GB0417749D0 - Improved bipolar MOSFET devices and methods for their use - Google Patents
Improved bipolar MOSFET devices and methods for their useInfo
- Publication number
- GB0417749D0 GB0417749D0 GBGB0417749.9A GB0417749A GB0417749D0 GB 0417749 D0 GB0417749 D0 GB 0417749D0 GB 0417749 A GB0417749 A GB 0417749A GB 0417749 D0 GB0417749 D0 GB 0417749D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- methods
- mosfet devices
- improved bipolar
- bipolar mosfet
- improved
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D18/00—Thyristors
- H10D18/40—Thyristors with turn-on by field effect
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
- H10D12/411—Insulated-gate bipolar transistors [IGBT]
- H10D12/441—Vertical IGBTs
- H10D12/461—Vertical IGBTs having non-planar surfaces, e.g. having trenches, recesses or pillars in the surfaces of the emitter, base or collector regions
- H10D12/481—Vertical IGBTs having non-planar surfaces, e.g. having trenches, recesses or pillars in the surfaces of the emitter, base or collector regions having gate structures on slanted surfaces, on vertical surfaces, or in grooves, e.g. trench gate IGBTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/101—Integrated devices comprising main components and built-in components, e.g. IGBT having built-in freewheel diode
- H10D84/131—Thyristors having built-in components
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/101—Integrated devices comprising main components and built-in components, e.g. IGBT having built-in freewheel diode
- H10D84/131—Thyristors having built-in components
- H10D84/138—Thyristors having built-in components the built-in components being FETs
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GBGB0417749.9A GB0417749D0 (en) | 2004-08-10 | 2004-08-10 | Improved bipolar MOSFET devices and methods for their use |
| EP05794178A EP1782482A1 (en) | 2004-08-10 | 2005-08-10 | Bipolar mosfet devices |
| JP2007525352A JP5113961B2 (ja) | 2004-08-10 | 2005-08-10 | バイポーラmosfet素子 |
| US11/659,812 US7893457B2 (en) | 2004-08-10 | 2005-08-10 | Bipolar mosfet devices and methods for their use |
| PCT/GB2005/003146 WO2006016160A1 (en) | 2004-08-10 | 2005-08-10 | Bipolar mosfet devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GBGB0417749.9A GB0417749D0 (en) | 2004-08-10 | 2004-08-10 | Improved bipolar MOSFET devices and methods for their use |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB0417749D0 true GB0417749D0 (en) | 2004-09-08 |
Family
ID=32982782
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GBGB0417749.9A Ceased GB0417749D0 (en) | 2004-08-10 | 2004-08-10 | Improved bipolar MOSFET devices and methods for their use |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US7893457B2 (enExample) |
| EP (1) | EP1782482A1 (enExample) |
| JP (1) | JP5113961B2 (enExample) |
| GB (1) | GB0417749D0 (enExample) |
| WO (1) | WO2006016160A1 (enExample) |
Families Citing this family (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7582917B2 (en) * | 2006-03-10 | 2009-09-01 | Bae Systems Information And Electronic Systems Integration Inc. | Monolithically integrated light-activated thyristor and method |
| ITTO20080045A1 (it) * | 2008-01-18 | 2009-07-19 | St Microelectronics Srl | Schiera di fotodiodi operanti in modalita' geiger reciprocamente isolati e relativo procedimento di fabbricazione |
| ITTO20080046A1 (it) | 2008-01-18 | 2009-07-19 | St Microelectronics Srl | Schiera di fotodiodi operanti in modalita' geiger reciprocamente isolati e relativo procedimento di fabbricazione |
| IT1392366B1 (it) * | 2008-12-17 | 2012-02-28 | St Microelectronics Rousset | Fotodiodo operante in modalita' geiger con resistore di soppressione integrato e controllabile, schiera di fotodiodi e relativo procedimento di fabbricazione |
| US20100213507A1 (en) * | 2009-02-20 | 2010-08-26 | Ching-Chung Ko | Lateral bipolar junction transistor |
| US8674454B2 (en) | 2009-02-20 | 2014-03-18 | Mediatek Inc. | Lateral bipolar junction transistor |
| US7897995B2 (en) * | 2009-04-07 | 2011-03-01 | Mediatek Inc. | Lateral bipolar junction transistor with reduced base resistance |
| IT1393781B1 (it) * | 2009-04-23 | 2012-05-08 | St Microelectronics Rousset | Fotodiodo operante in modalita' geiger con resistore di soppressione integrato e controllabile ad effetto jfet, schiera di fotodiodi e relativo procedimento di fabbricazione |
| US8264035B2 (en) * | 2010-03-26 | 2012-09-11 | Force Mos Technology Co., Ltd. | Avalanche capability improvement in power semiconductor devices |
