GB1114066A - An improved cooling plate - Google Patents

An improved cooling plate

Info

Publication number
GB1114066A
GB1114066A GB21564/66A GB2156466A GB1114066A GB 1114066 A GB1114066 A GB 1114066A GB 21564/66 A GB21564/66 A GB 21564/66A GB 2156466 A GB2156466 A GB 2156466A GB 1114066 A GB1114066 A GB 1114066A
Authority
GB
United Kingdom
Prior art keywords
cooling plate
cooling
plates
strip
space
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB21564/66A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Trane Co
Original Assignee
Trane Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Trane Co filed Critical Trane Co
Publication of GB1114066A publication Critical patent/GB1114066A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D9/00—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
    • F28D9/0062—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits for one heat-exchange medium being formed by spaced plates with inserted elements
    • F28D9/0068—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits for one heat-exchange medium being formed by spaced plates with inserted elements with means for changing flow direction of one heat exchange medium, e.g. using deflecting zones
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/025—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being corrugated, plate-like elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2240/00—Spacing means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
GB21564/66A 1965-10-24 1966-05-16 An improved cooling plate Expired GB1114066A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US504895A US3327776A (en) 1965-10-24 1965-10-24 Heat exchanger

Publications (1)

Publication Number Publication Date
GB1114066A true GB1114066A (en) 1968-05-15

Family

ID=24008162

Family Applications (1)

Application Number Title Priority Date Filing Date
GB21564/66A Expired GB1114066A (en) 1965-10-24 1966-05-16 An improved cooling plate

Country Status (3)

Country Link
US (1) US3327776A (enrdf_load_stackoverflow)
BE (1) BE681699A (enrdf_load_stackoverflow)
GB (1) GB1114066A (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0296019A1 (fr) * 1987-06-16 1988-12-21 Thomson-Csf Support pour circuit imprimé formant drain thermique à dilatation contrôlée, et procédé de fabrication
WO1990007255A1 (en) * 1988-12-14 1990-06-28 Cray Research, Inc. Cooling plate with interboard connector apertures
FR2681757A1 (fr) * 1991-09-24 1993-03-26 Behr Industrietechnik Gmbh Co Dispositif de refroidissement pour composants electriques.
EP2610908B1 (en) * 2010-08-23 2021-05-05 Sanoh Industrial Co., Ltd. Cooling device

