GB1199494A - Acidic Electrolytes for Depositing Shiny, Level Copper Coatings. - Google Patents
Acidic Electrolytes for Depositing Shiny, Level Copper Coatings.Info
- Publication number
- GB1199494A GB1199494A GB37420/67A GB3742067A GB1199494A GB 1199494 A GB1199494 A GB 1199494A GB 37420/67 A GB37420/67 A GB 37420/67A GB 3742067 A GB3742067 A GB 3742067A GB 1199494 A GB1199494 A GB 1199494A
- Authority
- GB
- United Kingdom
- Prior art keywords
- compound
- depositing
- nonylphenol
- thiourea
- acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000010949 copper Substances 0.000 title abstract 4
- 238000000151 deposition Methods 0.000 title abstract 3
- 239000003792 electrolyte Substances 0.000 title abstract 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title abstract 2
- 230000002378 acidificating effect Effects 0.000 title abstract 2
- 238000000576 coating method Methods 0.000 title abstract 2
- 229910052802 copper Inorganic materials 0.000 title abstract 2
- 150000001875 compounds Chemical class 0.000 abstract 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 abstract 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 abstract 2
- GLDOVTGHNKAZLK-UHFFFAOYSA-N octadecan-1-ol Chemical compound CCCCCCCCCCCCCCCCCCO GLDOVTGHNKAZLK-UHFFFAOYSA-N 0.000 abstract 2
- -1 polyethylene Polymers 0.000 abstract 2
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 abstract 2
- UGWULZWUXSCWPX-UHFFFAOYSA-N 2-sulfanylideneimidazolidin-4-one Chemical compound O=C1CNC(=S)N1 UGWULZWUXSCWPX-UHFFFAOYSA-N 0.000 abstract 1
- 229920002134 Carboxymethyl cellulose Polymers 0.000 abstract 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 abstract 1
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 abstract 1
- 239000004698 Polyethylene Substances 0.000 abstract 1
- 239000004372 Polyvinyl alcohol Substances 0.000 abstract 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 abstract 1
- 229910001514 alkali metal chloride Inorganic materials 0.000 abstract 1
- 125000003277 amino group Chemical group 0.000 abstract 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract 1
- DKVNPHBNOWQYFE-UHFFFAOYSA-N carbamodithioic acid Chemical compound NC(S)=S DKVNPHBNOWQYFE-UHFFFAOYSA-N 0.000 abstract 1
- 239000001768 carboxy methyl cellulose Substances 0.000 abstract 1
- 235000010948 carboxy methyl cellulose Nutrition 0.000 abstract 1
- 239000008112 carboxymethyl-cellulose Substances 0.000 abstract 1
- 229940105329 carboxymethylcellulose Drugs 0.000 abstract 1
- KZNICNPSHKQLFF-UHFFFAOYSA-N dihydromaleimide Natural products O=C1CCC(=O)N1 KZNICNPSHKQLFF-UHFFFAOYSA-N 0.000 abstract 1
- 150000002191 fatty alcohols Chemical class 0.000 abstract 1
- 125000000623 heterocyclic group Chemical group 0.000 abstract 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 abstract 1
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Substances C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 abstract 1
- GOQYKNQRPGWPLP-UHFFFAOYSA-N n-heptadecyl alcohol Natural products CCCCCCCCCCCCCCCCCO GOQYKNQRPGWPLP-UHFFFAOYSA-N 0.000 abstract 1
- 125000004433 nitrogen atom Chemical group N* 0.000 abstract 1
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 abstract 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid group Chemical group C(CCCCCCC\C=C/CCCCCCCC)(=O)O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 abstract 1
- 229910052760 oxygen Inorganic materials 0.000 abstract 1
- 239000001301 oxygen Substances 0.000 abstract 1
- 229920000573 polyethylene Polymers 0.000 abstract 1
- 229920001522 polyglycol ester Polymers 0.000 abstract 1
- 229920002451 polyvinyl alcohol Polymers 0.000 abstract 1
- 235000019422 polyvinyl alcohol Nutrition 0.000 abstract 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 abstract 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 abstract 1
- 150000003839 salts Chemical class 0.000 abstract 1
- 239000011780 sodium chloride Substances 0.000 abstract 1
- 229940012831 stearyl alcohol Drugs 0.000 abstract 1
- 229960002317 succinimide Drugs 0.000 abstract 1
- CWERGRDVMFNCDR-UHFFFAOYSA-N thioglycolic acid Chemical compound OC(=O)CS CWERGRDVMFNCDR-UHFFFAOYSA-N 0.000 abstract 1
- 150000003580 thiophosphoric acid esters Chemical class 0.000 abstract 1
- 229920002554 vinyl polymer Polymers 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Paints Or Removers (AREA)
- Electrolytic Production Of Metals (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DESC039431 | 1966-08-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1199494A true GB1199494A (en) | 1970-07-22 |
Family
ID=7435168
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB37420/67A Expired GB1199494A (en) | 1966-08-20 | 1967-08-15 | Acidic Electrolytes for Depositing Shiny, Level Copper Coatings. |
Country Status (3)
Country | Link |
---|---|
US (1) | US3502551A (enrdf_load_stackoverflow) |
GB (1) | GB1199494A (enrdf_load_stackoverflow) |
SE (1) | SE322956B (enrdf_load_stackoverflow) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2024046450A1 (zh) * | 2022-09-02 | 2024-03-07 | 宁波安集微电子科技有限公司 | 一种金属电镀组合物及其使用方法 |
WO2024046447A1 (zh) * | 2022-09-02 | 2024-03-07 | 宁波安集微电子科技有限公司 | 一种用于电解铜涂层的金属电镀组合物及其应用方法 |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2028803C3 (de) * | 1970-06-06 | 1980-08-14 | Schering Ag, 1000 Berlin Und 4619 Bergkamen | Polymere Phenazoniumverbindungen |
DE2053860C3 (de) * | 1970-10-29 | 1980-11-06 | Schering Ag | Saures wäßriges Bad zur galvanischen Abscheidung glänzender Kupferüberzüge |
GB1381666A (en) * | 1971-04-02 | 1975-01-22 | Univ Australian | Compositions containing copper salts their methods of production and the recovery and purification of copper |
US3961028A (en) * | 1971-04-02 | 1976-06-01 | Anumin Pty. Limited | Method of producing cuprous sulfate and bisulfate solutions |
US4113848A (en) * | 1971-04-02 | 1978-09-12 | Anumin Pty. Limited | Method of producing solutions containing cuprous ions |
US3966890A (en) * | 1971-04-02 | 1976-06-29 | Anumin Pty. Limited | Method of producing solutions containing cuprous ions |
US3770599A (en) * | 1971-05-24 | 1973-11-06 | Oxy Metal Finishing Corp | Acid zinc plating baths |
US3770598A (en) * | 1972-01-21 | 1973-11-06 | Oxy Metal Finishing Corp | Electrodeposition of copper from acid baths |
US3725220A (en) * | 1972-04-27 | 1973-04-03 | Lea Ronal Inc | Electrodeposition of copper from acidic baths |
DE2746938C2 (de) * | 1977-10-17 | 1987-04-09 | Schering AG, 1000 Berlin und 4709 Bergkamen | Wäßriges saures Bad zur galvanischen Abscheidung von glänzenden und rißfreien Kupferüberzügen und Verwendung dieses Bades |
US4376685A (en) * | 1981-06-24 | 1983-03-15 | M&T Chemicals Inc. | Acid copper electroplating baths containing brightening and leveling additives |
US4604175A (en) * | 1982-12-07 | 1986-08-05 | Naumov Jury I | Process for regeneration of iron-copper chloride etching solution |
DE3836521C2 (de) * | 1988-10-24 | 1995-04-13 | Atotech Deutschland Gmbh | Wäßriges saures Bad zur galvanischen Abscheidung von glänzenden und rißfreien Kupferüberzügen und Verwendung des Bades |
