FR2020723A1 - - Google Patents

Info

Publication number
FR2020723A1
FR2020723A1 FR6934970A FR6934970A FR2020723A1 FR 2020723 A1 FR2020723 A1 FR 2020723A1 FR 6934970 A FR6934970 A FR 6934970A FR 6934970 A FR6934970 A FR 6934970A FR 2020723 A1 FR2020723 A1 FR 2020723A1
Authority
FR
France
Prior art keywords
conductor
conductors
heat
oct
semi
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
FR6934970A
Other languages
English (en)
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RCA Corp
Original Assignee
RCA Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RCA Corp filed Critical RCA Corp
Publication of FR2020723A1 publication Critical patent/FR2020723A1/fr
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H10W70/461—
    • H10W74/016—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10659—Different types of terminals for the same component, e.g. solder balls combined with leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H10W72/5449—
    • H10W74/00—
    • H10W90/756—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Lead Frames For Integrated Circuits (AREA)
FR6934970A 1968-10-15 1969-10-13 Pending FR2020723A1 (cg-RX-API-DMAC10.html)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US76775368A 1968-10-15 1968-10-15

Publications (1)

Publication Number Publication Date
FR2020723A1 true FR2020723A1 (cg-RX-API-DMAC10.html) 1970-07-17

Family

ID=25080470

Family Applications (1)

Application Number Title Priority Date Filing Date
FR6934970A Pending FR2020723A1 (cg-RX-API-DMAC10.html) 1968-10-15 1969-10-13

Country Status (5)

Country Link
US (1) US3665256A (cg-RX-API-DMAC10.html)
DE (1) DE1951583A1 (cg-RX-API-DMAC10.html)
FR (1) FR2020723A1 (cg-RX-API-DMAC10.html)
GB (1) GB1252055A (cg-RX-API-DMAC10.html)
MY (1) MY7400286A (cg-RX-API-DMAC10.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2931449A1 (de) * 1978-08-02 1980-02-21 Hitachi Ltd Leitungsrahmen und denselben verwendende halbleitervorrichtung

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2123179B1 (cg-RX-API-DMAC10.html) * 1971-01-28 1974-02-15 Commissariat Energie Atomique
US3737728A (en) * 1971-12-17 1973-06-05 Data General Corp Mounting structure for heat-generating devices
US3836825A (en) * 1972-10-06 1974-09-17 Rca Corp Heat dissipation for power integrated circuit devices
US3905038A (en) * 1973-02-26 1975-09-09 Signetics Corp Semiconductor assembly and method
US4004195A (en) * 1975-05-12 1977-01-18 Rca Corporation Heat-sink assembly for high-power stud-mounted semiconductor device
JPS53132975A (en) * 1977-04-26 1978-11-20 Toshiba Corp Semiconductor device
US4137546A (en) * 1977-10-14 1979-01-30 Plessey Incorporated Stamped lead frame for semiconductor packages
US4218620A (en) 1978-07-20 1980-08-19 Eltec Instruments, Inc. Pyroelectric detector having improved suspension means
US4204248A (en) * 1978-11-20 1980-05-20 General Electric Company Heat transfer mounting arrangement for a solid state device connected to a circuit board
US4387413A (en) * 1980-12-24 1983-06-07 Rca Corporation Semiconductor apparatus with integral heat sink tab
US4459607A (en) * 1981-06-18 1984-07-10 Burroughs Corporation Tape automated wire bonded integrated circuit chip assembly
GB2141859A (en) * 1983-06-20 1985-01-03 Adco Ind Components A display device
DE3430849A1 (de) * 1984-08-22 1986-03-06 Gerd 7742 St Georgen Kammerer Verfahren zur raeumlichen ausweitung der elektrischen verbindung zwischen den anschlusskontakten hochintegrierter elektronischer bauelemente und den kontaktstellen einer elektrischen anschlussvorrichtung auf einem bauelementetraeger
US4584627A (en) * 1985-01-09 1986-04-22 Rogers Corporation Flat decoupling capacitor and method of manufacture thereof
JPS6249647A (ja) * 1986-08-13 1987-03-04 Hitachi Ltd レジンモ−ルド半導体装置の製法
IT1221258B (it) * 1988-06-22 1990-06-27 Sgs Thomson Microelectronics Contenitore plastico a cavita' per dispositivi semiconduttore
US5263245A (en) * 1992-01-27 1993-11-23 International Business Machines Corporation Method of making an electronic package with enhanced heat sinking
US5851337A (en) * 1997-06-30 1998-12-22 Caesar Technology Inc. Method of connecting TEHS on PBGA and modified connecting structure
US5867367A (en) * 1997-12-04 1999-02-02 Intel Corporation Quad flat pack integrated circuit package
US6713854B1 (en) 2000-10-16 2004-03-30 Legacy Electronics, Inc Electronic circuit module with a carrier having a mounting pad array
US7102892B2 (en) * 2000-03-13 2006-09-05 Legacy Electronics, Inc. Modular integrated circuit chip carrier
US6487078B2 (en) * 2000-03-13 2002-11-26 Legacy Electronics, Inc. Electronic module having a three dimensional array of carrier-mounted integrated circuit packages
US7103970B2 (en) * 2001-03-14 2006-09-12 Legacy Electronics, Inc. Method for fabricating a circuit board with a three dimensional surface mounted array of semiconductor chips
US7337522B2 (en) * 2000-10-16 2008-03-04 Legacy Electronics, Inc. Method and apparatus for fabricating a circuit board with a three dimensional surface mounted array of semiconductor chips
WO2006076381A2 (en) * 2005-01-12 2006-07-20 Legacy Electronics, Inc. Radial circuit board, system, and methods
CN105828521B (zh) * 2015-01-08 2018-10-02 上海和辉光电有限公司 印刷电路板的布局方法及印刷电路板

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1484389A (fr) * 1965-06-28 1967-06-09 Texas Instruments Inc Monture pour élément électronique, notamment pour semi-conducteur
US3395318A (en) * 1967-02-13 1968-07-30 Gen Precision Inc Circuit board card arrangement for the interconnection of electronic components

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1514273B2 (de) * 1964-08-21 1974-08-22 Nippon Electric Co., Ltd., Tokio Halbleiteranordmng
FR1495162A (fr) * 1965-10-22 1967-09-15 Motorola Inc Réglette métallique pour l'assemblage des semiconducteurs et semiconducteurs formés avec cette réglette
FR1530347A (fr) * 1966-07-13 1968-06-21 Motorola Inc Dispositif semiconducteur

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1484389A (fr) * 1965-06-28 1967-06-09 Texas Instruments Inc Monture pour élément électronique, notamment pour semi-conducteur
US3395318A (en) * 1967-02-13 1968-07-30 Gen Precision Inc Circuit board card arrangement for the interconnection of electronic components

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
ELECTRONICS, volume 41, no. 2, 22 janvier 1968 New York (US) "Beating the heat", page 44 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2931449A1 (de) * 1978-08-02 1980-02-21 Hitachi Ltd Leitungsrahmen und denselben verwendende halbleitervorrichtung

Also Published As

Publication number Publication date
MY7400286A (en) 1974-12-31
US3665256A (en) 1972-05-23
DE1951583A1 (de) 1971-02-04
GB1252055A (cg-RX-API-DMAC10.html) 1971-11-03

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