Families Citing this family (74)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3650310A (en) * 1970-07-16 1972-03-21 Stewart & Stevenson Serv Inc Combination boat trim tab and heat exchanger
US3865183A (en) * 1973-10-23 1975-02-11 Control Data Corp Cooling systems for electronic modules
US4085728A (en) * 1976-08-16 1978-04-25 Tomchak Sigfrid A Solar energy heater
US4170220A (en) * 1976-10-29 1979-10-09 Smith Henry C Solar heat collector
JPS6138237Y2 (enrdf_load_stackoverflow) * 1978-11-17 1986-11-05
US4519447A (en) * 1980-08-04 1985-05-28 Fine Particle Technology Corporation Substrate cooling
US4513812A (en) * 1981-06-25 1985-04-30 Papst-Motoren Gmbh & Co. Kg Heat sink for electronic devices
US4478277A (en) * 1982-06-28 1984-10-23 The Trane Company Heat exchanger having uniform surface temperature and improved structural strength
US4631635A (en) * 1984-10-31 1986-12-23 The United States Of America As Represented By The Secretary Of The Air Force Vibration isolated cold plate assembly
US4697427A (en) * 1985-05-10 1987-10-06 Sundstrand Corporation Forced flow evaporator for unusual gravity conditions
US4753290A (en) * 1986-07-18 1988-06-28 Unisys Corporation Reduced-stress heat sink device
US4938280A (en) * 1988-11-07 1990-07-03 Clark William E Liquid-cooled, flat plate heat exchanger
US4922573A (en) * 1989-04-14 1990-05-08 Grumman Aerospace Corporation Compression fitted bushing installation
US5275235A (en) * 1989-07-28 1994-01-04 Cesaroni Anthony Joseph Panel heat exchanger
JPH0652747B2 (ja) * 1990-02-05 1994-07-06 インターナショナル・ビジネス・マシーンズ・コーポレイション 断熱装置
US5088005A (en) * 1990-05-08 1992-02-11 Sundstrand Corporation Cold plate for cooling electronics
US5269146A (en) * 1990-08-28 1993-12-14 Kerner James M Thermoelectric closed-loop heat exchange system
US5381510A (en) * 1991-03-15 1995-01-10 In-Touch Products Co. In-line fluid heating apparatus with gradation of heat energy from inlet to outlet
US5245693A (en) * 1991-03-15 1993-09-14 In-Touch Products Co. Parenteral fluid warmer apparatus and disposable cassette utilizing thin, flexible heat-exchange membrane
GB9211413D0 (en) * 1992-05-29 1992-07-15 Cesaroni Anthony Joseph Panel heat exchanger formed from tubes and sheets
US5343359A (en) * 1992-11-19 1994-08-30 Cray Research, Inc. Apparatus for cooling daughter boards
US5316077A (en) * 1992-12-09 1994-05-31 Eaton Corporation Heat sink for electrical circuit components
US5737387A (en) * 1994-03-11 1998-04-07 Arch Development Corporation Cooling for a rotating anode X-ray tube
JP3158983B2 (ja) * 1994-10-03 2001-04-23 住友精密工業株式会社 Ｌｓｉパッケージ冷却用コルゲート型放熱フィン
US5638900A (en) * 1995-01-27 1997-06-17 Ail Research, Inc. Heat exchange assembly
US6305463B1 (en) * 1996-02-22 2001-10-23 Silicon Graphics, Inc. Air or liquid cooled computer module cold plate
US5804761A (en) * 1996-05-02 1998-09-08 Chrysler Corporation Water cooled DC bus structure
US6047108A (en) * 1996-10-01 2000-04-04 Baxter International Inc. Blood warming apparatus
US5846224A (en) * 1996-10-01 1998-12-08 Baxter International Inc. Container for use with blood warming apparatus
US5983997A (en) * 1996-10-17 1999-11-16 Brazonics, Inc. Cold plate having uniform pressure drop and uniform flow rate
JP3479477B2 (ja) * 1999-12-16 2003-12-15 Ｓｍｃ株式会社 温調装置用熱交換装置
JP4312339B2 (ja) * 2000-02-24 2009-08-12 ナブテスコ株式会社 蛇行通路付熱伝達装置
US6508301B2 (en) * 2000-04-19 2003-01-21 Thermal Form & Function Cold plate utilizing fin with evaporating refrigerant
JP2002098454A (ja) * 2000-07-21 2002-04-05 Mitsubishi Materials Corp 液冷ヒートシンク及びその製造方法
JP2002046482A (ja) * 2000-07-31 2002-02-12 Honda Motor Co Ltd ヒートシンク式冷却装置
US6578626B1 (en) * 2000-11-21 2003-06-17 Thermal Corp. Liquid cooled heat exchanger with enhanced flow
US7134484B2 (en) * 2000-12-07 2006-11-14 International Business Machines Corporation Increased efficiency in liquid and gaseous planar device cooling technology
DE10125636B4 (de) * 2001-05-25 2004-03-25 Agilent Technologies, Inc. (n.d.Ges.d.Staates Delaware), Palo Alto Kühler für elektrische und/oder elektronische Bauteile
