GB1111910A - Improvements in or relating to cathode sputtering - Google Patents

Improvements in or relating to cathode sputtering

Info

Publication number
GB1111910A
GB1111910A GB53862/65A GB5386265A GB1111910A GB 1111910 A GB1111910 A GB 1111910A GB 53862/65 A GB53862/65 A GB 53862/65A GB 5386265 A GB5386265 A GB 5386265A GB 1111910 A GB1111910 A GB 1111910A
Authority
GB
United Kingdom
Prior art keywords
substrate
cathode
sputtering
anode
rods
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB53862/65A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of GB1111910A publication Critical patent/GB1111910A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C23C14/541—Heating or cooling of the substrates
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N15/00—Investigating characteristics of particles; Investigating permeability, pore-volume, or surface-area of porous materials
    • G01N15/08—Investigating permeability, pore-volume, or surface area of porous materials
    • G01N15/088—Investigating volume, surface area, size or distribution of pores; Porosimetry
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields

Abstract

Cathode sputtering apparatus comprises a vacuum chamber, a cathode, substrate support and means such as a horseshoe permanent or electromagnet for generating a localized field for deflecting charged particles away from the surface of the substrate to prevent the heating of the substrate and means for adjusting the relative positions of the magnetic deflecting field and the article to vary the cooling effect. Metals such as Fe, Ni, and Co, metalloids and non metals may be deposited and reactive sputtering may be effected such as sputtering of Si in oxygen to deposit SiO2 on to Si. As shown in Fig. 1 anode 16 e.g. of aluminium and cathode 14 are supported on rests 28, 30 mounted on rods 26 electrically earthed. The substrate 18 is attached to the <PICT:1111910/C6-C7/1> anode or may be attached to the rods 26. A horseshoe magnet 40 surrounded by cooling coils 44 generates a localized field 42 over the surface of substrate 18 substantially parallel to the substrate. Figs. 2 and 3 (not shown) show a rack and pinion mechanism for adjusting the position of the magnet relative to the substrate.
GB53862/65A 1964-12-31 1965-12-20 Improvements in or relating to cathode sputtering Expired GB1111910A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US422677A US3330752A (en) 1964-12-31 1964-12-31 Method and apparatus for cathode sputtering including suppressing temperature rise adjacent the anode using a localized magnetic field

Publications (1)

Publication Number Publication Date
GB1111910A true GB1111910A (en) 1968-05-01

Family

ID=23675890

Family Applications (2)

Application Number Title Priority Date Filing Date
GB53862/65A Expired GB1111910A (en) 1964-12-31 1965-12-20 Improvements in or relating to cathode sputtering
GB12862/67A Expired GB1111410A (en) 1964-12-31 1967-03-20 Porosity data apparatus and method

Family Applications After (1)

Application Number Title Priority Date Filing Date
GB12862/67A Expired GB1111410A (en) 1964-12-31 1967-03-20 Porosity data apparatus and method

Country Status (5)

Country Link
US (1) US3330752A (en)
FR (1) FR1459625A (en)
GB (2) GB1111910A (en)
NL (1) NL6516538A (en)
SE (1) SE326354B (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0095211A2 (en) * 1982-05-21 1983-11-30 Koninklijke Philips Electronics N.V. Magnetron cathode sputtering system
GB2191787A (en) * 1986-06-23 1987-12-23 Balzers Hochvakuum Process and arrangement for sputtering a material by means of high frequency
GB2211861B (en) * 1987-10-30 1992-01-29 Pioneer Electronic Corp Photomagnetic memory medium having a non-columnar structure
DE4022708A1 (en) * 1990-07-17 1992-04-02 Balzers Hochvakuum ETCHING OR COATING PLANTS
DE4042417A1 (en) * 1990-07-17 1992-05-14 Balzers Hochvakuum Etching or coating appts. with divided chamber wall
CN109470618A (en) * 2018-11-19 2019-03-15 庄严 A kind of concrete impervious instrument being converted to negative pressure actuation using magnetic force

