GB2321316A8 - Forming a pattern on a semiconductor substrate including heating or cooling the substrate to adjust its size - Google Patents
Forming a pattern on a semiconductor substrate including heating or cooling the substrate to adjust its sizeInfo
- Publication number
- GB2321316A8 GB2321316A8 GB9800991A GB9800991A GB2321316A8 GB 2321316 A8 GB2321316 A8 GB 2321316A8 GB 9800991 A GB9800991 A GB 9800991A GB 9800991 A GB9800991 A GB 9800991A GB 2321316 A8 GB2321316 A8 GB 2321316A8
- Authority
- GB
- United Kingdom
- Prior art keywords
- adjust
- cooling
- pattern
- forming
- size
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
- G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9005375A JPH10208994A (en) | 1997-01-16 | 1997-01-16 | Alignment method and aligner |
Publications (4)
Publication Number | Publication Date |
---|---|
GB9800991D0 GB9800991D0 (en) | 1998-03-11 |
GB2321316A GB2321316A (en) | 1998-07-22 |
GB2321316B GB2321316B (en) | 2001-06-20 |
GB2321316A8 true GB2321316A8 (en) | 2001-08-30 |
Family
ID=11609435
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB9800991A Expired - Fee Related GB2321316B (en) | 1997-01-16 | 1998-01-16 | Light exposure method and light exposure device |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPH10208994A (en) |
KR (1) | KR100289674B1 (en) |
GB (1) | GB2321316B (en) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11307430A (en) * | 1998-04-23 | 1999-11-05 | Canon Inc | Aligner, manufacture of device, and drive |
KR100493379B1 (en) * | 2001-12-27 | 2005-06-07 | 엘지.필립스 엘시디 주식회사 | Liquid crystal display device and method for manufacturing the same |
JP4085147B2 (en) | 2002-10-11 | 2008-05-14 | スパンション エルエルシー | Semiconductor device manufacturing method and manufacturing apparatus |
EP1513017A1 (en) | 2003-09-04 | 2005-03-09 | ASML Netherlands B.V. | Lithographic apparatus and device manufacturing method |
EP1513021B1 (en) * | 2003-09-04 | 2007-10-03 | ASML Netherlands B.V. | Lithographic apparatus and a method of compensating for thermal deformation in a lithographic apparatus |
KR101579361B1 (en) | 2004-02-04 | 2015-12-21 | 가부시키가이샤 니콘 | Exposure apparatus, exposure method, and device producing method |
US7561251B2 (en) * | 2004-03-29 | 2009-07-14 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7830493B2 (en) | 2005-10-04 | 2010-11-09 | Asml Netherlands B.V. | System and method for compensating for radiation induced thermal distortions in a substrate or projection system |
US7924408B2 (en) * | 2007-02-23 | 2011-04-12 | Kla-Tencor Technologies Corporation | Temperature effects on overlay accuracy |
US20090042139A1 (en) * | 2007-04-10 | 2009-02-12 | Nikon Corporation | Exposure method and electronic device manufacturing method |
KR101504388B1 (en) * | 2008-06-26 | 2015-03-19 | 가부시키가이샤 니콘 | Method and apparatus for manufacturing display element |
US10775707B2 (en) | 2016-10-07 | 2020-09-15 | Asml Netherlands B.V. | Lithographic apparatus and method |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1578259A (en) * | 1977-05-11 | 1980-11-05 | Philips Electronic Associated | Methods of manufacturing solid-state devices apparatus for use therein and devices manufactured thereby |
JPS60158626A (en) * | 1984-01-30 | 1985-08-20 | Canon Inc | Semiconductor exposure device |
-
1997
- 1997-01-16 JP JP9005375A patent/JPH10208994A/en active Pending
-
1998
- 1998-01-16 GB GB9800991A patent/GB2321316B/en not_active Expired - Fee Related
- 1998-01-16 KR KR1019980001267A patent/KR100289674B1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR19980070574A (en) | 1998-10-26 |
JPH10208994A (en) | 1998-08-07 |
GB2321316B (en) | 2001-06-20 |
GB2321316A (en) | 1998-07-22 |
GB9800991D0 (en) | 1998-03-11 |
KR100289674B1 (en) | 2001-07-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
711B | Application made for correction of error (sect. 117/77) | ||
732E | Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977) | ||
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20040116 |