FR2961347B1 - Capteur d'image a multiplication d'electrons - Google Patents
Capteur d'image a multiplication d'electronsInfo
- Publication number
- FR2961347B1 FR2961347B1 FR1002530A FR1002530A FR2961347B1 FR 2961347 B1 FR2961347 B1 FR 2961347B1 FR 1002530 A FR1002530 A FR 1002530A FR 1002530 A FR1002530 A FR 1002530A FR 2961347 B1 FR2961347 B1 FR 2961347B1
- Authority
- FR
- France
- Prior art keywords
- transfer
- gate
- region
- active layer
- photodiode region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 abstract 2
- 230000005684 electric field Effects 0.000 abstract 1
- 230000001939 inductive effect Effects 0.000 abstract 1
- 230000010354 integration Effects 0.000 abstract 1
- 230000035945 sensitivity Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14603—Special geometry or disposition of pixel-elements, address-lines or gate-electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14609—Pixel-elements with integrated switching, control, storage or amplification elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
- H01L27/14645—Colour imagers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1002530A FR2961347B1 (fr) | 2010-06-15 | 2010-06-15 | Capteur d'image a multiplication d'electrons |
IL213401A IL213401A (en) | 2010-06-15 | 2011-06-06 | An electron multiplier imaging detector and a suitable method |
US13/159,088 US8592740B2 (en) | 2010-06-15 | 2011-06-13 | Electron multiplication image sensor and corresponding method |
JP2011133300A JP5994137B2 (ja) | 2010-06-15 | 2011-06-15 | 電子増倍画像センサー及び対応する方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1002530A FR2961347B1 (fr) | 2010-06-15 | 2010-06-15 | Capteur d'image a multiplication d'electrons |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2961347A1 FR2961347A1 (fr) | 2011-12-16 |
FR2961347B1 true FR2961347B1 (fr) | 2012-08-24 |
Family
ID=43424191
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1002530A Expired - Fee Related FR2961347B1 (fr) | 2010-06-15 | 2010-06-15 | Capteur d'image a multiplication d'electrons |
Country Status (4)
Country | Link |
---|---|
US (1) | US8592740B2 (fr) |
JP (1) | JP5994137B2 (fr) |
FR (1) | FR2961347B1 (fr) |
IL (1) | IL213401A (fr) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5506683B2 (ja) * | 2008-08-11 | 2014-05-28 | 本田技研工業株式会社 | 画素、画素の製造方法、撮像装置および画像形成方法 |
FR2973160B1 (fr) * | 2011-03-23 | 2013-03-29 | E2V Semiconductors | Capteur d'image a multiplication d'electrons |
JP5829133B2 (ja) | 2012-01-13 | 2015-12-09 | 日立オートモティブシステムズステアリング株式会社 | パワーステアリング装置 |
JP5573978B2 (ja) * | 2012-02-09 | 2014-08-20 | 株式会社デンソー | 固体撮像素子およびその駆動方法 |
FR2990299B1 (fr) * | 2012-05-03 | 2014-05-09 | E2V Semiconductors | Capteur d'image matriciel a transfert de charges bidirectionnel a grilles dissymetriques |
EP2816601B1 (fr) | 2013-06-20 | 2017-03-01 | IMEC vzw | Améliorations apportées ou se rapportant à des photodiodes pour utilisation dans des capteurs d'image |
CN106847852B (zh) * | 2017-03-27 | 2024-02-27 | 安徽北方微电子研究院集团有限公司 | 一种电子倍增电荷耦合器件的背面结构及其制作方法 |
JP2020088293A (ja) * | 2018-11-29 | 2020-06-04 | キヤノン株式会社 | 光電変換装置、光電変換システム、移動体 |
CN112271187B (zh) * | 2020-09-25 | 2023-10-27 | 华东光电集成器件研究所 | 一种背照式emccd背面结构及其制作方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6512544B1 (en) * | 1998-06-17 | 2003-01-28 | Foveon, Inc. | Storage pixel sensor and array with compression |
KR100504562B1 (ko) * | 2001-07-18 | 2005-08-03 | 매그나칩 반도체 유한회사 | 씨모스 이미지 센서 |
DE602004021251D1 (de) * | 2004-08-04 | 2009-07-09 | Suisse Electronique Microtech | Festkörperbildsensor mit elektronischer Kontrolle der Apertur |
JP3996618B1 (ja) * | 2006-05-11 | 2007-10-24 | 総吉 廣津 | 半導体撮像素子 |
JP5324056B2 (ja) * | 2007-05-16 | 2013-10-23 | 株式会社デンソー | 固体撮像装置及びその駆動方法 |
KR100897187B1 (ko) * | 2007-08-09 | 2009-05-14 | (주)실리콘화일 | 감도저하를 방지하는 분리형 단위화소 및 상기 단위화소의구동방법 |
JP2009059847A (ja) * | 2007-08-31 | 2009-03-19 | Sanyo Electric Co Ltd | 撮像装置 |
US7755685B2 (en) * | 2007-09-28 | 2010-07-13 | Sarnoff Corporation | Electron multiplication CMOS imager |
JP2009135242A (ja) * | 2007-11-30 | 2009-06-18 | Sanyo Electric Co Ltd | 撮像装置 |
JP2009147049A (ja) * | 2007-12-13 | 2009-07-02 | Sanyo Electric Co Ltd | 撮像装置 |
US7538307B1 (en) * | 2008-02-19 | 2009-05-26 | Teledyne Licensing Llc | Charge multiplication CMOS image sensor and method for charge multiplication |
-
2010
- 2010-06-15 FR FR1002530A patent/FR2961347B1/fr not_active Expired - Fee Related
-
2011
- 2011-06-06 IL IL213401A patent/IL213401A/en active IP Right Grant
- 2011-06-13 US US13/159,088 patent/US8592740B2/en not_active Expired - Fee Related
- 2011-06-15 JP JP2011133300A patent/JP5994137B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP5994137B2 (ja) | 2016-09-21 |
FR2961347A1 (fr) | 2011-12-16 |
IL213401A0 (en) | 2011-07-31 |
US20110303822A1 (en) | 2011-12-15 |
IL213401A (en) | 2015-11-30 |
JP2012004569A (ja) | 2012-01-05 |
US8592740B2 (en) | 2013-11-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PLFP | Fee payment |
Year of fee payment: 7 |
|
PLFP | Fee payment |
Year of fee payment: 8 |
|
PLFP | Fee payment |
Year of fee payment: 9 |
|
CD | Change of name or company name |
Owner name: TELEDYNE E2V SEMICONDUCTORS SAS, FR Effective date: 20180907 |
|
PLFP | Fee payment |
Year of fee payment: 11 |
|
ST | Notification of lapse |
Effective date: 20220205 |