JP2007132942A - センサ装置およびセンサ装置を製作するための方法 - Google Patents
センサ装置およびセンサ装置を製作するための方法 Download PDFInfo
- Publication number
- JP2007132942A JP2007132942A JP2006304169A JP2006304169A JP2007132942A JP 2007132942 A JP2007132942 A JP 2007132942A JP 2006304169 A JP2006304169 A JP 2006304169A JP 2006304169 A JP2006304169 A JP 2006304169A JP 2007132942 A JP2007132942 A JP 2007132942A
- Authority
- JP
- Japan
- Prior art keywords
- sensor
- sensor device
- substrate
- back side
- diaphragm
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 26
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 239000000758 substrate Substances 0.000 claims abstract description 63
- 238000005530 etching Methods 0.000 claims description 24
- 229910052751 metal Inorganic materials 0.000 claims description 19
- 239000002184 metal Substances 0.000 claims description 19
- 239000004020 conductor Substances 0.000 claims description 17
- 238000000926 separation method Methods 0.000 claims description 10
- 238000004544 sputter deposition Methods 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 238000000151 deposition Methods 0.000 claims description 3
- 238000006073 displacement reaction Methods 0.000 claims description 3
- 238000001704 evaporation Methods 0.000 claims description 3
- 230000008020 evaporation Effects 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 2
- 229910052804 chromium Inorganic materials 0.000 claims description 2
- 239000011651 chromium Substances 0.000 claims description 2
- 238000004090 dissolution Methods 0.000 claims description 2
- 238000011156 evaluation Methods 0.000 claims description 2
- 239000010936 titanium Substances 0.000 claims description 2
- 229910052719 titanium Inorganic materials 0.000 claims description 2
- 239000000463 material Substances 0.000 claims 2
- 238000002161 passivation Methods 0.000 abstract description 12
- 238000005459 micromachining Methods 0.000 abstract description 8
- 239000010410 layer Substances 0.000 description 58
- 238000006243 chemical reaction Methods 0.000 description 7
- 239000011521 glass Substances 0.000 description 6
- 239000011241 protective layer Substances 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 5
- RZVAJINKPMORJF-UHFFFAOYSA-N Acetaminophen Chemical compound CC(=O)NC1=CC=C(O)C=C1 RZVAJINKPMORJF-UHFFFAOYSA-N 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 238000001465 metallisation Methods 0.000 description 4
- 238000000206 photolithography Methods 0.000 description 4
- 239000005297 pyrex Substances 0.000 description 4
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 4
- 238000005219 brazing Methods 0.000 description 3
- 230000003628 erosive effect Effects 0.000 description 3
- 229910021426 porous silicon Inorganic materials 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000012876 topography Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0006—Interconnects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/0061—Electrical connection means
- G01L19/0069—Electrical connection means from the sensor to its support
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/145—Housings with stress relieving means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/147—Details about the mounting of the sensor to support or covering means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
- G01L9/0045—Diaphragm associated with a buried cavity
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- Child & Adolescent Psychology (AREA)
