GB1084028A - A method of soldering a semiconductor chip to a backing plate - Google Patents

A method of soldering a semiconductor chip to a backing plate

Info

Publication number
GB1084028A
GB1084028A GB50581/65A GB5058165A GB1084028A GB 1084028 A GB1084028 A GB 1084028A GB 50581/65 A GB50581/65 A GB 50581/65A GB 5058165 A GB5058165 A GB 5058165A GB 1084028 A GB1084028 A GB 1084028A
Authority
GB
United Kingdom
Prior art keywords
solder
hole
chip
soldering
pellet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB50581/65A
Other languages
English (en)
Inventor
Leonard Thomas Alexand Beckett
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STC PLC
Original Assignee
Standard Telephone and Cables PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Standard Telephone and Cables PLC filed Critical Standard Telephone and Cables PLC
Priority to GB50581/65A priority Critical patent/GB1084028A/en
Priority to ES0333938A priority patent/ES333938A1/es
Priority to BE690375D priority patent/BE690375A/xx
Priority to NL6616750A priority patent/NL6616750A/xx
Priority to FR85377A priority patent/FR1503071A/fr
Publication of GB1084028A publication Critical patent/GB1084028A/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • H10W40/10—
    • H10W72/073—
    • H10W72/07336—
    • H10W72/07353—
    • H10W72/334—
    • H10W72/931—

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Die Bonding (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
GB50581/65A 1965-11-29 1965-11-29 A method of soldering a semiconductor chip to a backing plate Expired GB1084028A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
GB50581/65A GB1084028A (en) 1965-11-29 1965-11-29 A method of soldering a semiconductor chip to a backing plate
ES0333938A ES333938A1 (es) 1965-11-29 1966-11-29 Un metodo para soldar un cuerpo a una base.
BE690375D BE690375A (cg-RX-API-DMAC10.html) 1965-11-29 1966-11-29
NL6616750A NL6616750A (cg-RX-API-DMAC10.html) 1965-11-29 1966-11-29
FR85377A FR1503071A (fr) 1965-11-29 1966-11-29 Procédé de soudage à l'étain

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB50581/65A GB1084028A (en) 1965-11-29 1965-11-29 A method of soldering a semiconductor chip to a backing plate

Publications (1)

Publication Number Publication Date
GB1084028A true GB1084028A (en) 1967-09-20

Family

ID=10456473

Family Applications (1)

Application Number Title Priority Date Filing Date
GB50581/65A Expired GB1084028A (en) 1965-11-29 1965-11-29 A method of soldering a semiconductor chip to a backing plate

Country Status (5)

Country Link
BE (1) BE690375A (cg-RX-API-DMAC10.html)
ES (1) ES333938A1 (cg-RX-API-DMAC10.html)
FR (1) FR1503071A (cg-RX-API-DMAC10.html)
GB (1) GB1084028A (cg-RX-API-DMAC10.html)
NL (1) NL6616750A (cg-RX-API-DMAC10.html)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2118101A1 (cg-RX-API-DMAC10.html) * 1970-12-15 1972-07-28 Philips Nv
DE2601765A1 (de) * 1975-01-24 1976-07-29 Senju Metal Industry Co Mikrokugel aus lotmaterial mit einem metallischen kern und verfahren zur herstellung derselben
FR2625038A1 (fr) * 1987-12-22 1989-06-23 Cit Alcatel Procede et dispositif de refroidissement d'un boitier de circuit integre
CN107598404A (zh) * 2016-07-12 2018-01-19 蔡明坤 均温装置的腔体的制造方法及其结构

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2118101A1 (cg-RX-API-DMAC10.html) * 1970-12-15 1972-07-28 Philips Nv
DE2601765A1 (de) * 1975-01-24 1976-07-29 Senju Metal Industry Co Mikrokugel aus lotmaterial mit einem metallischen kern und verfahren zur herstellung derselben
FR2625038A1 (fr) * 1987-12-22 1989-06-23 Cit Alcatel Procede et dispositif de refroidissement d'un boitier de circuit integre
EP0321899A1 (fr) * 1987-12-22 1989-06-28 Alcatel Cit Procédé et dispositif de refroidissement d'un boîtier de circuit intégré
US4924352A (en) * 1987-12-22 1990-05-08 Societe Anonyme Dite: Alcatel Cit Method and device for cooling an integrated circuit package
CN107598404A (zh) * 2016-07-12 2018-01-19 蔡明坤 均温装置的腔体的制造方法及其结构

Also Published As

Publication number Publication date
ES333938A1 (es) 1967-10-16
NL6616750A (cg-RX-API-DMAC10.html) 1967-05-30
BE690375A (cg-RX-API-DMAC10.html) 1967-05-29
FR1503071A (fr) 1967-11-24

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