US20040182544A1 (en) * 2002-12-27 2004-09-23 Lee Hsieh Kun Cooling device utilizing liquid coolant
US7111674B2 (en) * 2003-08-06 2006-09-26 Fujitsu Limited Heat dissipating housing with interlocking chamfers and ESD resistance
JP2005106389A (ja) * 2003-09-30 2005-04-21 Zexel Valeo Climate Control Corp 熱交換チューブ
JP4234621B2 (ja) * 2004-02-16 2009-03-04 株式会社日立製作所 液冷システムおよび電子装置
US6843310B1 (en) * 2004-03-03 2005-01-18 Chin-Ping Chen Semi-closed air cooling type radiator
US7512422B2 (en) * 2004-05-28 2009-03-31 Ixys Corporation RF generator with commutation inductor
FI117590B (fi) * 2004-06-11 2006-11-30 Abb Oy Jäähdytyselementti
US20060118279A1 (en) * 2004-12-07 2006-06-08 Eric Stafford Water cooling system for computer components
JP4333587B2 (ja) * 2005-01-14 2009-09-16 三菱電機株式会社 ヒートシンクおよび冷却ユニット
US20060175043A1 (en) * 2005-02-07 2006-08-10 Hung-Tao Peng Temperature conductor and method of making same
JP2006286767A (ja) * 2005-03-31 2006-10-19 Hitachi Ltd 冷却ジャケット
DE102005034998B4 (de) * 2005-07-27 2016-06-23 Behr Industry Gmbh & Co. Kg Verfahren zur Herstellung einer Vorrichtung zur Kühlung von elektronischen Bauelementen sowie Vorrichtung zur Kühlung von elektronischen Bauelementen
US7757752B2 (en) * 2006-05-12 2010-07-20 Seiko Epson Corporation Heat exchanger, light source apparatus, and projector
TWM311234U (en) * 2006-08-02 2007-05-01 Man Zai Ind Co Ltd Water-cooling base
DE102006041788B4 (de) * 2006-09-06 2012-06-14 Airbus Operations Gmbh Luftfahrzeug-Elektronikkühleinrichtung für ein Luftfahrzeug mit einem Flüssigkeitskühlsystem
US8833438B2 (en) * 2006-11-29 2014-09-16 Raytheon Company Multi-orientation single or two phase coldplate with positive flow characteristics
US9743563B2 (en) 2007-03-20 2017-08-22 Conti Temic Microelectronic Gmbh Control appliance for using in the engine compartment or in the transmission of a motor vehicle and cooling system for such a control appliance
US20100101512A1 (en) * 2007-03-20 2010-04-29 Conti Temic Microelectronic Gmbh Control Appliance For Using In The Engine Compartment Or In The Transmission Of A Motor Vehicle And Cooling System For Such A Control Appliance
JP4967988B2 (ja) * 2007-10-25 2012-07-04 株式会社豊田自動織機 半導体冷却装置
US20100002392A1 (en) * 2008-07-07 2010-01-07 I-Ming Liu Assembled Heat Sink Structure
US20100147290A1 (en) * 2008-12-16 2010-06-17 Yan Krzysztof Kunczynski Solar Water Heater
US20100147289A1 (en) * 2008-12-16 2010-06-17 Yan Krzysztof Kunczynski Solar Water Heater
JP4737294B2 (ja) * 2009-01-08 2011-07-27 トヨタ自動車株式会社 放熱装置、パワーモジュール、放熱装置の製造方法
KR101289313B1 (ko) * 2009-05-22 2013-07-24 엘에스산전 주식회사 수냉식 쿨러 및 이를 구비한 인버터
US8991478B2 (en) * 2010-03-29 2015-03-31 Hamilton Sundstrand Space Systems International, Inc. Compact two sided cold plate with transfer tubes
EP2709431A1 (en) * 2011-05-12 2014-03-19 Toyota Jidosha Kabushiki Kaisha Cooler and manufacturing method for cooler
WO2014036476A2 (en) * 2012-08-31 2014-03-06 State Of Oregon Acting By And Through The State Board Of Higher Education On Behalf Of Oregon State University System and method for storing energy and purifying fluid
DE102012217874A1 (de) * 2012-09-28 2014-04-17 Behr Gmbh & Co. Kg Vorrichtung zur Führung eines Fluids
US20180106558A9 (en) * 2013-06-27 2018-04-19 Dana Canada Corporation Fluid channels having performance enhancement features and devices incorporating same
KR20150077673A (ko) * 2013-12-30 2015-07-08 삼성디스플레이 주식회사 전자기기용 방열부재
US10088239B2 (en) * 2015-05-28 2018-10-02 Hamilton Sundstrand Corporation Heat exchanger with improved flow at mitered corners
CN106705701A (zh) * 2015-08-18 2017-05-24 珠海格力节能环保制冷技术研究中心有限公司 散热器及其制造方法
US20170186667A1 (en) * 2015-12-26 2017-06-29 Intel Corporation Cooling of electronics using folded foil microchannels
JP6623810B2 (ja) * 2016-02-16 2019-12-25 オムロン株式会社 冷却器、流路ユニット
CN111477997B (zh) * 2020-03-25 2022-01-11 安徽沃博源科技有限公司 液冷板及液冷装置
DE102021208579B4 (de) 2021-08-06 2025-03-20 Zf Friedrichshafen Ag Getriebe für ein Kraftfahrzeug