- Pressure Sensors (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
【解決手段】センサ領域と裏側との間の電気的なコンタクティング部を、少なくとも1つのコンタクトホールを裏側から基板に加工することにより、センサ領域が、裏側に電気的にコンタクティングされているようにした。
【選択図】図3
Description
Claims (10)
- センサ装置(1)、特にマイクロマシニング型の圧力センサ(1)であって、表側(2)と裏側(3)とを備えた基板(4)が設けられており、表側(2)が、媒体に面しており、裏側(3)が、基板(4)の反対側に配置されており、少なくとも1つのセンサ領域(7)を備えたセンサダイヤフラム(5)が、表側(2)に配置されており、切欠き(6)または中空室(6)が、センサダイヤフラム(5)の、表側(2)と反対の側に配置されている形式のものにおいて、センサ領域(7)が、裏側(3)に電気的にコンタクティングされていることを特徴とする、センサ装置。
- 当該センサ装置(1)が、少なくとも1つのコンタクトホール(8)を有しており、該コンタクトホール(8)が、裏側(3)から基板(4)内に延びていて、有利には表側(2)にまで延びているかまたは表側(2)に配置された層(20,21,23,24)にまで延びている、請求項1記載のセンサ装置。
- 裏側(3)の少なくとも一部および/またはコンタクトホール(8)が、導電性の層(9)、有利には、たとえばアルミニウムおよび/またはクロムおよび/またはチタンおよび/または金から成る構造化された金属層を備えている、請求項1または2記載のセンサ装置。
- センサ領域(7)と裏側(3)との間の電気的なコンタクティング部が、金属製の導体(9,23)および/またはドーピングされた領域(22,24,25,26)から形成されている、請求項1から3までのいずれか1項記載のセンサ装置。
- 当該センサ装置が、ほぼセンサダイヤフラム(5)を取り囲むように配置された応力分離のための手段(10)、特に、有利には表側に加工された全周にわたって延びる溝または、有利にはセンサダイヤフラム(5)を基板(4)の内部で環状に取り囲む分離ダイヤフラムを有している、請求項1から4までのいずれか1項記載のセンサ装置。
- コンタクトホール(8)および/または全周にわたって延びる溝(10)が、エッチング法、有利には異方性エッチングまたはトレンチエッチング法によって製作されている、請求項1から5までのいずれか1項記載のセンサ装置。
- 裏側(3)が、少なくとも1つの電気的なコンタクトまたはコンタクト領域(9)を有しており、該コンタクトまたは該コンタクト領域(9)が、特にボンディングワイヤ(11)によって導電的にプリント配線板(12)に接続されているかまたは特に直接、有利にはフリップチップ接続によって導電的にプリント配線板(12)に接続されている、請求項1から6までのいずれか1項記載のセンサ装置。
- センサダイヤフラム(5)の変位が、ピエゾ抵抗式にまたは容量式にセンシング可能であり、有利には評価回路によって評価可能である、請求項1から7までのいずれか1項記載のセンサ装置。
- 請求項1から8までのいずれか1項記載のセンサ装置を製作するための方法において、センサ領域(7)と裏側(3)との間の電気的なコンタクティング部を、まず、少なくとも1つのコンタクトホール(8)を裏側(3)から基板(4)に加工、有利には異方性エッチングまたはトレンチエッチングし、その後、裏側(3)および/またはコンタクトホール(8)に少なくとも部分的に金属層(9)を、有利にはフォトリソグラフィプロセスおよび/またはスパッタリングおよび/または蒸着によって設け、電気的なコンタクトを金属製の導体(9,23)によってかつ/または基板の領域(22,24、25,26)のドーピングによって製作することにより形成することを特徴とする、センサ装置を製作するための方法。
- 基板(4)の一部領域を、有利には50%よりも多い多孔度、有利には80%よりも多い多孔度を備えて多孔質にエッチングし、中空室(6)を、多孔質にエッチングされた部分領域における半導体材料の一部を中空室(6)を取り囲むように堆積させることによって形成するかもしくは中空室(6)を、多孔質にエッチングされた部分領域における半導体材料の一部の溶解によって形成することにより、センサダイヤフラム(5)および/または分離ダイヤフラム(10)を基板(4)に形成する、請求項9記載の方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102005053861A DE102005053861A1 (de) | 2005-11-11 | 2005-11-11 | Sensoranordnung und Verfahren zur Herstellung einer Sensoranordnung |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2007132942A true JP2007132942A (ja) | 2007-05-31 |
Family
ID=37982620
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006304169A Pending JP2007132942A (ja) | 2005-11-11 | 2006-11-09 | センサ装置およびセンサ装置を製作するための方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US7493819B2 (ja) |
JP (1) | JP2007132942A (ja) |
DE (1) | DE102005053861A1 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010531435A (ja) * | 2007-06-06 | 2010-09-24 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | マイクロメカニカル素子およびマイクロメカニカル素子の製造方法 |
JP2013156061A (ja) * | 2012-01-27 | 2013-08-15 | Fuji Electric Co Ltd | Son構造を有する物理量センサおよびその製造方法。 |
JP2021051003A (ja) * | 2019-09-25 | 2021-04-01 | 愛知時計電機株式会社 | センサチップ |
JP2021051002A (ja) * | 2019-09-25 | 2021-04-01 | 愛知時計電機株式会社 | センサチップ |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7304412B2 (en) * | 2005-01-31 | 2007-12-04 | Avago Technologes Wireless Ip (Singapore) Pte Ltd | Apparatus embodying doped substrate portion |
NL2000566C2 (nl) | 2007-03-30 | 2008-10-02 | Elmos Advanced Packaging B V | Sensorelement en sensorsamenstel met omhulling. |
EP2015046A1 (en) * | 2007-06-06 | 2009-01-14 | Infineon Technologies SensoNor AS | Vacuum Sensor |
JP5331546B2 (ja) * | 2008-04-24 | 2013-10-30 | 株式会社フジクラ | 圧力センサモジュール及び電子部品 |