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3467057A (en) * 1966-07-27 1969-09-16 Hitachi Ltd Electron beam evaporator
US3889019A (en) * 1969-03-13 1975-06-10 United Aircraft Corp Vapor randomization in vacuum deposition of coatings
US4013539A (en) * 1973-01-12 1977-03-22 Coulter Information Systems, Inc. Thin film deposition apparatus
US3977955A (en) * 1974-05-10 1976-08-31 Bell Telephone Laboratories, Incorporated Method for cathodic sputtering including suppressing temperature rise
US4025410A (en) * 1975-08-25 1977-05-24 Western Electric Company, Inc. Sputtering apparatus and methods using a magnetic field
CA1159012A (en) * 1980-05-02 1983-12-20 Seitaro Matsuo Plasma deposition apparatus
DE3030374C2 (en) * 1980-08-11 1983-11-10 Harro Prof. Dr. 5900 Siegen Lentz Mercury porosimeter
US4778561A (en) * 1987-10-30 1988-10-18 Veeco Instruments, Inc. Electron cyclotron resonance plasma source
RU2527656C2 (en) * 2012-07-25 2014-09-10 Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Тамбовский государственный технический университет" ФГБО ВПО ТГТУ Method of measuring porosity of particles of bulk materials
CN110987759A (en) * 2019-12-11 2020-04-10 东南大学 Device and method for testing porosity of porous material by using gas

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2754259A (en) * 1952-11-29 1956-07-10 Sprague Electric Co Process and apparatus for growing single crystals
US3077444A (en) * 1956-06-13 1963-02-12 Siegfried R Hoh Laminated magnetic materials and methods
US3117065A (en) * 1959-09-02 1964-01-07 Magnetic Film And Tape Company Method and apparatus for making magnetic recording tape
US3133874A (en) * 1960-12-05 1964-05-19 Robert W Morris Production of thin film metallic patterns
US3170810A (en) * 1962-05-24 1965-02-23 Western Electric Co Methods of and apparatus for forming substances on preselected areas of substrates

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0095211A2 (en) * 1982-05-21 1983-11-30 Koninklijke Philips Electronics N.V. Magnetron cathode sputtering system
EP0095211A3 (en) * 1982-05-21 1984-05-09 N.V. Philips' Gloeilampenfabrieken Magnetron cathode sputtering system
GB2191787A (en) * 1986-06-23 1987-12-23 Balzers Hochvakuum Process and arrangement for sputtering a material by means of high frequency
GB2191787B (en) * 1986-06-23 1991-03-13 Balzers Hochvakuum Process and arrangement for sputtering a material by means of high frequency
GB2211861B (en) * 1987-10-30 1992-01-29 Pioneer Electronic Corp Photomagnetic memory medium having a non-columnar structure
US5135819A (en) * 1987-10-30 1992-08-04 Pioneer Electronic Corporation Photomagnetic memory medium having a non-columnar structure
DE4022708A1 (en) * 1990-07-17 1992-04-02 Balzers Hochvakuum ETCHING OR COATING PLANTS
DE4042417A1 (en) * 1990-07-17 1992-05-14 Balzers Hochvakuum Etching or coating appts. with divided chamber wall
US5460707A (en) * 1990-07-17 1995-10-24 Balzers Aktiengesellschaft Etching or coating method and a plant therefor
CN109470618A (en) * 2018-11-19 2019-03-15 庄严 A kind of concrete impervious instrument being converted to negative pressure actuation using magnetic force
CN109470618B (en) * 2018-11-19 2021-12-17 莆田市荔城区任西贸易有限公司 Adopt magnetic force to convert concrete impermeability appearance of negative pressure actuation into

Also Published As

Publication number Publication date
FR1459625A (en) 1966-11-18
SE326354B (en) 1970-07-20
NL6516538A (en) 1966-07-04
US3330752A (en) 1967-07-11
GB1111410A (en) 1968-04-24

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