Erzeugung wenigstens einer Leiterbahnkreuzung

Similar Documents

Publication Publication Date Title
DE3485039D1 (de) Planare verkettete schaltung fuer integrierte schaltkreise.
KR880004724A (ko) 금속 기판 및 그 제조 방법
GB1276095A (en) Microcircuits and processes for their manufacture
IT8322982A0 (it) Dispositivo elettronico includente una piastrina comprendente un substrato ed una struttura di collegamento elettrico formata su una superfice maggiore del substrato e costituita da unapellicola elettricamente isolante e da uno strato di collegamento metallico.
GB1268317A (en) Improvements in or relating to the manufacture of conductor plates
ES539842A0 (es) Procedimiento de fabricacion de circuitos impresos
GB1231849A (de)
GB1262245A (en) Production of circuit boards
DE3688255D1 (de) Verfahren zur herstellung von mehrschichtleiterplatten.
GB1379558A (en) Methods of manufacture of multilayer circuit structures
GB1221914A (en) Manufacture of integrated circuits
DE3377454D1 (en) Method and apparatus for the selective and self-adjusting deposition of metal layers and application of this method
SE8702704D0 (sv) Sett for tillverkning av ett monsterkort samt anordning for anvendning vid genomforande av settet
GB1256344A (en) Photographic manufacture of printed circuits
ES8305179A1 (es) "procedimiento para la fabricacion de placas de circuitos que contienen en estado integrado resistencias electricas y-o lugares de contactos de conmutacion".
JPS5258491A (en) Semiconductor device
US4762732A (en) Process for forming silver conductors on a substrate
GB1287791A (en) A microcircuit and manufacture of same
ES349772A1 (es) Metodo de obtencion de circuitos semiconductores.
JPS5257972A (en) Method of plating conductive layer on circuit substrate
GB1255334A (en) Integrated circuits
GB1222332A (en) A method of producing an etched printed circuit board
DE1765945A1 (de) Verfahren zum Herstellen einer gedruckten Schaltung mit in mehreren Ebenen verlaufenden flaechenhaften Leiterzuegen
GB1176051A (en) Electroless Metal Plating.
JPS5461468A (en) Film wiring substrate and electronic components using it

Legal Events

Date Code Title Description
CSNS Application of which complete specification have been accepted and published, but patent is not sealed