GB9914942D0 - Semiconductor device having an alignment mark and manufacturing method therefor - Google Patents
Semiconductor device having an alignment mark and manufacturing method thereforInfo
- Publication number
- GB9914942D0 GB9914942D0 GBGB9914942.9A GB9914942A GB9914942D0 GB 9914942 D0 GB9914942 D0 GB 9914942D0 GB 9914942 A GB9914942 A GB 9914942A GB 9914942 D0 GB9914942 D0 GB 9914942D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- manufacturing
- semiconductor device
- alignment mark
- method therefor
- therefor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54426—Marks applied to semiconductor devices or parts for alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54453—Marks applied to semiconductor devices or parts for use prior to dicing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54453—Marks applied to semiconductor devices or parts for use prior to dicing
- H01L2223/5446—Located in scribe lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18077598A JP3196200B2 (en) | 1998-06-26 | 1998-06-26 | Semiconductor device and manufacturing method thereof |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| GB9914942D0 true GB9914942D0 (en) | 1999-08-25 |
| GB2339072A GB2339072A (en) | 2000-01-12 |
| GB2339072B GB2339072B (en) | 2001-04-04 |
Family
ID=16089119
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB9914942A Expired - Fee Related GB2339072B (en) | 1998-06-26 | 1999-06-25 | Semiconductor device having an alignment mark and manufacturing method therefor |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP3196200B2 (en) |
| KR (1) | KR20000006483A (en) |
| GB (1) | GB2339072B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4623819B2 (en) * | 2000-12-12 | 2011-02-02 | ルネサスエレクトロニクス株式会社 | Semiconductor device and manufacturing method thereof |
| KR100493410B1 (en) * | 2001-03-15 | 2005-06-07 | 주식회사 하이닉스반도체 | Alignment Mark |
| JP5612830B2 (en) | 2009-05-18 | 2014-10-22 | ルネサスエレクトロニクス株式会社 | Manufacturing method of semiconductor device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09260647A (en) * | 1996-03-19 | 1997-10-03 | Toshiba Corp | Semiconductor device and manufacture thereof |
-
1998
- 1998-06-26 JP JP18077598A patent/JP3196200B2/en not_active Expired - Fee Related
-
1999
- 1999-06-25 GB GB9914942A patent/GB2339072B/en not_active Expired - Fee Related
- 1999-06-25 KR KR1019990024304A patent/KR20000006483A/en not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| JP3196200B2 (en) | 2001-08-06 |
| JP2000021880A (en) | 2000-01-21 |
| GB2339072B (en) | 2001-04-04 |
| KR20000006483A (en) | 2000-01-25 |
| GB2339072A (en) | 2000-01-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20030625 |