FR3079053B1 - Substrats composites pour les dispositifs d'etiquette a ondes acoustiques de surface pour applications de rfid et de capteurs - Google Patents

Substrats composites pour les dispositifs d'etiquette a ondes acoustiques de surface pour applications de rfid et de capteurs Download PDF

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Publication number
FR3079053B1
FR3079053B1 FR1852279A FR1852279A FR3079053B1 FR 3079053 B1 FR3079053 B1 FR 3079053B1 FR 1852279 A FR1852279 A FR 1852279A FR 1852279 A FR1852279 A FR 1852279A FR 3079053 B1 FR3079053 B1 FR 3079053B1
Authority
FR
France
Prior art keywords
acoustic wave
surface acoustic
rfid
propagation
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1852279A
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English (en)
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FR3079053A1 (fr
Inventor
Sylvain Ballandras
Thierry Laroche
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Soitec SA
Original Assignee
Frecnsys SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to FR1852279A priority Critical patent/FR3079053B1/fr
Application filed by Frecnsys SAS filed Critical Frecnsys SAS
Priority to KR1020207029174A priority patent/KR20200140281A/ko
Priority to CN201980019361.1A priority patent/CN111868745A/zh
Priority to US16/980,324 priority patent/US20210034935A1/en
Priority to JP2020547377A priority patent/JP7480936B2/ja
Priority to EP19710688.3A priority patent/EP3766011B1/fr
Priority to PCT/EP2019/056428 priority patent/WO2019175315A1/fr
Publication of FR3079053A1 publication Critical patent/FR3079053A1/fr
Application granted granted Critical
Publication of FR3079053B1 publication Critical patent/FR3079053B1/fr
Priority to JP2022197349A priority patent/JP2023027239A/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/0672—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with resonating marks
    • G06K19/0675—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with resonating marks the resonating marks being of the surface acoustic wave [SAW] kind
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02559—Characteristics of substrate, e.g. cutting angles of lithium niobate or lithium-tantalate substrates
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02574—Characteristics of substrate, e.g. cutting angles of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02582—Characteristics of substrate, e.g. cutting angles of diamond substrates
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/25—Constructional features of resonators using surface acoustic waves

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Measuring Fluid Pressure (AREA)

Abstract

L'invention concerne un dispositif d'étiquette à ondes acoustiques de surface comprenant un substrat de propagation d'ondes acoustiques (202), au moins une structure de transducteur (204) comprenant des électrodes en peigne interdigitées (216), et au moins un moyen réfléchissant, le moyen réfléchissant comprenant au moins un réflecteur (206, 208, 210), caractérisé en ce que le substrat de propagation d'onde acoustique (202) est un substrat composite (202) comprenant un substrat de base (226) et une couche piézoélectrique (224), dans lequel l'orientation cristallographique de la couche piézoélectrique (224) par rapport au substrat de base (226) est telle que la propagation d'une onde de cisaillement à l'intérieur de la couche piézoélectrique (224) et dans la direction de propagation correspondant à l'onde acoustique est rendue possible. L'invention concerne également un dispositif de détermination de quantité physique et un procédé de fabrication d'un tel dispositif d'étiquette à ondes acoustiques de surface (200).
FR1852279A 2018-03-16 2018-03-16 Substrats composites pour les dispositifs d'etiquette a ondes acoustiques de surface pour applications de rfid et de capteurs Active FR3079053B1 (fr)

Priority Applications (8)

Application Number Priority Date Filing Date Title
FR1852279A FR3079053B1 (fr) 2018-03-16 2018-03-16 Substrats composites pour les dispositifs d'etiquette a ondes acoustiques de surface pour applications de rfid et de capteurs
CN201980019361.1A CN111868745A (zh) 2018-03-16 2019-03-14 用于rfid和传感器应用的saw标签的复合基板
US16/980,324 US20210034935A1 (en) 2018-03-16 2019-03-14 Composite substrates for saw tags or rfid and sensors applications
JP2020547377A JP7480936B2 (ja) 2018-03-16 2019-03-14 Ｒｆｉｄ及びセンサ用途のためのｓａｗタグ用複合基板
KR1020207029174A KR20200140281A (ko) 2018-03-16 2019-03-14 알에프아이디(rfid) 및 센서 애플리케이션을 위한 표면 탄성파 태그용 복합 기판
EP19710688.3A EP3766011B1 (fr) 2018-03-16 2019-03-14 Substrats composites pour étiquettes de scie pour applications rfid et capteurs
PCT/EP2019/056428 WO2019175315A1 (fr) 2018-03-16 2019-03-14 Substrats composites pour étiquettes de scie pour applications rfid et capteurs
JP2022197349A JP2023027239A (ja) 2018-03-16 2022-12-09 Ｒｆｉｄ及びセンサ用途のためのｓａｗタグ用複合基板