JP5291979B2 (ja) * | 2008-04-24 | 2013-09-18 | 株式会社フジクラ | 圧力センサ及びその製造方法と、該圧力センサを備えた電子部品 |
US8351635B2 (en) * | 2008-11-05 | 2013-01-08 | Fortemedia, Inc. | Silicon-based microphone structure with electromagnetic interference shielding means |
FR2950691B1 (fr) * | 2009-09-30 | 2012-05-04 | Michelin Soc Tech | Organe de mesure de pression etanche |
DE102010042438B4 (de) | 2010-01-27 | 2013-09-26 | Robert Bosch Gmbh | Sensoranordnung |
US8704538B2 (en) * | 2010-07-01 | 2014-04-22 | Mks Instruments, Inc. | Capacitance sensors |
DE102010043982A1 (de) * | 2010-11-16 | 2011-12-15 | Robert Bosch Gmbh | Sensoranordnung |
FR2977884B1 (fr) * | 2011-07-12 | 2016-01-29 | Commissariat Energie Atomique | Procede de realisation d'une structure a membrane suspendue et a electrode enterree |
FR2977885A1 (fr) | 2011-07-12 | 2013-01-18 | Commissariat Energie Atomique | Procede de realisation d'une structure a electrode enterree par report direct et structure ainsi obtenue |
US9891124B2 (en) * | 2013-05-24 | 2018-02-13 | Hitachi Metals, Ltd. | Pressure sensor, and mass flow meter, and mass flow controller using same |
DE102013226775A1 (de) * | 2013-12-19 | 2015-06-25 | Vega Grieshaber Kg | Messzelle |
US10023461B2 (en) * | 2014-10-31 | 2018-07-17 | Stmicroelectronics S.R.L. | Microintegrated encapsulated MEMS sensor with mechanical decoupling and manufacturing process thereof |
WO2020191576A1 (zh) * | 2019-03-25 | 2020-10-01 | 共达电声股份有限公司 | 一种传感器 |
DE102019208867A1 (de) * | 2019-06-18 | 2020-12-24 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Vorrichtung zum Erfassen eines Drucks eines Fluids |
CN111620295B (zh) * | 2020-05-27 | 2023-06-27 | 南京信息工程大学 | 一种微压探测压力传感器及其测量装置 |
DE102020214229A1 (de) | 2020-11-12 | 2022-05-12 | Robert Bosch Gesellschaft mit beschränkter Haftung | Verfahren zur Herstellung eines mikromechanischen Bauteils und mikromechanisches Bauteil |
US11692895B2 (en) | 2021-03-30 | 2023-07-04 | Rosemount Aerospace Inc. | Differential pressure sensor |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09116173A (ja) * | 1995-10-23 | 1997-05-02 | Fujikura Ltd | 半導体センサおよびその製造方法 |
JPH09126920A (ja) * | 1995-10-26 | 1997-05-16 | Matsushita Electric Works Ltd | 半導体圧力センサ |
JP2003214967A (ja) * | 2002-01-22 | 2003-07-30 | Hitachi Unisia Automotive Ltd | ブリッジ回路型検出素子 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4222277A (en) * | 1979-08-13 | 1980-09-16 | Kulite Semiconductor Products, Inc. | Media compatible pressure transducer |
US4774843A (en) * | 1987-08-14 | 1988-10-04 | Gulton Industries, Inc. | Strain gage |
US5511428A (en) * | 1994-06-10 | 1996-04-30 | Massachusetts Institute Of Technology | Backside contact of sensor microstructures |
US6388279B1 (en) * | 1997-06-11 | 2002-05-14 | Denso Corporation | Semiconductor substrate manufacturing method, semiconductor pressure sensor and manufacturing method thereof |
US6550337B1 (en) * | 2000-01-19 | 2003-04-22 | Measurement Specialties, Inc. | Isolation technique for pressure sensing structure |
DE10032579B4 (de) | 2000-07-05 | 2020-07-02 | Robert Bosch Gmbh | Verfahren zur Herstellung eines Halbleiterbauelements sowie ein nach dem Verfahren hergestelltes Halbleiterbauelement |
DE10323559A1 (de) | 2003-05-26 | 2004-12-30 | Robert Bosch Gmbh | Mikromechanische Vorrichtung, Drucksensor und Verfahren |
US7812416B2 (en) * | 2006-05-22 | 2010-10-12 | Cardiomems, Inc. | Methods and apparatus having an integrated circuit attached to fused silica |