| IT1399690B1 (it) | 2010-03-30 | 2013-04-26 | St Microelectronics Srl | Fotodiodo a valanga operante in modalita' geiger ad elevato rapporto segnale rumore e relativo procedimento di fabbricazione |
| JP5537359B2 (ja) * | 2010-09-15 | 2014-07-02 | 株式会社東芝 | 半導体装置 |
| JP5480084B2 (ja) | 2010-09-24 | 2014-04-23 | 株式会社東芝 | 半導体装置 |
| KR101352766B1 (ko) | 2011-12-08 | 2014-01-15 | 서강대학교산학협력단 | 엔모스를 삽입한 수평형 절연게이트 바이폴라트랜지스터 소자 |
| JP2014060362A (ja) | 2012-09-19 | 2014-04-03 | Toshiba Corp | 半導体装置 |
| US9799731B2 (en) | 2013-06-24 | 2017-10-24 | Ideal Power, Inc. | Multi-level inverters using sequenced drive of double-base bidirectional bipolar transistors |
| US9029909B2 (en) | 2013-06-24 | 2015-05-12 | Ideal Power Inc. | Systems, circuits, devices, and methods with bidirectional bipolar transistors |
| US9742385B2 (en) | 2013-06-24 | 2017-08-22 | Ideal Power, Inc. | Bidirectional semiconductor switch with passive turnoff |
| US11637016B2 (en) | 2013-12-11 | 2023-04-25 | Ideal Power Inc. | Systems and methods for bidirectional device fabrication |
| US9355853B2 (en) | 2013-12-11 | 2016-05-31 | Ideal Power Inc. | Systems and methods for bidirectional device fabrication |
| JP6659685B2 (ja) | 2014-11-06 | 2020-03-04 | アイディール パワー インコーポレイテッド | ダブルベースバイポーラジャンクショントランジスタの最適化された動作を有する回路、方法、及びシステム、並びに、可変電圧自己同期整流器回路、方法、及びシステム、並びに、ダブルベースコンタクト双方向バイポーラジャンクショントランジスタ回路による動作ポイント最適化、方法、及びシステム。 |
| DE112015002120B4 (de) * | 2014-12-19 | 2024-02-22 | Fuji Electric Co., Ltd. | Halbleitervorrichtung und Halbleitervorrichtungsherstellungsverfahren |
| US9520492B2 (en) * | 2015-02-18 | 2016-12-13 | Macronix International Co., Ltd. | Semiconductor device having buried layer |
| WO2017043607A1 (ja) * | 2015-09-09 | 2017-03-16 | 住友電気工業株式会社 | 縦型炭化珪素半導体装置のトレンチのアニール処理装置、縦型炭化珪素半導体装置の製造方法および縦型炭化珪素半導体装置 |
| GB201604796D0 (en) * | 2015-11-10 | 2016-05-04 | Analog Devices Global | A combined isolator and power switch |
| US9935628B2 (en) | 2015-11-10 | 2018-04-03 | Analog Devices Global | FET—bipolar transistor combination, and a switch comprising such a FET—bipolar transistor combination |
| GB2606383A (en) * | 2021-05-06 | 2022-11-09 | Eco Semiconductors Ltd | A semiconductor device |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2941405B2 (ja) * | 1990-10-25 | 1999-08-25 | 株式会社東芝 | 半導体装置 |
| US5483087A (en) * | 1994-07-08 | 1996-01-09 | International Rectifier Corporation | Bidirectional thyristor with MOS turn-off capability with a single gate |
| AU6272798A (en) * | 1997-02-07 | 1998-08-26 | James Albert Cooper Jr. | Structure for increasing the maximum voltage of silicon carbide power transistors |
| DE19816448C1 (de) * | 1998-04-14 | 1999-09-30 | Siemens Ag | Universal-Halbleiterscheibe für Hochspannungs-Halbleiterbauelemente, ihr Herstellungsverfahren und ihre Verwendung |
| JP4761011B2 (ja) * | 1999-05-26 | 2011-08-31 | 株式会社豊田中央研究所 | サイリスタを有する半導体装置及びその製造方法 |
| GB9921068D0 (en) * | 1999-09-08 | 1999-11-10 | Univ Montfort | Bipolar mosfet device |
| JP2001177091A (ja) * | 1999-12-07 | 2001-06-29 | Analog & Power Electronics Corp | ラッチ制御可能な絶縁ゲートバイポーラトランジスタ |
| DE10026925C2 (de) * | 2000-05-30 | 2002-04-18 | Infineon Technologies Ag | Feldeffektgesteuertes, vertikales Halbleiterbauelement |
| JP3506676B2 (ja) * | 2001-01-25 | 2004-03-15 | Necエレクトロニクス株式会社 | 半導体装置 |
| US6465304B1 (en) * | 2001-10-04 | 2002-10-15 | General Semiconductor, Inc. | Method for fabricating a power semiconductor device having a floating island voltage sustaining layer |
| US7161208B2 (en) * | 2002-05-14 | 2007-01-09 | International Rectifier Corporation | Trench mosfet with field relief feature |
| JP2004103980A (ja) * | 2002-09-12 | 2004-04-02 | Toshiba Corp | 半導体装置 |
| JP4209260B2 (ja) * | 2003-06-04 | 2009-01-14 | Necエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
-
2004
- 2004-08-10 GB GBGB0417749.9A patent/GB0417749D0/en not_active Ceased
-
2005
- 2005-08-10 WO PCT/GB2005/003146 patent/WO2006016160A1/en not_active Ceased
- 2005-08-10 EP EP05794178A patent/EP1782482A1/en not_active Withdrawn
- 2005-08-10 US US11/659,812 patent/US7893457B2/en not_active Expired - Fee Related
- 2005-08-10 JP JP2007525352A patent/JP5113961B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| EP1782482A1 (en) | 2007-05-09 |
| US20080191238A1 (en) | 2008-08-14 |
| JP5113961B2 (ja) | 2013-01-09 |
| JP2008510294A (ja) | 2008-04-03 |
| WO2006016160A1 (en) | 2006-02-16 |
| US7893457B2 (en) | 2011-02-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| AT | Applications terminated before publication under section 16(1) |