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1852279 2018-03-16
FR1852279A FR3079053B1 (fr) 2018-03-16 2018-03-16 Substrats composites pour les dispositifs d'etiquette a ondes acoustiques de surface pour applications de rfid et de capteurs

Publications (2)

Publication Number Publication Date
FR3079053A1 FR3079053A1 (fr) 2019-09-20
FR3079053B1 true FR3079053B1 (fr) 2020-03-27

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
FR1852279A Active FR3079053B1 (fr) 2018-03-16 2018-03-16 Substrats composites pour les dispositifs d'etiquette a ondes acoustiques de surface pour applications de rfid et de capteurs

Country Status (7)

Country Link
US (1) US20210034935A1 (fr)
EP (1) EP3766011B1 (fr)
JP (2) JP7480936B2 (fr)
KR (1) KR20200140281A (fr)
CN (1) CN111868745A (fr)
FR (1) FR3079053B1 (fr)
WO (1) WO2019175315A1 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11664780B2 (en) * 2019-05-14 2023-05-30 Skyworks Solutions, Inc. Rayleigh mode surface acoustic wave resonator
FR3105894B3 (fr) * 2019-12-30 2023-11-03 Frecnsys Structure de transducteur pour résonateur à accès unique
US11864465B2 (en) * 2020-05-22 2024-01-02 Wisconsin Alumni Research Foundation Integration of semiconductor membranes with piezoelectric substrates
FR3114875B1 (fr) * 2020-10-01 2023-01-20 Frecnsys Dispositif à résonateurs
CN112953449A (zh) * 2021-03-04 2021-06-11 偲百创(深圳)科技有限公司 横向激励剪切模式的声学谐振器的制造方法
CN113162579A (zh) * 2021-03-15 2021-07-23 电子科技大学 一种固态反射型声表面波谐振器及其制备方法
JP7345117B2 (ja) 2021-06-02 2023-09-15 パナソニックＩｐマネジメント株式会社 温度センサ及び温度測定装置

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DE19911369C2 (de) * 1999-03-15 2003-04-03 Nanotron Ges Fuer Mikrotechnik Oberflächen-Wellen-Wandler-Einrichtung sowie Identifikationssystem hiermit
JP2003234634A (ja) * 2002-02-08 2003-08-22 Toshiba Corp 弾性波素子及びその製造方法
FR2837636B1 (fr) * 2002-03-19 2004-09-24 Thales Sa Dispositif a ondes acoustiques d'interface en tantalate de lithium
US6958696B2 (en) * 2002-10-09 2005-10-25 Rf Saw Components, Inc. Transfer function system for determining an identifier on a surface acoustic wave identification tag and method of operating the same
US6759789B2 (en) * 2002-10-18 2004-07-06 Rf Saw Components, Inc. Surface acoustic wave identification tag having an interdigital transducer adapted for code discrimination and methods of operation and manufacture thereof
JP2004186868A (ja) * 2002-12-02 2004-07-02 Fujitsu Media Device Kk 弾性表面波素子、それを有する送信フィルタ及び受信フィルタ、並びにそれらを有するデュプレクサ
JP2004343671A (ja) * 2003-03-14 2004-12-02 Sony Corp 個体情報検出装置
JP4111032B2 (ja) * 2003-03-26 2008-07-02 セイコーエプソン株式会社 強誘電体素子の製造方法、表面弾性波素子、インクジェットヘッド、インクジェットプリンター、周波数フィルタ、発振器、電子回路、及び電子機器
EP1665526A4 (fr) * 2003-09-15 2008-09-10 Rf Saw Components Inc Procede de discrimination d'etiquettes d'identification a ondes acoustiques de surface
CN100539411C (zh) * 2004-04-01 2009-09-09 爱普生拓优科梦株式会社 表面声波器件
JP2006170864A (ja) * 2004-12-16 2006-06-29 Pegasus Net Kk Ｓａｗ温度計による室温管理及び火災報知システム
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WO2015198904A1 (fr) * 2014-06-26 2015-12-30 株式会社村田製作所 Filtre à ondes élastiques de surface de type à résonateur à couplage longitudinal
FR3033462B1 (fr) * 2015-03-04 2018-03-30 Commissariat A L'energie Atomique Et Aux Energies Alternatives Dispositif a ondes elastiques de surface comprenant un film piezoelectrique monocristallin et un substrat cristallin, a faibles coefficients viscoelastiques
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Also Published As

Publication number Publication date
WO2019175315A1 (fr) 2019-09-19
FR3079053A1 (fr) 2019-09-20
JP2021516906A (ja) 2021-07-08
JP7480936B2 (ja) 2024-05-10
US20210034935A1 (en) 2021-02-04
EP3766011A1 (fr) 2021-01-20
CN111868745A (zh) 2020-10-30
JP2023027239A (ja) 2023-03-01
EP3766011B1 (fr) 2022-06-22
KR20200140281A (ko) 2020-12-15

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