DE102005053861A1 - Sensoranordnung und Verfahren zur Herstellung einer Sensoranordnung - Google Patents

Sensoranordnung und Verfahren zur Herstellung einer Sensoranordnung Download PDF

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Publication number
DE102005053861A1
DE102005053861A1 DE102005053861A DE102005053861A DE102005053861A1 DE 102005053861 A1 DE102005053861 A1 DE 102005053861A1 DE 102005053861 A DE102005053861 A DE 102005053861A DE 102005053861 A DE102005053861 A DE 102005053861A DE 102005053861 A1 DE102005053861 A1 DE 102005053861A1
Authority
DE
Germany
Prior art keywords
sensor arrangement
sensor
front side
producing
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE102005053861A
Other languages
English (en)
Inventor
Hubert Benzel
Roland Guenschel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Priority to DE102005053861A priority Critical patent/DE102005053861A1/de
Priority to US11/592,904 priority patent/US7493819B2/en
Priority to JP2006304169A priority patent/JP2007132942A/ja
Publication of DE102005053861A1 publication Critical patent/DE102005053861A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0006—Interconnects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0061—Electrical connection means
    • G01L19/0069—Electrical connection means from the sensor to its support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/145—Housings with stress relieving means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/147—Details about the mounting of the sensor to support or covering means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
    • G01L9/0045—Diaphragm associated with a buried cavity
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Child & Adolescent Psychology (AREA)
  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)

Abstract

Sensoranordnung, insbesondere ein mikromechanischer Drucksensor, aufweisend ein Substrat mit einer Vorderseite und mit einer Rückseite, wobei die Vorderseite einem Medium zugewandt ist und die Rückseite auf der gegenüberliegenden Seite des Substrats angeordnet ist, wobei eine Sensormembran mit wenigstens einem Sensorbereich auf der Vorderseite, eine Ausnehmung oder ein Hohlraum hinter der Sensormembran und die elektrische Kontaktierung auf der Rückseite angeordnet ist, sowie Verfahren zur Herstellung.
DE102005053861A 2005-11-11 2005-11-11 Sensoranordnung und Verfahren zur Herstellung einer Sensoranordnung Withdrawn DE102005053861A1 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
DE102005053861A DE102005053861A1 (de) 2005-11-11 2005-11-11 Sensoranordnung und Verfahren zur Herstellung einer Sensoranordnung
US11/592,904 US7493819B2 (en) 2005-11-11 2006-11-02 Micromechanical pressure sensor system
JP2006304169A JP2007132942A (ja) 2005-11-11 2006-11-09 センサ装置およびセンサ装置を製作するための方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102005053861A DE102005053861A1 (de) 2005-11-11 2005-11-11 Sensoranordnung und Verfahren zur Herstellung einer Sensoranordnung

Publications (1)

Publication Number Publication Date
DE102005053861A1 true DE102005053861A1 (de) 2007-05-16

Family

ID=37982620

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102005053861A Withdrawn DE102005053861A1 (de) 2005-11-11 2005-11-11 Sensoranordnung und Verfahren zur Herstellung einer Sensoranordnung

Country Status (3)

Country Link
US (1) US7493819B2 (de)
JP (1) JP2007132942A (de)
DE (1) DE102005053861A1 (de)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL2000566C2 (nl) * 2007-03-30 2008-10-02 Elmos Advanced Packaging B V Sensorelement en sensorsamenstel met omhulling.
WO2008148654A2 (de) * 2007-06-06 2008-12-11 Robert Bosch Gmbh Elektrische kontaktierung für ein mikromechanisches bauelement
DE102010043982A1 (de) * 2010-11-16 2011-12-15 Robert Bosch Gmbh Sensoranordnung
US8671752B2 (en) 2010-01-27 2014-03-18 Robert Bosch Gmbh Sensor system
DE102013226775A1 (de) * 2013-12-19 2015-06-25 Vega Grieshaber Kg Messzelle
CN111620295A (zh) * 2020-05-27 2020-09-04 南京信息工程大学 一种微压探测压力传感器及其测量装置
DE102019208867A1 (de) * 2019-06-18 2020-12-24 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Vorrichtung zum Erfassen eines Drucks eines Fluids
DE102020214229A1 (de) 2020-11-12 2022-05-12 Robert Bosch Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung eines mikromechanischen Bauteils und mikromechanisches Bauteil

