FR2889896B1 - Amplificateur de puissance de haute frequence - Google Patents

Amplificateur de puissance de haute frequence

Info

Publication number
FR2889896B1
FR2889896B1 FR0605835A FR0605835A FR2889896B1 FR 2889896 B1 FR2889896 B1 FR 2889896B1 FR 0605835 A FR0605835 A FR 0605835A FR 0605835 A FR0605835 A FR 0605835A FR 2889896 B1 FR2889896 B1 FR 2889896B1
Authority
FR
France
Prior art keywords
high frequency
power amplifier
frequency power
amplifier
power
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR0605835A
Other languages
English (en)
Other versions
FR2889896A1 (fr
Inventor
Seiki Gotou
Akira Inoue
Akira Ohta
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of FR2889896A1 publication Critical patent/FR2889896A1/fr
Application granted granted Critical
Publication of FR2889896B1 publication Critical patent/FR2889896B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03F—AMPLIFIERS
    • H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
    • H03F3/189—High-frequency amplifiers, e.g. radio frequency amplifiers
    • H03F3/19—High-frequency amplifiers, e.g. radio frequency amplifiers with semiconductor devices only
    • H03F3/193—High-frequency amplifiers, e.g. radio frequency amplifiers with semiconductor devices only with field-effect devices
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03F—AMPLIFIERS
    • H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
    • H03F3/189—High-frequency amplifiers, e.g. radio frequency amplifiers
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03F—AMPLIFIERS
    • H03F1/00—Details of amplifiers with only discharge tubes, only semiconductor devices or only unspecified devices as amplifying elements
    • H03F1/02—Modifications of amplifiers to raise the efficiency, e.g. gliding Class A stages, use of an auxiliary oscillation
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03F—AMPLIFIERS
    • H03F1/00—Details of amplifiers with only discharge tubes, only semiconductor devices or only unspecified devices as amplifying elements
    • H03F1/56—Modifications of input or output impedances, not otherwise provided for
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Amplifiers (AREA)
  • Microwave Amplifiers (AREA)
FR0605835A 2005-07-29 2006-06-28 Amplificateur de puissance de haute frequence Active FR2889896B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005220933 2005-07-29
JP2005367964A JP2007060616A (ja) 2005-07-29 2005-12-21 高周波電力増幅器

Publications (2)

Publication Number Publication Date
FR2889896A1 FR2889896A1 (fr) 2007-02-23
FR2889896B1 true FR2889896B1 (fr) 2014-06-13

Family

ID=37693676

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0605835A Active FR2889896B1 (fr) 2005-07-29 2006-06-28 Amplificateur de puissance de haute frequence

Country Status (6)

