FR3079667B1 - Dispositif d'onde acoustique de surface sur substrat composite - Google Patents

Dispositif d'onde acoustique de surface sur substrat composite Download PDF

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Publication number
FR3079667B1
FR3079667B1 FR1852687A FR1852687A FR3079667B1 FR 3079667 B1 FR3079667 B1 FR 3079667B1 FR 1852687 A FR1852687 A FR 1852687A FR 1852687 A FR1852687 A FR 1852687A FR 3079667 B1 FR3079667 B1 FR 3079667B1
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FR
France
Prior art keywords
surface acoustic
acoustic wave
wave device
composite substrate
piezoelectric layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1852687A
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English (en)
Other versions
FR3079667A1 (fr
Inventor
Sylvain Ballandras
Florent Bernard
Emilie Courjou
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Soitec SA
Original Assignee
Frecnsys SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Frecnsys SAS filed Critical Frecnsys SAS
Priority to FR1852687A priority Critical patent/FR3079667B1/fr
Priority to CN201980022462.4A priority patent/CN111937302A/zh
Priority to PCT/EP2019/056933 priority patent/WO2019185415A1/fr
Priority to US17/042,768 priority patent/US11437973B2/en
Priority to EP19711372.3A priority patent/EP3776855B1/fr
Publication of FR3079667A1 publication Critical patent/FR3079667A1/fr
Application granted granted Critical
Publication of FR3079667B1 publication Critical patent/FR3079667B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02574—Characteristics of substrate, e.g. cutting angles of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/0222—Details of interface-acoustic, boundary, pseudo-acoustic or Stonely wave devices
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02236—Details of surface skimming bulk wave devices
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02559—Characteristics of substrate, e.g. cutting angles of lithium niobate or lithium-tantalate substrates
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02818—Means for compensation or elimination of undesirable effects
    • H03H9/02834—Means for compensation or elimination of undesirable effects of temperature influence
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/25—Constructional features of resonators using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/46—Filters
    • H03H9/64—Filters using surface acoustic waves
    • H03H9/6406—Filters characterised by a particular frequency characteristic
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02228—Guided bulk acoustic wave devices or Lamb wave devices having interdigital transducers situated in parallel planes on either side of a piezoelectric layer
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02566—Characteristics of substrate, e.g. cutting angles of semiconductor substrates
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02582—Characteristics of substrate, e.g. cutting angles of diamond substrates

Abstract

L'invention concerne un dispositif à ondes acoustiques de surface utilisant une onde guidée polarisée longitudinalement comprenant un substrat composite (7) comprenant une couche piézoélectrique(11) formée au-dessus un substrat de base (9), dans lequel l'orientation cristalline de la couche piézoélectrique (11) par rapport au substrat de base (9) est telle que la vitesse de phase de l'onde polarisée longitudinalement est inférieure à la vitesse de phase critique du substrat de base (9) à laquelle le guidage d'onde à l'intérieur de la couche piézoélectrique (11) disparaît. L'invention concerne également un procédé de fabrication d'un tel dispositif à ondes acoustiques de surface.
FR1852687A 2018-03-28 2018-03-28 Dispositif d'onde acoustique de surface sur substrat composite Active FR3079667B1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
FR1852687A FR3079667B1 (fr) 2018-03-28 2018-03-28 Dispositif d'onde acoustique de surface sur substrat composite
CN201980022462.4A CN111937302A (zh) 2018-03-28 2019-03-20 复合基板上的表面声波设备
PCT/EP2019/056933 WO2019185415A1 (fr) 2018-03-28 2019-03-20 Dispositif à ondes acoustiques de surface sur substrat composite
US17/042,768 US11437973B2 (en) 2018-03-28 2019-03-20 Surface acoustic wave device on composite substrate
EP19711372.3A EP3776855B1 (fr) 2018-03-28 2019-03-20 Dispositif à ondes acoustiques de surface sur substrat composite

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1852687 2018-03-28
FR1852687A FR3079667B1 (fr) 2018-03-28 2018-03-28 Dispositif d'onde acoustique de surface sur substrat composite

Publications (2)

Publication Number Publication Date
FR3079667A1 FR3079667A1 (fr) 2019-10-04
FR3079667B1 true FR3079667B1 (fr) 2020-03-27

Family

ID=62873465

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1852687A Active FR3079667B1 (fr) 2018-03-28 2018-03-28 Dispositif d'onde acoustique de surface sur substrat composite

Country Status (5)

Country Link
US (1) US11437973B2 (fr)
EP (1) EP3776855B1 (fr)
CN (1) CN111937302A (fr)
FR (1) FR3079667B1 (fr)
WO (1) WO2019185415A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11626856B2 (en) * 2019-10-30 2023-04-11 X-Celeprint Limited Non-linear tethers for suspended devices
KR20230146636A (ko) * 2021-02-20 2023-10-19 스펙트론 (선전) 테크놀로지스 씨오., 엘티디 공진 장치 및 음향 필터
WO2023087211A1 (fr) * 2021-11-18 2023-05-25 华为技术有限公司 Résonateur saw et filtre saw
WO2023250159A1 (fr) * 2022-06-24 2023-12-28 Massachusetts Institute Of Technology Dispositifs électroniques minces flexibles et systèmes et procédés associés

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW241397B (fr) * 1993-01-14 1995-02-21 Murata Manufacturing Co
EP1696562A4 (fr) * 2003-12-16 2010-07-07 Murata Manufacturing Co Dispositif a onde limite acoustique
JP5194416B2 (ja) * 2006-09-29 2013-05-08 住友大阪セメント株式会社 極細炭素含有塗料と極細炭素膜の製造方法及び極細炭素膜並びに電界電子放出素子
JP4316632B2 (ja) * 2007-04-16 2009-08-19 富士通メディアデバイス株式会社 弾性表面波装置及び分波器
DE112012007215B4 (de) * 2012-12-12 2018-10-31 Epcos Ag Elektroakustische Komponente
FR3033462B1 (fr) * 2015-03-04 2018-03-30 Commissariat A L'energie Atomique Et Aux Energies Alternatives Dispositif a ondes elastiques de surface comprenant un film piezoelectrique monocristallin et un substrat cristallin, a faibles coefficients viscoelastiques
WO2017043394A1 (fr) * 2015-09-10 2017-03-16 株式会社村田製作所 Dispositif à ondes élastiques, circuit frontal haute fréquence et dispositif de communication
US10084427B2 (en) * 2016-01-28 2018-09-25 Qorvo Us, Inc. Surface acoustic wave device having a piezoelectric layer on a quartz substrate and methods of manufacturing thereof
US10128814B2 (en) * 2016-01-28 2018-11-13 Qorvo Us, Inc. Guided surface acoustic wave device providing spurious mode rejection
JP6998650B2 (ja) * 2016-08-10 2022-01-18 株式会社日本製鋼所 接合基板、弾性表面波素子、弾性表面波デバイスおよび接合基板の製造方法

Also Published As

Publication number Publication date
CN111937302A (zh) 2020-11-13
WO2019185415A1 (fr) 2019-10-03
US11437973B2 (en) 2022-09-06
EP3776855B1 (fr) 2024-02-21
FR3079667A1 (fr) 2019-10-04
US20210028760A1 (en) 2021-01-28
EP3776855A1 (fr) 2021-02-17

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