FR2844397B1 - Unite a faible dilatation, procede de fabrication de cette unite et semi-conducteur dote de cette unite - Google Patents

Unite a faible dilatation, procede de fabrication de cette unite et semi-conducteur dote de cette unite

Info

Publication number
FR2844397B1
FR2844397B1 FR0310539A FR0310539A FR2844397B1 FR 2844397 B1 FR2844397 B1 FR 2844397B1 FR 0310539 A FR0310539 A FR 0310539A FR 0310539 A FR0310539 A FR 0310539A FR 2844397 B1 FR2844397 B1 FR 2844397B1
Authority
FR
France
Prior art keywords
unit
manufacturing
method therefor
semiconductor provided
low dilation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0310539A
Other languages
English (en)
Other versions
FR2844397A1 (fr
Inventor
Takashi Yoshida
Kyoichi Kinoshita
Katsufumi Tanaka
Tomohei Sugiyama
Hidehiro Kudo
Eiji Kono
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyota Industries Corp
Original Assignee
Toyota Industries Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyota Industries Corp filed Critical Toyota Industries Corp
Publication of FR2844397A1 publication Critical patent/FR2844397A1/fr
Application granted granted Critical
Publication of FR2844397B1 publication Critical patent/FR2844397B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12458—All metal or with adjacent metals having composition, density, or hardness gradient
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12528—Semiconductor component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12937—Co- or Ni-base component next to Fe-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12951—Fe-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12951—Fe-base component
    • Y10T428/12958—Next to Fe-base component
FR0310539A 2002-09-06 2003-09-05 Unite a faible dilatation, procede de fabrication de cette unite et semi-conducteur dote de cette unite Expired - Fee Related FR2844397B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002261248A JP2004103700A (ja) 2002-09-06 2002-09-06 低膨張部材及びその製造方法並びに低膨張部材を用いた半導体装置

Publications (2)

Publication Number Publication Date
FR2844397A1 FR2844397A1 (fr) 2004-03-12
FR2844397B1 true FR2844397B1 (fr) 2006-01-13

Family

ID=31884722

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0310539A Expired - Fee Related FR2844397B1 (fr) 2002-09-06 2003-09-05 Unite a faible dilatation, procede de fabrication de cette unite et semi-conducteur dote de cette unite

Country Status (4)

Country Link
US (1) US7087316B2 (fr)
JP (1) JP2004103700A (fr)
DE (1) DE10340837A1 (fr)
FR (1) FR2844397B1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5749908B2 (ja) * 2010-09-17 2015-07-15 株式会社神戸製鋼所 熱伝導性と放熱性に優れた電子機器用樹脂被覆鋼板
DE102013102541A1 (de) * 2013-03-13 2014-09-18 Schweizer Electronic Ag Elektronisches Bauteil, Verfahren zu dessen Herstellung und Leiterplatte mit elektronischem Bauteil
DE102014213490C5 (de) * 2014-07-10 2020-06-18 Continental Automotive Gmbh Kühlvorrichtung, Verfahren zur Herstellung einer Kühlvorrichtung und Leistungsschaltung
DE102015216887C5 (de) 2015-09-03 2025-11-27 Schaeffler Technologies AG & Co. KG Kühlvorrichtung, Verfahren zur Herstellung einer Kühlvorrichtung und Leistungsschaltung

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0759745B2 (ja) 1986-07-15 1995-06-28 日新製鋼株式会社 耐熱性に優れたチタンめつき鋼板
JPH0610335B2 (ja) 1986-07-15 1994-02-09 日新製鋼株式会社 耐熱性に優れたアルミニウムめつき鋼板
US5590524A (en) * 1992-05-14 1997-01-07 Soundwich, Inc. Damped heat shield
JP2861725B2 (ja) * 1993-04-07 1999-02-24 住友金属鉱山株式会社 半導体装置及びそのリードフレーム
JPH09312361A (ja) * 1996-05-22 1997-12-02 Hitachi Metals Ltd 電子部品用複合材料およびその製造方法
US5844310A (en) * 1996-08-09 1998-12-01 Hitachi Metals, Ltd. Heat spreader semiconductor device with heat spreader and method for producing same
JP3982895B2 (ja) 1997-04-09 2007-09-26 三井化学株式会社 金属ベース半導体回路基板
US6129993A (en) * 1998-02-13 2000-10-10 Hitachi Metals, Ltd. Heat spreader and method of making the same
US6114048A (en) * 1998-09-04 2000-09-05 Brush Wellman, Inc. Functionally graded metal substrates and process for making same
US6154364A (en) * 1998-11-19 2000-11-28 Delco Electronics Corp. Circuit board assembly with IC device mounted thereto
JP3040979B1 (ja) * 1998-12-02 2000-05-15 日本特殊陶業株式会社 配線基板及び補強板
JP3854464B2 (ja) * 2001-01-09 2006-12-06 新日本製鐵株式会社 アルカリマンガン電池正極缶用Ｎｉメッキ鋼板
JP2003100968A (ja) * 2001-09-21 2003-04-04 Toyota Industries Corp 放熱材及びその製造方法

Also Published As

Publication number Publication date
FR2844397A1 (fr) 2004-03-12
US7087316B2 (en) 2006-08-08
JP2004103700A (ja) 2004-04-02
DE10340837A1 (de) 2004-05-13
US20050031889A1 (en) 2005-02-10

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20120531