Country Link
US (1) US7310019B2 (fr)
JP (1) JP2007060616A (fr)
KR (1) KR100834866B1 (fr)
DE (1) DE102006033457A1 (fr)
FR (1) FR2889896B1 (fr)
TW (1) TWI318497B (fr)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4743077B2 (ja) * 2006-10-23 2011-08-10 三菱電機株式会社 高周波電力増幅器
JP5438947B2 (ja) 2007-11-27 2014-03-12 株式会社東芝 半導体装置
JP2009232076A (ja) * 2008-03-21 2009-10-08 Mitsubishi Electric Corp 高周波電力増幅器
JP5283943B2 (ja) 2008-03-25 2013-09-04 株式会社東芝 半導体装置
US7746173B1 (en) 2008-04-30 2010-06-29 Triquint Semiconductor, Inc. Power amplifier with output harmonic resonators
US7804366B2 (en) * 2008-11-06 2010-09-28 Raytheon Company Millimeter wave monolithic integrated circuits
JP5631607B2 (ja) * 2009-08-21 2014-11-26 株式会社東芝 マルチチップモジュール構造を有する高周波回路
JP5269864B2 (ja) * 2010-12-07 2013-08-21 株式会社東芝 半導体装置
US8698558B2 (en) * 2011-06-23 2014-04-15 Qualcomm Incorporated Low-voltage power-efficient envelope tracker
US9077285B2 (en) * 2012-04-06 2015-07-07 Freescale Semiconductor, Inc. Electronic devices with multiple amplifier stages and methods of their manufacture
JP6073371B2 (ja) * 2012-12-03 2017-02-01 三菱電機株式会社 広帯域増幅器
JP6565130B2 (ja) * 2013-10-31 2019-08-28 三菱電機株式会社 増幅器
US9806159B2 (en) * 2015-10-08 2017-10-31 Macom Technology Solutions Holdings, Inc. Tuned semiconductor amplifier
US20170302245A1 (en) 2016-04-15 2017-10-19 Macom Technology Solutions Holdings, Inc. Ultra-broad bandwidth matching technique
US10250197B1 (en) * 2017-11-06 2019-04-02 Nxp Usa, Inc. Multiple-stage power amplifiers implemented with multiple semiconductor technologies
EP3480945A1 (fr) 2017-11-06 2019-05-08 NXP USA, Inc. Amplificateurs de puissance à plusieurs étages mis en uvre avec de multiples technologies de semi-conducteur
WO2019155601A1 (fr) 2018-02-09 2019-08-15 三菱電機株式会社 Amplificateur
CN111989861B (zh) 2018-04-16 2023-06-20 三菱电机株式会社 高频功率放大器
US11158575B2 (en) 2018-06-05 2021-10-26 Macom Technology Solutions Holdings, Inc. Parasitic capacitance reduction in GaN-on-silicon devices
CN109921746A (zh) * 2018-12-20 2019-06-21 佛山臻智微芯科技有限公司 一种改善射频功率放大器性能的阻抗匹配电路结构
CN114902398A (zh) 2020-01-07 2022-08-12 三菱电机株式会社 高频半导体装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5105167A (en) * 1991-03-28 1992-04-14 Honeywell Inc. Harmonic injection amplifier
US5592122A (en) 1994-05-19 1997-01-07 Matsushita Electric Industrial Co., Ltd. Radio-frequency power amplifier with input impedance matching circuit based on harmonic wave
JP2695395B2 (ja) 1994-05-19 1997-12-24 松下電器産業株式会社 高周波電力増幅器
JP3438953B2 (ja) * 1994-07-20 2003-08-18 三洋電機株式会社 バイアス回路
JP3504472B2 (ja) * 1997-09-29 2004-03-08 三菱電機株式会社 半導体装置
JPH11145744A (ja) * 1997-11-06 1999-05-28 Nec Corp マイクロ波増幅器
JPH11346130A (ja) * 1998-06-02 1999-12-14 Mitsubishi Electric Corp 半導体装置
JP3888785B2 (ja) * 1998-09-28 2007-03-07 三菱電機株式会社 高周波電力増幅器
JP2000332124A (ja) * 1999-03-18 2000-11-30 Toshiba Corp 半導体装置
US6236274B1 (en) * 2000-01-04 2001-05-22 Industrial Technology Research Institute Second harmonic terminations for high efficiency radio frequency dual-band power amplifier
JP2001237647A (ja) 2000-02-22 2001-08-31 Kyocera Corp 高周波用電力増幅器
JP4601807B2 (ja) * 2000-11-29 2010-12-22 三菱電機株式会社 高周波電力増幅器
JP2003174335A (ja) * 2001-12-05 2003-06-20 Mitsubishi Electric Corp 増幅器

Also Published As

Publication number Publication date
US7310019B2 (en) 2007-12-18
US20070024371A1 (en) 2007-02-01
FR2889896A1 (fr) 2007-02-23
KR20070015048A (ko) 2007-02-01
KR100834866B1 (ko) 2008-06-03
TW200705799A (en) 2007-02-01
JP2007060616A (ja) 2007-03-08
DE102006033457A1 (de) 2007-04-19
TWI318497B (en) 2009-12-11

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