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US7304412B2 (en) * 2005-01-31 2007-12-04 Avago Technologes Wireless Ip (Singapore) Pte Ltd Apparatus embodying doped substrate portion
EP2015046A1 (de) * 2007-06-06 2009-01-14 Infineon Technologies SensoNor AS Vakuumsensor
JP5331546B2 (ja) * 2008-04-24 2013-10-30 株式会社フジクラ 圧力センサモジュール及び電子部品
JP5291979B2 (ja) * 2008-04-24 2013-09-18 株式会社フジクラ 圧力センサ及びその製造方法と、該圧力センサを備えた電子部品
US8351635B2 (en) * 2008-11-05 2013-01-08 Fortemedia, Inc. Silicon-based microphone structure with electromagnetic interference shielding means
FR2950691B1 (fr) * 2009-09-30 2012-05-04 Michelin Soc Tech Organe de mesure de pression etanche
US8704538B2 (en) * 2010-07-01 2014-04-22 Mks Instruments, Inc. Capacitance sensors
FR2977885A1 (fr) 2011-07-12 2013-01-18 Commissariat Energie Atomique Procede de realisation d'une structure a electrode enterree par report direct et structure ainsi obtenue
FR2977884B1 (fr) * 2011-07-12 2016-01-29 Commissariat Energie Atomique Procede de realisation d'une structure a membrane suspendue et a electrode enterree
JP5935352B2 (ja) * 2012-01-27 2016-06-15 富士電機株式会社 Ｓｏｎ構造を有する物理量センサの製造方法。
CN104956194B (zh) * 2013-05-24 2017-03-08 日立金属株式会社 压力传感器、使用该压力传感器的质量流量计以及质量流量控制器
US10023461B2 (en) * 2014-10-31 2018-07-17 Stmicroelectronics S.R.L. Microintegrated encapsulated MEMS sensor with mechanical decoupling and manufacturing process thereof
US11796411B2 (en) * 2019-03-25 2023-10-24 Gettop Acoustic Co., Ltd. Sensor with a flexible plate
JP7406947B2 (ja) * 2019-09-25 2023-12-28 愛知時計電機株式会社 センサチップ
JP7343343B2 (ja) * 2019-09-25 2023-09-12 愛知時計電機株式会社 センサチップ
US11692895B2 (en) 2021-03-30 2023-07-04 Rosemount Aerospace Inc. Differential pressure sensor

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US4222277A (en) * 1979-08-13 1980-09-16 Kulite Semiconductor Products, Inc. Media compatible pressure transducer
US4774843A (en) * 1987-08-14 1988-10-04 Gulton Industries, Inc. Strain gage
US5511428A (en) * 1994-06-10 1996-04-30 Massachusetts Institute Of Technology Backside contact of sensor microstructures
JPH09116173A (ja) * 1995-10-23 1997-05-02 Fujikura Ltd 半導体センサおよびその製造方法
JP3136087B2 (ja) * 1995-10-26 2001-02-19 松下電工株式会社 半導体圧力センサ
US6388279B1 (en) * 1997-06-11 2002-05-14 Denso Corporation Semiconductor substrate manufacturing method, semiconductor pressure sensor and manufacturing method thereof
US6550337B1 (en) * 2000-01-19 2003-04-22 Measurement Specialties, Inc. Isolation technique for pressure sensing structure
DE10032579B4 (de) 2000-07-05 2020-07-02 Robert Bosch Gmbh Verfahren zur Herstellung eines Halbleiterbauelements sowie ein nach dem Verfahren hergestelltes Halbleiterbauelement
JP2003214967A (ja) * 2002-01-22 2003-07-30 Hitachi Unisia Automotive Ltd ブリッジ回路型検出素子
DE10323559A1 (de) 2003-05-26 2004-12-30 Robert Bosch Gmbh Mikromechanische Vorrichtung, Drucksensor und Verfahren
US7812416B2 (en) * 2006-05-22 2010-10-12 Cardiomems, Inc. Methods and apparatus having an integrated circuit attached to fused silica

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL2000566C2 (nl) * 2007-03-30 2008-10-02 Elmos Advanced Packaging B V Sensorelement en sensorsamenstel met omhulling.
US7685881B2 (en) 2007-03-30 2010-03-30 Elmos Advanced Packaging B.V. Sensor element and sensor assembly provided with a casing
WO2008148654A2 (de) * 2007-06-06 2008-12-11 Robert Bosch Gmbh Elektrische kontaktierung für ein mikromechanisches bauelement
WO2008148654A3 (de) * 2007-06-06 2009-06-11 Bosch Gmbh Robert Elektrische kontaktierung für ein mikromechanisches bauelement
US8076739B2 (en) 2007-06-06 2011-12-13 Robert Bosch Gmbh Micromechanical component and method for producing a micromechanical component
US8671752B2 (en) 2010-01-27 2014-03-18 Robert Bosch Gmbh Sensor system
DE102010043982A1 (de) * 2010-11-16 2011-12-15 Robert Bosch Gmbh Sensoranordnung
DE102013226775A1 (de) * 2013-12-19 2015-06-25 Vega Grieshaber Kg Messzelle
US9606015B2 (en) 2013-12-19 2017-03-28 Vega Grieshaber Kg Measurement cell
DE102019208867A1 (de) * 2019-06-18 2020-12-24 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Vorrichtung zum Erfassen eines Drucks eines Fluids
CN111620295A (zh) * 2020-05-27 2020-09-04 南京信息工程大学 一种微压探测压力传感器及其测量装置
DE102020214229A1 (de) 2020-11-12 2022-05-12 Robert Bosch Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung eines mikromechanischen Bauteils und mikromechanisches Bauteil

Also Published As

Publication number Publication date
US20070113661A1 (en) 2007-05-24
JP2007132942A (ja) 2007-05-31
US7493819B2 (en) 2009-02-24

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R012 Request for examination validly filed

Effective date: 20120828

R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee