GB1184277A - Improvements in and relating to Electroless Plating - Google Patents
Improvements in and relating to Electroless PlatingInfo
- Publication number
- GB1184277A GB1184277A GB51064/68A GB5106468A GB1184277A GB 1184277 A GB1184277 A GB 1184277A GB 51064/68 A GB51064/68 A GB 51064/68A GB 5106468 A GB5106468 A GB 5106468A GB 1184277 A GB1184277 A GB 1184277A
- Authority
- GB
- United Kingdom
- Prior art keywords
- copper
- litre
- oct
- metals
- complexing agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C23C18/405—Formaldehyde
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6976967 | 1967-10-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1184277A true GB1184277A (en) | 1970-03-11 |
Family
ID=13412321
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB51064/68A Expired GB1184277A (en) | 1967-10-27 | 1968-10-28 | Improvements in and relating to Electroless Plating |
Country Status (4)
| Country | Link |
|---|---|
| DE (1) | DE1806081B2 (enrdf_load_stackoverflow) |
| FR (1) | FR1600458A (enrdf_load_stackoverflow) |
| GB (1) | GB1184277A (enrdf_load_stackoverflow) |
| NL (2) | NL149862B (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2610470A1 (de) * | 1975-03-14 | 1976-09-30 | Hitachi Ltd | Loesung zum nichtgalvanischen verkupfern |
| US4343659A (en) | 1979-10-26 | 1982-08-10 | Hitachi, Ltd. | Process for producing copper barrier type, nuclear fuel cladding |
| CN112969819A (zh) * | 2018-11-14 | 2021-06-15 | Ymt股份有限公司 | 电镀积层和印刷电路板 |
-
1968
- 1968-10-25 FR FR1600458D patent/FR1600458A/fr not_active Expired
- 1968-10-25 DE DE19681806081 patent/DE1806081B2/de active Pending
- 1968-10-25 NL NL686815319A patent/NL149862B/xx not_active IP Right Cessation
- 1968-10-28 GB GB51064/68A patent/GB1184277A/en not_active Expired
-
1976
- 1976-02-10 NL NL7601332A patent/NL7601332A/xx unknown
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2610470A1 (de) * | 1975-03-14 | 1976-09-30 | Hitachi Ltd | Loesung zum nichtgalvanischen verkupfern |
| US4343659A (en) | 1979-10-26 | 1982-08-10 | Hitachi, Ltd. | Process for producing copper barrier type, nuclear fuel cladding |
| CN112969819A (zh) * | 2018-11-14 | 2021-06-15 | Ymt股份有限公司 | 电镀积层和印刷电路板 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE1806081B2 (de) | 1971-08-12 |
| DE1806081A1 (de) | 1969-06-19 |
| NL6815319A (enrdf_load_stackoverflow) | 1969-04-29 |
| NL7601332A (nl) | 1976-06-30 |
| NL149862B (nl) | 1976-06-15 |
| FR1600458A (enrdf_load_stackoverflow) | 1970-07-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed [section 19, patents act 1949] | ||
| PE20 | Patent expired after termination of 20 years |