-
2005
- 2005-11-11 DE DE102005053861A patent/DE102005053861A1/de not_active Withdrawn
-
2006
- 2006-11-02 US US11/592,904 patent/US7493819B2/en active Active
- 2006-11-09 JP JP2006304169A patent/JP2007132942A/ja active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09116173A (ja) * | 1995-10-23 | 1997-05-02 | Fujikura Ltd | 半導体センサおよびその製造方法 |
JPH09126920A (ja) * | 1995-10-26 | 1997-05-16 | Matsushita Electric Works Ltd | 半導体圧力センサ |
JP2003214967A (ja) * | 2002-01-22 | 2003-07-30 | Hitachi Unisia Automotive Ltd | ブリッジ回路型検出素子 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010531435A (ja) * | 2007-06-06 | 2010-09-24 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | マイクロメカニカル素子およびマイクロメカニカル素子の製造方法 |
JP2013156061A (ja) * | 2012-01-27 | 2013-08-15 | Fuji Electric Co Ltd | Son構造を有する物理量センサおよびその製造方法。 |
JP2021051003A (ja) * | 2019-09-25 | 2021-04-01 | 愛知時計電機株式会社 | センサチップ |
JP2021051002A (ja) * | 2019-09-25 | 2021-04-01 | 愛知時計電機株式会社 | センサチップ |
JP7343343B2 (ja) | 2019-09-25 | 2023-09-12 | 愛知時計電機株式会社 | センサチップ |
JP7406947B2 (ja) | 2019-09-25 | 2023-12-28 | 愛知時計電機株式会社 | センサチップ |
Also Published As
Publication number | Publication date |
---|---|
US7493819B2 (en) | 2009-02-24 |
DE102005053861A1 (de) | 2007-05-16 |
US20070113661A1 (en) | 2007-05-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2007132942A (ja) | センサ装置およびセンサ装置を製作するための方法 | |
JP4847960B2 (ja) | 半導体チップを搭載するための方法および相応する半導体チップ装置 | |
US6109113A (en) | Silicon micromachined capacitive pressure sensor and method of manufacture | |
US5929497A (en) | Batch processed multi-lead vacuum packaging for integrated sensors and circuits | |
CN101988859B (zh) | 具有高精确度和高灵敏度的低压传感器装置 | |
JP5568803B2 (ja) | 高温用媒体適合電気絶縁圧力センサ | |
EP1860417B1 (en) | A pressure sensor having a chamber and a method for fabricating the same | |
US8076739B2 (en) | Micromechanical component and method for producing a micromechanical component | |
JP2005249795A (ja) | 半導体チップを実装する方法および相応の半導体チップ配置構造 | |
US7555956B2 (en) | Micromechanical device having two sensor patterns | |
US20070052046A1 (en) | Pressure sensors and methods of making the same | |
US20050186703A1 (en) | Method for packaging semiconductor chips and corresponding semiconductor chip system | |
US20050284228A1 (en) | Pressure sensor | |
JP2015515609A (ja) | カテーテルダイおよびその製造方法 | |
US6688181B1 (en) | Membrane pressure sensor comprising silicon carbide and method for making same | |
EP1969334A2 (en) | Pressure sensor with silicon frit bonded cap | |
JP6130405B2 (ja) | 微小機械測定素子 | |
KR102588550B1 (ko) | 미소 기계식 압력 센서 장치 및 상응하는 제조 방법 | |
TW201813918A (zh) | 用於製造微機械壓力感測器的方法 | |
TW201336774A (zh) | 微機械測量元件及用以製造微機械測量元件之方法 | |
US20110073969A1 (en) | Sensor system and method for manufacturing same | |
US20120073379A1 (en) | Sensor system for detecting high pressures | |
JP4507890B2 (ja) | 圧力センサの製造方法 | |
US6207470B1 (en) | Method for manufacturing a pressure-measuring device equipped with a resonating element | |
CN110402233A (zh) | 用于制造用于微机械压力传感器的mems装置的方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20091109 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20120307 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20120307 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20120607 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20120612 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120705 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20120801 |