GB1395314A - Electroless gold plating on refractory metals - Google Patents

Electroless gold plating on refractory metals

Info

Publication number
GB1395314A
GB1395314A GB869174A GB869174A GB1395314A GB 1395314 A GB1395314 A GB 1395314A GB 869174 A GB869174 A GB 869174A GB 869174 A GB869174 A GB 869174A GB 1395314 A GB1395314 A GB 1395314A
Authority
GB
United Kingdom
Prior art keywords
gold plating
rinsed
electroless gold
refractory metals
deionized water
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB869174A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ceramic Systems
Original Assignee
Ceramic Systems
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ceramic Systems filed Critical Ceramic Systems
Publication of GB1395314A publication Critical patent/GB1395314A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/48—Electroplating: Baths therefor from solutions of gold
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C25D5/38—Pretreatment of metallic surfaces to be electroplated of refractory metals or nickel
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Chemically Coating (AREA)

Abstract

1395314 Electroless gold plating CERAMIC SYSTEMS 26 Feb 1974 [8 June 1973] 8691/74 Heading C7F A metal substrate of e.g. Mo, W, Nb, Co is electrolessly plated with Au in a bath comprising Na- or KAu CN (2 to 10 g/l.), an organic chelating agent, e.g. e.d.t.a. ethylenediamine, and triethanolamine, (10 to 50 g/l.), an alkali metal salt of a weak acid, e.g. tartrate or citrate (25 to 100 g/l.), and alkali metal hydroxide to make pH 13 to 14. The substrate is first contacted with an alkali descaler at 80 to 100‹C, rinsed in deionized water, rinsed in dilute acid at 80 to 100‹C, and rinsed in boiling deionized water.
GB869174A 1973-06-08 1974-02-26 Electroless gold plating on refractory metals Expired GB1395314A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US368431A US3862850A (en) 1973-06-08 1973-06-08 Electroless gold plating on refractory metals
DE2414471A DE2414471C3 (en) 1973-06-08 1974-03-26 Aqueous bath for electroless gold plating of difficult-to-melt metals

Publications (1)

Publication Number Publication Date
GB1395314A true GB1395314A (en) 1975-05-21

Family

ID=25766875

Family Applications (1)

Application Number Title Priority Date Filing Date
GB869174A Expired GB1395314A (en) 1973-06-08 1974-02-26 Electroless gold plating on refractory metals

Country Status (3)

Country Link
US (1) US3862850A (en)
DE (1) DE2414471C3 (en)
GB (1) GB1395314A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2133046A (en) * 1982-12-01 1984-07-18 Omi Int Corp Electroless direct deposition of gold in metallized ceramics

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4374876A (en) * 1981-06-02 1983-02-22 Occidental Chemical Corporation Process for the immersion deposition of gold
US5178918A (en) * 1986-07-14 1993-01-12 Robert Duva Electroless plating process

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3032436A (en) * 1960-11-18 1962-05-01 Metal Proc Co Inc Method and composition for plating by chemical reduction
US3396042A (en) * 1961-08-28 1968-08-06 Sel Rex Corp Chemical gold plating composition
US3212918A (en) * 1962-05-28 1965-10-19 Ibm Electroless plating process
US3230098A (en) * 1962-10-09 1966-01-18 Engelhard Ind Inc Immersion plating with noble metals
US3468676A (en) * 1963-09-09 1969-09-23 Photocircuits Corp Electroless gold plating
US3589916A (en) * 1964-06-24 1971-06-29 Photocircuits Corp Autocatalytic gold plating solutions
US3627558A (en) * 1968-11-27 1971-12-14 Technograph Printed Circuits L Sensitization process for electroless plating
US3672939A (en) * 1969-06-02 1972-06-27 Ppg Industries Inc Electroless process for forming thin metal films

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2133046A (en) * 1982-12-01 1984-07-18 Omi Int Corp Electroless direct deposition of gold in metallized ceramics

Also Published As

Publication number Publication date
DE2414471C3 (en) 1980-06-26
DE2414471A1 (en) 1976-02-19
US3862850A (en) 1975-01-28
DE2414471B2 (en) 1977-04-28

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
732 Registration of transactions, instruments or events in the register (sect. 32/1977)
PCNP Patent ceased through non-payment of renewal fee