FR2855510B1 - Dispositif micromecanique notamment capteur de pression et procede de fabrication - Google Patents

Dispositif micromecanique notamment capteur de pression et procede de fabrication

Info

Publication number
FR2855510B1
FR2855510B1 FR0405570A FR0405570A FR2855510B1 FR 2855510 B1 FR2855510 B1 FR 2855510B1 FR 0405570 A FR0405570 A FR 0405570A FR 0405570 A FR0405570 A FR 0405570A FR 2855510 B1 FR2855510 B1 FR 2855510B1
Authority
FR
France
Prior art keywords
manufacture
pressure sensor
micromechanical device
micromechanical
sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0405570A
Other languages
English (en)
Other versions
FR2855510A1 (fr
Inventor
Joerg Muchow
Andreas Junger
Hubert Benzel
Juergen Nitsche
Frank Schaefer
Andreas Duell
Heinz Georg Vossenberg
Christoph Schelling
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of FR2855510A1 publication Critical patent/FR2855510A1/fr
Application granted granted Critical
Publication of FR2855510B1 publication Critical patent/FR2855510B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
    • B81C1/00158—Diaphragms, membranes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0264—Pressure sensors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/03—Static structures
    • B81B2203/0315—Cavities
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0111—Bulk micromachining
    • B81C2201/0115—Porous silicon

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Pressure Sensors (AREA)
FR0405570A 2003-05-26 2004-05-24 Dispositif micromecanique notamment capteur de pression et procede de fabrication Expired - Fee Related FR2855510B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10323559A DE10323559A1 (de) 2003-05-26 2003-05-26 Mikromechanische Vorrichtung, Drucksensor und Verfahren

Publications (2)

Publication Number Publication Date
FR2855510A1 FR2855510A1 (fr) 2004-12-03
FR2855510B1 true FR2855510B1 (fr) 2006-03-17

Family

ID=33426759

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0405570A Expired - Fee Related FR2855510B1 (fr) 2003-05-26 2004-05-24 Dispositif micromecanique notamment capteur de pression et procede de fabrication

Country Status (4)

Country Link
US (1) US20050016288A1 (fr)
DE (1) DE10323559A1 (fr)
FR (1) FR2855510B1 (fr)
IT (1) ITMI20040135A1 (fr)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005009422B4 (de) * 2005-03-02 2014-05-28 Robert Bosch Gmbh Mikromechanisches Bauelement und entsprechendes Herstellungsverfahren
DE102005032635A1 (de) 2005-07-13 2007-01-25 Robert Bosch Gmbh Mikromechanische Vorrichtung mit zwei Sensorstrukturen, Verfahren zur Herstellung einer mikromechanischen Vorrichtung
DE102005053861A1 (de) 2005-11-11 2007-05-16 Bosch Gmbh Robert Sensoranordnung und Verfahren zur Herstellung einer Sensoranordnung
DE102005055473A1 (de) 2005-11-22 2007-05-24 Robert Bosch Gmbh Mikromechanische Vorrichtung und Verfahren zur Herstellung einer mikromechanischen Vorrichtung
EP2015046A1 (fr) * 2007-06-06 2009-01-14 Infineon Technologies SensoNor AS Capteur de vide
DE102007026445A1 (de) 2007-06-06 2008-12-11 Robert Bosch Gmbh Mikromechanisches Bauelement und Verfahren zur Herstellung eines mikromechanischen Bauelements
DE102010002463A1 (de) * 2010-03-01 2011-09-01 Robert Bosch Gmbh Mikromechanisches Drucksensorelement und Verfahren zu dessen Herstellung
DE102010038810B4 (de) 2010-08-03 2020-01-02 Robert Bosch Gmbh Verfahren zum Verkappen eines mikromechanischen Bauelements
CN107209077B (zh) * 2015-02-12 2020-10-20 霍尼韦尔国际公司 具有改进的凹部或者空腔结构的微型机械装置
DE102016112762B4 (de) * 2016-07-12 2019-07-11 Infineon Technologies Ag Schichtstruktur und Verfahren zum Herstellen einer Schichtstruktur
US10965040B2 (en) * 2018-05-23 2021-03-30 Innolux Corporation Antenna device
JP7460388B2 (ja) 2020-02-19 2024-04-02 アズビル株式会社 圧力センサ

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5578843A (en) * 1994-10-06 1996-11-26 Kavlico Corporation Semiconductor sensor with a fusion bonded flexible structure
JP3426498B2 (ja) * 1997-08-13 2003-07-14 株式会社日立ユニシアオートモティブ 圧力センサ
DE19932541B4 (de) * 1999-07-13 2011-07-28 Robert Bosch GmbH, 70469 Verfahren zur Herstellung einer Membran
US6722963B1 (en) * 1999-08-03 2004-04-20 Micron Technology, Inc. Apparatus for chemical-mechanical planarization of microelectronic substrates with a carrier and membrane
DE10047500B4 (de) * 2000-09-26 2009-11-26 Robert Bosch Gmbh Mikromechanische Membran und Verfahren zu ihrer Herstellung
DE10136164A1 (de) * 2001-07-25 2003-02-20 Bosch Gmbh Robert Mikromechanisches Bauelement
EP1306348B1 (fr) * 2001-10-24 2007-05-16 Robert Bosch Gmbh Procédé de fabrication d'une unité capteuse à mémbrane et unité capteuse à mémbrane
KR100616508B1 (ko) * 2002-04-11 2006-08-29 삼성전기주식회사 Ｆｂａｒ 소자 및 그 제조방법

Also Published As

Publication number Publication date
US20050016288A1 (en) 2005-01-27
ITMI20040135A1 (it) 2004-04-29
DE10323559A1 (de) 2004-12-30
FR2855510A1 (fr) 2004-12-03

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20120131