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2912624A (en) * 1957-07-29 1959-11-10 Itt Fluid cooled electronic chassis
US3048374A (en) * 1958-11-10 1962-08-07 United Aircraft Prod Cooled mounting plate for electronic equipment
US3135321A (en) * 1960-03-07 1964-06-02 Trane Co Heat exchanger
FR1363913A (fr) * 1963-02-25 1964-06-19 Ygnis Sa élément parcouru par un fluide dans le sens de la longueur et destiné à favoriser les échanges thermiques

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0296019A1 (fr) * 1987-06-16 1988-12-21 Thomson-Csf Support pour circuit imprimé formant drain thermique à dilatation contrôlée, et procédé de fabrication
FR2616997A1 (fr) * 1987-06-16 1988-12-23 Thomson Csf Support pour circuit imprime, formant drain thermique a dilatation controlee, et procede de fabrication
US4878152A (en) * 1987-06-16 1989-10-31 Thomson-Csf Mounting for printed circuits forming a heat sink with controlled expansion
AU603450B2 (en) * 1987-06-16 1990-11-15 Thomson-Csf Mounting for printed circuit forming a heat sink with controlled expansion
WO1990007255A1 (en) * 1988-12-14 1990-06-28 Cray Research, Inc. Cooling plate with interboard connector apertures
FR2681757A1 (fr) * 1991-09-24 1993-03-26 Behr Industrietechnik Gmbh Co Dispositif de refroidissement pour composants electriques.
EP2610908B1 (en) * 2010-08-23 2021-05-05 Sanoh Industrial Co., Ltd. Cooling device

Also Published As

Publication number Publication date
BE681699A (enrdf_load_stackoverflow) 1966-10-31
US3327776A (en) 1967-06-27

Similar Documents

Publication Publication Date Title
GB1114066A (en) An improved cooling plate
US3907032A (en) Tube and fin heat exchanger
US3180404A (en) Cooling electronic heat producing elements and the like
US3197343A (en) Thermoelectric panels
GB1153403A (en) Plate Type Heat Exchangers.
GB1532673A (en) Plate-type heat exchanger
US3141500A (en) Heat exchanger coils of the panel type
CS207380B2 (en) Heat exchanger
GB1216306A (en) Plate-type heat exchangers
GB1278998A (en) Improvements in or relating to a heat exchanger for cooling fluids such as oil
US4408661A (en) Cabinet cooler heat exchanger
US2632633A (en) Punched fin elements for heat exchangers
US2804285A (en) Heat exchanger formed of channel members
GB885150A (en) Improvements in or relating to heat exchangers
US2988336A (en) Heat exchanger
US2784947A (en) Heat exchange assembly
ES344262A1 (es) Perfeccionamientos en la construccion de cambiadores de ca-lor.
JP2543854B2 (ja) プレ−ト式熱交換器
DE69907888D1 (de) Wärmetauschervorrichtung
US2983485A (en) Envelope construction
US3048374A (en) Cooled mounting plate for electronic equipment
GB859837A (en) Improvements relating to plate-type heat-exchangers
GB1071116A (en) Improvements in or relating to plate heat exchangers
FR2398279A1 (fr) Ailette d'echangeur de chaleur
GB1116620A (en) Improvements in or relating to heat exchangers