FR2792411B1 - Capteur de deformation a semiconducteurs - Google Patents

Capteur de deformation a semiconducteurs

Info

Publication number
FR2792411B1
FR2792411B1 FR0004623A FR0004623A FR2792411B1 FR 2792411 B1 FR2792411 B1 FR 2792411B1 FR 0004623 A FR0004623 A FR 0004623A FR 0004623 A FR0004623 A FR 0004623A FR 2792411 B1 FR2792411 B1 FR 2792411B1
Authority
FR
France
Prior art keywords
deformation sensor
semiconductor deformation
semiconductor
sensor
deformation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0004623A
Other languages
English (en)
Other versions
FR2792411A1 (fr
Inventor
Seiichiro Ishio
Yasutoshi Suzuki
Inao Toyoda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Publication of FR2792411A1 publication Critical patent/FR2792411A1/fr
Application granted granted Critical
Publication of FR2792411B1 publication Critical patent/FR2792411B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/147—Details about the mounting of the sensor to support or covering means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Pressure Sensors (AREA)
  • Measuring Fluid Pressure (AREA)
FR0004623A 1999-04-14 2000-04-11 Capteur de deformation a semiconducteurs Expired - Fee Related FR2792411B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP10691399 1999-04-14
JP2000052163A JP2000356561A (ja) 1999-04-14 2000-02-23 半導体歪みセンサ

Publications (2)

Publication Number Publication Date
FR2792411A1 FR2792411A1 (fr) 2000-10-20
FR2792411B1 true FR2792411B1 (fr) 2004-05-28

Family

ID=26447013

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0004623A Expired - Fee Related FR2792411B1 (fr) 1999-04-14 2000-04-11 Capteur de deformation a semiconducteurs

Country Status (4)

Country Link
US (1) US6521966B1 (fr)
JP (1) JP2000356561A (fr)
DE (1) DE10018404A1 (fr)
FR (1) FR2792411B1 (fr)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002310827A (ja) * 2001-04-11 2002-10-23 Denso Corp 圧力センサ
DE10134586A1 (de) * 2001-07-17 2003-02-06 Siemens Ag Sensoreinrichtung zum Erfassen einer Dehnungsbeanspruchung
JP2004340891A (ja) * 2003-05-19 2004-12-02 Mitsubishi Electric Corp 圧力センサ装置
DE10331967A1 (de) * 2003-07-15 2005-02-03 Robert Bosch Gmbh Sensoreinrichtung
US20050123783A1 (en) * 2003-07-31 2005-06-09 Gregory Otto J. Composite used for thermal spray instrumentation and method for making the same
US20050115329A1 (en) * 2003-10-23 2005-06-02 Gregory Otto J. High temperature strain gages
JP4656851B2 (ja) * 2004-03-18 2011-03-23 株式会社ジェイテクト トルク検出装置
WO2005112140A2 (fr) * 2004-04-12 2005-11-24 The Board Of Governors For Higher Education, State Of Rhode Island And Providence Plantations Thermocouples ceramiques en couche mince
DE102004058815A1 (de) * 2004-12-07 2006-06-08 Robert Bosch Gmbh Chipmodul und Verfahren zu dessen Herstellung
JP4683618B2 (ja) * 2005-02-10 2011-05-18 キヤノンアネルバ株式会社 隔膜型圧力センサ及びその製造方法
KR100708989B1 (ko) * 2005-08-02 2007-04-18 미츠비시덴키 가부시키가이샤 반도체 압력 센서
JP4249193B2 (ja) * 2006-02-20 2009-04-02 三菱電機株式会社 半導体圧力センサ装置
JP4893123B2 (ja) * 2006-06-23 2012-03-07 株式会社デンソー 半導体式圧力センサおよびその製造方法
JP2008070230A (ja) * 2006-09-14 2008-03-27 Hitachi Ltd 物理量検出装置
JP4699418B2 (ja) * 2007-04-19 2011-06-08 株式会社デンソー 圧力センサ
US8191426B2 (en) * 2007-06-05 2012-06-05 Board Of Governors For Higher Education, State Of Rhode Island And Providence Plantations Low TCR nanocomposite strain gages
JP4952428B2 (ja) * 2007-08-01 2012-06-13 株式会社デンソー センサ装置
JP5010395B2 (ja) * 2007-08-24 2012-08-29 パナソニック株式会社 圧力センサ
EP2090873B1 (fr) * 2008-02-14 2011-06-01 Elmos Advanced Packaging B.V. Conditionnement de circuit intégré
CN102470805B (zh) 2009-07-14 2015-02-04 三菱电机株式会社 车辆状态检测装置及制造方法
DE102009055717A1 (de) * 2009-11-26 2011-06-01 Continental Automotive Gmbh Sensormodul und Herstellungsverfahren eines Sensormoduls
JP5665197B2 (ja) * 2012-03-12 2015-02-04 パナソニックＩｐマネジメント株式会社 圧力センサ
DE102012215285A1 (de) * 2012-08-29 2014-03-06 Osram Opto Semiconductors Gmbh Gehäuse, elektronische Baugruppe, Verfahren zum Herstellen eines Gehäuses und Verfahren zum Herstellen einer elektronischen Baugruppe
FR3000205B1 (fr) * 2012-12-21 2015-07-31 Michelin & Cie Capteur de pression perfectionne a boitier etanche
JP6435468B2 (ja) * 2014-08-21 2018-12-12 株式会社テージーケー 圧力センサモジュール及び圧力センサモジュールの製造方法
ITUB20154017A1 (it) * 2015-09-30 2017-03-30 St Microelectronics Srl Dispositivo incapsulato di materiale semiconduttore a ridotta sensibilita' nei confronti di stress termo-meccanici
JP6315025B2 (ja) * 2016-04-26 2018-04-25 株式会社デンソー 物理量センサおよびその製造方法
JP2021071305A (ja) * 2019-10-29 2021-05-06 ミネベアミツミ株式会社 力覚センサ装置
JP7512785B2 (ja) 2020-09-15 2024-07-09 株式会社デンソー 電子装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04258176A (ja) * 1991-02-12 1992-09-14 Mitsubishi Electric Corp 半導体圧力センサ
JPH05172674A (ja) 1991-11-26 1993-07-09 Hitachi Ltd 検出装置
US5333505A (en) * 1992-01-13 1994-08-02 Mitsubishi Denki Kabushiki Kaisha Semiconductor pressure sensor for use at high temperature and pressure and method of manufacturing same
WO1996026424A1 (fr) * 1995-02-24 1996-08-29 Lucas Novasensor Capteur de pression a transducteur monte sur une base en metal
JPH0961271A (ja) 1995-08-29 1997-03-07 Mitsubishi Electric Corp 半導体式センサ及びその製造方法
US5948991A (en) * 1996-12-09 1999-09-07 Denso Corporation Semiconductor physical quantity sensor device having semiconductor sensor chip integrated with semiconductor circuit chip
JPH10197374A (ja) 1997-01-14 1998-07-31 Mitsubishi Electric Corp 半導体センサ
JPH1123613A (ja) * 1997-07-04 1999-01-29 Tokai Rika Co Ltd ダイアフラム式センサチップを利用したセンサ
JPH1130559A (ja) * 1997-07-10 1999-02-02 Fuji Koki Corp 圧力センサ
US5986316A (en) 1997-11-26 1999-11-16 Denso Corporation Semiconductor type physical quantity sensor

Also Published As

Publication number Publication date
US6521966B1 (en) 2003-02-18
FR2792411A1 (fr) 2000-10-20
DE10018404A1 (de) 2000-10-19
JP2000356561A (ja) 2000-12-26

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20151231