DE59700942D1 (de) | 1990-03-19 | 2000-02-10 | Atotech Deutschland Gmbh | Wässriges, saures Bad zur galvanischen Abscheidung von glänzenden und rissfreien Kupferüberzügen und Verwendung dieses Bades |
US5232575A (en) * | 1990-07-26 | 1993-08-03 | Mcgean-Rohco, Inc. | Polymeric leveling additive for acid electroplating baths |
US5151170A (en) * | 1991-12-19 | 1992-09-29 | Mcgean-Rohco, Inc. | Acid copper electroplating bath containing brightening additive |
US5730854A (en) * | 1996-05-30 | 1998-03-24 | Enthone-Omi, Inc. | Alkoxylated dimercaptans as copper additives and de-polarizing additives |
DE19758121C2 (de) * | 1997-12-17 | 2000-04-06 | Atotech Deutschland Gmbh | Wäßriges Bad und Verfahren zum elektrolytischen Abscheiden von Kupferschichten |
US7316772B2 (en) * | 2002-03-05 | 2008-01-08 | Enthone Inc. | Defect reduction in electrodeposited copper for semiconductor applications |
US8002962B2 (en) | 2002-03-05 | 2011-08-23 | Enthone Inc. | Copper electrodeposition in microelectronics |
US6896739B1 (en) * | 2003-12-03 | 2005-05-24 | For Your Ease Only, Inc. | Anti-tarnish aqueous treatment |
JP4973829B2 (ja) * | 2004-07-23 | 2012-07-11 | 上村工業株式会社 | 電気銅めっき浴及び電気銅めっき方法 |
DE102005011708B3 (de) * | 2005-03-11 | 2007-03-01 | Atotech Deutschland Gmbh | Polyvinylammoniumverbindung und Verfahren zu deren Herstellung sowie diese Verbindung enthaltende saure Lösung und Verfahren zum elektrolytischen Abscheiden eines Kupferniederschlages |
TWI328622B (en) * | 2005-09-30 | 2010-08-11 | Rohm & Haas Elect Mat | Leveler compounds |
WO2008142770A1 (ja) * | 2007-05-21 | 2008-11-27 | C. Uyemura & Co., Ltd. | 電気銅めっき浴 |
JP5637671B2 (ja) * | 2009-09-16 | 2014-12-10 | 上村工業株式会社 | 電気銅めっき浴及びその電気銅めっき浴を用いた電気めっき方法 |
CN101935854B (zh) * | 2010-09-20 | 2011-11-30 | 东莞华威铜箔科技有限公司 | 电解铜箔用添加剂的制备方法、制品及其应用 |
KR101809588B1 (ko) | 2013-11-06 | 2018-01-18 | 롬 앤드 하스 일렉트로닉 머트어리얼즈 엘엘씨 | 평활제로서의 질소 함유 폴리머 |
KR102036001B1 (ko) | 2015-04-28 | 2019-10-24 | 롬 앤드 하스 일렉트로닉 머트어리얼즈 엘엘씨 | 전기도금 욕을 위한 첨가제로서의 비스언하이드라이드와 디아민의 반응 생성물 |
TWI660541B (zh) * | 2018-10-01 | 2019-05-21 | 長春石油化學股份有限公司 | 用於鋰二次電池集電體之銅箔及包含其之負極 |
CN113881984B (zh) * | 2021-10-21 | 2022-09-16 | 深圳市励高表面处理材料有限公司 | 一种脉冲电镀整平剂及制备方法和应用该整平液的电镀液 |
CN114875409B (zh) * | 2022-06-07 | 2023-09-01 | 深圳市板明科技股份有限公司 | 一种线路板微蚀粗化液循环再生添加剂及其应用 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL298381A (enrdf_load_stackoverflow) * | 1953-09-19 | |||
US2853444A (en) * | 1955-10-18 | 1958-09-23 | Dow Chemical Co | Electrowinning of metals |
US2872346A (en) * | 1956-05-21 | 1959-02-03 | Miller Adolph | Metal plating bath |
US2931760A (en) * | 1957-09-25 | 1960-04-05 | Leon R Westbrook | Acid copper plating |
US3322657A (en) * | 1964-04-28 | 1967-05-30 | Langbein Pfanhauser Werke Ag | Electrodeposition of bright copper |
-
1967
- 1967-06-28 SE SE9526/67*A patent/SE322956B/xx unknown
- 1967-08-10 US US659608A patent/US3502551A/en not_active Expired - Lifetime
- 1967-08-15 GB GB37420/67A patent/GB1199494A/en not_active Expired
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2024046450A1 (zh) * | 2022-09-02 | 2024-03-07 | 宁波安集微电子科技有限公司 | 一种金属电镀组合物及其使用方法 |
WO2024046447A1 (zh) * | 2022-09-02 | 2024-03-07 | 宁波安集微电子科技有限公司 | 一种用于电解铜涂层的金属电镀组合物及其应用方法 |
Also Published As
Publication number | Publication date |
---|---|
DE1521031A1 (de) | 1969-09-04 |
DE1521031B2 (de) | 1975-09-25 |
US3502551A (en) | 1970-03-24 |
SE322956B (enrdf_load_stackoverflow) | 1970-04-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed [section 19, patents act 1949] | ||
PE20 | Patent expired after termination of 20 years |