GB1395314A - Electroless gold plating on refractory metals - Google Patents
Electroless gold plating on refractory metalsInfo
- Publication number
- GB1395314A GB1395314A GB869174A GB869174A GB1395314A GB 1395314 A GB1395314 A GB 1395314A GB 869174 A GB869174 A GB 869174A GB 869174 A GB869174 A GB 869174A GB 1395314 A GB1395314 A GB 1395314A
- Authority
- GB
- United Kingdom
- Prior art keywords
- gold plating
- rinsed
- electroless gold
- refractory metals
- deionized water
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/48—Electroplating: Baths therefor from solutions of gold
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
- C25D5/38—Pretreatment of metallic surfaces to be electroplated of refractory metals or nickel
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Chemically Coating (AREA)
Abstract
1395314 Electroless gold plating CERAMIC SYSTEMS 26 Feb 1974 [8 June 1973] 8691/74 Heading C7F A metal substrate of e.g. Mo, W, Nb, Co is electrolessly plated with Au in a bath comprising Na- or KAu CN (2 to 10 g/l.), an organic chelating agent, e.g. e.d.t.a. ethylenediamine, and triethanolamine, (10 to 50 g/l.), an alkali metal salt of a weak acid, e.g. tartrate or citrate (25 to 100 g/l.), and alkali metal hydroxide to make pH 13 to 14. The substrate is first contacted with an alkali descaler at 80 to 100C, rinsed in deionized water, rinsed in dilute acid at 80 to 100C, and rinsed in boiling deionized water.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US368431A US3862850A (en) | 1973-06-08 | 1973-06-08 | Electroless gold plating on refractory metals |
DE2414471A DE2414471C3 (en) | 1973-06-08 | 1974-03-26 | Aqueous bath for electroless gold plating of difficult-to-melt metals |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1395314A true GB1395314A (en) | 1975-05-21 |
Family
ID=25766875
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB869174A Expired GB1395314A (en) | 1973-06-08 | 1974-02-26 | Electroless gold plating on refractory metals |
Country Status (3)
Country | Link |
---|---|
US (1) | US3862850A (en) |
DE (1) | DE2414471C3 (en) |
GB (1) | GB1395314A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2133046A (en) * | 1982-12-01 | 1984-07-18 | Omi Int Corp | Electroless direct deposition of gold in metallized ceramics |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4374876A (en) * | 1981-06-02 | 1983-02-22 | Occidental Chemical Corporation | Process for the immersion deposition of gold |
US5178918A (en) * | 1986-07-14 | 1993-01-12 | Robert Duva | Electroless plating process |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3032436A (en) * | 1960-11-18 | 1962-05-01 | Metal Proc Co Inc | Method and composition for plating by chemical reduction |
US3396042A (en) * | 1961-08-28 | 1968-08-06 | Sel Rex Corp | Chemical gold plating composition |
US3212918A (en) * | 1962-05-28 | 1965-10-19 | Ibm | Electroless plating process |
US3230098A (en) * | 1962-10-09 | 1966-01-18 | Engelhard Ind Inc | Immersion plating with noble metals |
US3468676A (en) * | 1963-09-09 | 1969-09-23 | Photocircuits Corp | Electroless gold plating |
US3589916A (en) * | 1964-06-24 | 1971-06-29 | Photocircuits Corp | Autocatalytic gold plating solutions |
US3627558A (en) * | 1968-11-27 | 1971-12-14 | Technograph Printed Circuits L | Sensitization process for electroless plating |
US3672939A (en) * | 1969-06-02 | 1972-06-27 | Ppg Industries Inc | Electroless process for forming thin metal films |
-
1973
- 1973-06-08 US US368431A patent/US3862850A/en not_active Expired - Lifetime
-
1974
- 1974-02-26 GB GB869174A patent/GB1395314A/en not_active Expired
- 1974-03-26 DE DE2414471A patent/DE2414471C3/en not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2133046A (en) * | 1982-12-01 | 1984-07-18 | Omi Int Corp | Electroless direct deposition of gold in metallized ceramics |
Also Published As
Publication number | Publication date |
---|---|
DE2414471C3 (en) | 1980-06-26 |
DE2414471A1 (en) | 1976-02-19 |
US3862850A (en) | 1975-01-28 |
DE2414471B2 (en) | 1977-04-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed [section 19, patents act 1949] | ||
732 | Registration of transactions, instruments or events in the register (sect. 32/1977) | ||
PCNP | Patent ceased through non-payment of renewal fee |