FR2783971B1 - Circuit semi-conducteur comprenant des motifs en surface et procede de reglage d'un outil par rapport a cette surface - Google Patents

Circuit semi-conducteur comprenant des motifs en surface et procede de reglage d'un outil par rapport a cette surface

Info

Publication number
FR2783971B1
FR2783971B1 FR9812249A FR9812249A FR2783971B1 FR 2783971 B1 FR2783971 B1 FR 2783971B1 FR 9812249 A FR9812249 A FR 9812249A FR 9812249 A FR9812249 A FR 9812249A FR 2783971 B1 FR2783971 B1 FR 2783971B1
Authority
FR
France
Prior art keywords
tool
adjusting
respect
semiconductor circuit
patterns
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9812249A
Other languages
English (en)
Other versions
FR2783971A1 (fr
Inventor
Michel Vallet
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics SA
Original Assignee
STMicroelectronics SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STMicroelectronics SA filed Critical STMicroelectronics SA
Priority to FR9812249A priority Critical patent/FR2783971B1/fr
Priority to US09/407,507 priority patent/US6539276B1/en
Publication of FR2783971A1 publication Critical patent/FR2783971A1/fr
Application granted granted Critical
Publication of FR2783971B1 publication Critical patent/FR2783971B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54406—Marks applied to semiconductor devices or parts comprising alphanumeric information
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/5442—Marks applied to semiconductor devices or parts comprising non digital, non alphanumeric information, e.g. symbols
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54453—Marks applied to semiconductor devices or parts for use prior to dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
FR9812249A 1998-09-30 1998-09-30 Circuit semi-conducteur comprenant des motifs en surface et procede de reglage d'un outil par rapport a cette surface Expired - Fee Related FR2783971B1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR9812249A FR2783971B1 (fr) 1998-09-30 1998-09-30 Circuit semi-conducteur comprenant des motifs en surface et procede de reglage d'un outil par rapport a cette surface
US09/407,507 US6539276B1 (en) 1998-09-30 1999-09-28 Semiconductor circuit having surface features and method of adjusting a tool with respect to this surface

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9812249A FR2783971B1 (fr) 1998-09-30 1998-09-30 Circuit semi-conducteur comprenant des motifs en surface et procede de reglage d'un outil par rapport a cette surface

Publications (2)

Publication Number Publication Date
FR2783971A1 FR2783971A1 (fr) 2000-03-31
FR2783971B1 true FR2783971B1 (fr) 2002-08-23

Family

ID=9531041

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9812249A Expired - Fee Related FR2783971B1 (fr) 1998-09-30 1998-09-30 Circuit semi-conducteur comprenant des motifs en surface et procede de reglage d'un outil par rapport a cette surface

Country Status (2)

Country Link
US (1) US6539276B1 (fr)
FR (1) FR2783971B1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2884045A1 (fr) * 2005-03-29 2006-10-06 St Microelectronics Sa Identification d'un circuit integre de reference pour equipement de prise et pose
CN101399251B (zh) * 2007-09-26 2012-06-06 中芯国际集成电路制造(上海)有限公司 存储器的布局方法和结构

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1330502A (en) * 1970-09-21 1973-09-19 Texas Instruments Ltd Manufacture of masks
JPS5745236A (en) * 1980-09-02 1982-03-15 Fujitsu Ltd Manufacture of semiconductor device
US4407933A (en) * 1981-06-11 1983-10-04 Bell Telephone Laboratories, Incorporated Alignment marks for electron beam lithography
JPS6066428A (ja) * 1983-09-21 1985-04-16 Fujitsu Ltd 電子ビ−ム露光方法
JPH0619670B2 (ja) * 1984-12-17 1994-03-16 株式会社デイスコ 自動精密位置合せシステム
JP2723508B2 (ja) * 1985-10-21 1998-03-09 日本電気株式会社 電子線直接描画のためのアライメント方法
JPH0196920A (ja) * 1987-10-09 1989-04-14 Fujitsu Ltd ウエーハの識別方法
JP2575795B2 (ja) * 1988-04-28 1997-01-29 富士通株式会社 半導体装置の製造方法
JPH05343296A (ja) * 1992-06-09 1993-12-24 Canon Inc 位置検出装置及びそれを用いた半導体素子の製造方法
JPH06318038A (ja) * 1993-05-07 1994-11-15 Nitto Denko Corp 個体識別ラベル

Also Published As

Publication number Publication date
FR2783971A1 (fr) 2000-03-31
US6539276B1 (en) 2003-03-25

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20080531