NL6616750A - - Google Patents
Info
- Publication number
- NL6616750A NL6616750A NL6616750A NL6616750A NL6616750A NL 6616750 A NL6616750 A NL 6616750A NL 6616750 A NL6616750 A NL 6616750A NL 6616750 A NL6616750 A NL 6616750A NL 6616750 A NL6616750 A NL 6616750A
- Authority
- NL
- Netherlands
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
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- H10W40/10—
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- H10W72/073—
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- H10W72/07336—
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- H10W72/07353—
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- H10W72/334—
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- H10W72/931—
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Die Bonding (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB50581/65A GB1084028A (en) | 1965-11-29 | 1965-11-29 | A method of soldering a semiconductor chip to a backing plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NL6616750A true NL6616750A (cg-RX-API-DMAC10.html) | 1967-05-30 |
Family
ID=10456473
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL6616750A NL6616750A (cg-RX-API-DMAC10.html) | 1965-11-29 | 1966-11-29 |
Country Status (5)
| Country | Link |
|---|---|
| BE (1) | BE690375A (cg-RX-API-DMAC10.html) |
| ES (1) | ES333938A1 (cg-RX-API-DMAC10.html) |
| FR (1) | FR1503071A (cg-RX-API-DMAC10.html) |
| GB (1) | GB1084028A (cg-RX-API-DMAC10.html) |
| NL (1) | NL6616750A (cg-RX-API-DMAC10.html) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1331980A (en) * | 1970-12-15 | 1973-09-26 | Mullard Ltd | Mounting semiconductor bodies |
| JPS5535238B2 (cg-RX-API-DMAC10.html) * | 1975-01-24 | 1980-09-12 | ||
| FR2625038B1 (fr) * | 1987-12-22 | 1990-08-17 | Cit Alcatel | Procede et dispositif de refroidissement d'un boitier de circuit integre |
| CN107598404A (zh) * | 2016-07-12 | 2018-01-19 | 蔡明坤 | 均温装置的腔体的制造方法及其结构 |
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1965
- 1965-11-29 GB GB50581/65A patent/GB1084028A/en not_active Expired
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1966
- 1966-11-29 BE BE690375D patent/BE690375A/xx unknown
- 1966-11-29 FR FR85377A patent/FR1503071A/fr not_active Expired
- 1966-11-29 ES ES0333938A patent/ES333938A1/es not_active Expired
- 1966-11-29 NL NL6616750A patent/NL6616750A/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| ES333938A1 (es) | 1967-10-16 |
| GB1084028A (en) | 1967-09-20 |
| BE690375A (cg-RX-API-DMAC10.html) | 1967-05-29 |
| FR1503071A (fr) | 1967-11-24 |