GB1182422A - Improvements in or relating to the Etching of Metals - Google Patents

Improvements in or relating to the Etching of Metals

Info

Publication number
GB1182422A
GB1182422A GB9772/67A GB977267A GB1182422A GB 1182422 A GB1182422 A GB 1182422A GB 9772/67 A GB9772/67 A GB 9772/67A GB 977267 A GB977267 A GB 977267A GB 1182422 A GB1182422 A GB 1182422A
Authority
GB
United Kingdom
Prior art keywords
resist
pattern
exposed
layer
aluminium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB9772/67A
Inventor
Ronald George Joseph Chapman
John Clark Maddison
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Plessey Co Ltd
Original Assignee
Plessey Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Plessey Co Ltd filed Critical Plessey Co Ltd
Priority to GB9772/67A priority Critical patent/GB1182422A/en
Priority to NL6707945A priority patent/NL6707945A/xx
Priority to SE08408/67A priority patent/SE339600B/xx
Priority to FR110286A priority patent/FR1527363A/en
Priority to DE19671621505 priority patent/DE1621505A1/en
Publication of GB1182422A publication Critical patent/GB1182422A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/02—Local etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer, layered thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0505—Double exposure of the same photosensitive layer

Abstract

1,182,422. Etching. PLESSEY CO. Ltd. 9 June, 1967 [15 June, 1966; 1 March, 1967], Nos. 26666/66 and 9772/67. Heading B6J. [Also in Division H1] Different metals in a multi-layer structure are etched by applying a positive working photo-resist to the outer layer of metal; exposing a first pattern and developing to remove the exposed resist; exposing a second pattern in the remaining resist; etching the outer layer of metal under the exposed first pattern; and then at some stage after this first etching step, developing the second pattern is permit the outer layer of metal under the exposed second pattern to be etched. In an example, successive layers (5, 6, 7) (Fig. 3, not shown) of aluminium nickel and aluminium are deposited on a glass substrate 4 and covered with a positiveworking photo-resist (8). The resist is exposed and developed to leave unexposed resist over areas 1, 2 and 3, Fig. 2, and then a second pattern is formed by exposing resist over area 3 only. The exposed aluminium is etched away with an ammonium persulphate/orthophosphoric acid mixture and then the second pattern is developed (Fig. 6, not shown). The exposed nickel layer is removed with dilute nitric acid (Fig. 7, not shown), and then the persulphate/phosphoric acid mixture is again used to not only remove the lowest layer (5) of exposed aluminium, but also to remove the top layer (6) in area 3. The remaining photo-resist, i.e. on areas 1 and 2, is then removed to leave a three layer metal pad on areas 1 and 2 and a twolayer interconnecting part in area 3. The process is applicable to more than two patterns.
GB9772/67A 1966-06-15 1966-06-15 Improvements in or relating to the Etching of Metals Expired GB1182422A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
GB9772/67A GB1182422A (en) 1966-06-15 1966-06-15 Improvements in or relating to the Etching of Metals
NL6707945A NL6707945A (en) 1966-06-15 1967-06-07
SE08408/67A SE339600B (en) 1966-06-15 1967-06-14
FR110286A FR1527363A (en) 1966-06-15 1967-06-14 Process for the production of printed circuits
DE19671621505 DE1621505A1 (en) 1966-06-15 1967-06-14 Printed circuit

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB2666666 1966-06-15
GB9772/67A GB1182422A (en) 1966-06-15 1966-06-15 Improvements in or relating to the Etching of Metals

Publications (1)

Publication Number Publication Date
GB1182422A true GB1182422A (en) 1970-02-25

Family

ID=26243163

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9772/67A Expired GB1182422A (en) 1966-06-15 1966-06-15 Improvements in or relating to the Etching of Metals

Country Status (4)

Country Link
DE (1) DE1621505A1 (en)
GB (1) GB1182422A (en)
NL (1) NL6707945A (en)
SE (1) SE339600B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108668437A (en) * 2017-03-27 2018-10-16 三星电子株式会社 Metal unit is installed and the electronic equipment of metal unit is installed including surface in surface

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108668437A (en) * 2017-03-27 2018-10-16 三星电子株式会社 Metal unit is installed and the electronic equipment of metal unit is installed including surface in surface

Also Published As

Publication number Publication date
DE1621505A1 (en) 1971-04-29
SE339600B (en) 1971-10-11
NL6707945A (en) 1967-12-18

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PLNP Patent lapsed through nonpayment of renewal fees