FR2745677A1 - Boitier electro-optique integre - Google Patents

Boitier electro-optique integre Download PDF

Info

Publication number
FR2745677A1
FR2745677A1 FR9702481A FR9702481A FR2745677A1 FR 2745677 A1 FR2745677 A1 FR 2745677A1 FR 9702481 A FR9702481 A FR 9702481A FR 9702481 A FR9702481 A FR 9702481A FR 2745677 A1 FR2745677 A1 FR 2745677A1
Authority
FR
France
Prior art keywords
light emitting
emitting devices
mounting
substrate
main surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
FR9702481A
Other languages
English (en)
French (fr)
Inventor
Michael S Lebby
John W Stafford
Fred V Richard
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of FR2745677A1 publication Critical patent/FR2745677A1/fr
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/35—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being liquid crystals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/127—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed characterised by arrangements for sealing or adhesion
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electroluminescent Light Sources (AREA)
  • Led Device Packages (AREA)
FR9702481A 1996-03-04 1997-03-03 Boitier electro-optique integre Pending FR2745677A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/610,506 US5739800A (en) 1996-03-04 1996-03-04 Integrated electro-optical package with LED display chip and substrate with drivers and central opening

Publications (1)

Publication Number Publication Date
FR2745677A1 true FR2745677A1 (fr) 1997-09-05

Family

ID=24445293

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9702481A Pending FR2745677A1 (fr) 1996-03-04 1997-03-03 Boitier electro-optique integre

Country Status (5)

Country Link
US (1) US5739800A (https=)
JP (1) JPH09244553A (https=)
KR (1) KR100455969B1 (https=)
FR (1) FR2745677A1 (https=)
TW (1) TW351007B (https=)

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CN109064913A (zh) * 2017-07-19 2018-12-21 广州超维光电科技有限责任公司 基于类舞台结构的内嵌集成式行单元

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US6897855B1 (en) * 1998-02-17 2005-05-24 Sarnoff Corporation Tiled electronic display structure
US6059173A (en) * 1998-03-05 2000-05-09 International Business Machines Corporation Micro grid array solder interconnection structure for second level packaging joining a module and printed circuit board
DE19861162A1 (de) * 1998-11-06 2000-06-29 Harting Elektrooptische Bauteile Gmbh & Co Kg Verfahren zur Herstellung einer Leiterplatte sowie Leiterplatte
US6498592B1 (en) 1999-02-16 2002-12-24 Sarnoff Corp. Display tile structure using organic light emitting materials
US6439731B1 (en) * 1999-04-05 2002-08-27 Honeywell International, Inc. Flat panel liquid crystal display
EP1076357A1 (de) * 1999-08-11 2001-02-14 SiMoTec GmbH Montagevorrichtung zur Herstellung microsystemtechnischer Produkte
JP2001092381A (ja) * 1999-09-27 2001-04-06 Nec Corp 有機ｅｌディスプレイおよびその製造方法
JP3906653B2 (ja) * 2000-07-18 2007-04-18 ソニー株式会社 画像表示装置及びその製造方法
JP4461616B2 (ja) 2000-12-14 2010-05-12 ソニー株式会社 素子の転写方法、素子保持基板の形成方法、及び素子保持基板
JP4649745B2 (ja) 2001-02-01 2011-03-16 ソニー株式会社 発光素子の転写方法
WO2002084631A1 (en) * 2001-04-11 2002-10-24 Sony Corporation Element transfer method, element arrangmenet method using the same, and image display apparatus production method
US6573660B2 (en) * 2001-04-30 2003-06-03 Intel Corporation Driving emissive displays
KR100806806B1 (ko) * 2001-05-29 2008-02-22 엘지.필립스 엘시디 주식회사 평판형 표시장치의 결합장치
JP3659407B2 (ja) * 2001-08-03 2005-06-15 ソニー株式会社 発光装置
US7855708B2 (en) * 2001-09-05 2010-12-21 Honeywell International Inc. LED backlight luminance sensing for LCDs
JP2003077940A (ja) * 2001-09-06 2003-03-14 Sony Corp 素子の転写方法及びこれを用いた素子の配列方法、画像表示装置の製造方法
JP2003255850A (ja) * 2002-03-05 2003-09-10 Pioneer Electronic Corp 表示パネル基板及び表示装置
JP4259979B2 (ja) 2003-10-22 2009-04-30 新光電気工業株式会社 光透過性カバー及びこれを備えたデバイス並びにそれらの製造方法
EP1999800A1 (en) * 2006-03-21 2008-12-10 Koninklijke Philips Electronics N.V. Light emitting diode module and method for the manufacturing of such an led module
TWI363432B (en) * 2007-02-26 2012-05-01 Everlight Electronics Co Ltd A structure of a light emitting diode and a method to assemble thereof
US8138027B2 (en) 2008-03-07 2012-03-20 Stats Chippac, Ltd. Optical semiconductor device having pre-molded leadframe with window and method therefor
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US8456586B2 (en) 2009-06-11 2013-06-04 Apple Inc. Portable computer display structures
TWI423483B (zh) * 2009-09-28 2014-01-11 Silicon Base Dev Inc 光二極體封裝結構
US8408780B2 (en) * 2009-11-03 2013-04-02 Apple Inc. Portable computer housing with integral display
US8743309B2 (en) 2009-11-10 2014-06-03 Apple Inc. Methods for fabricating display structures
US9143668B2 (en) 2010-10-29 2015-09-22 Apple Inc. Camera lens structures and display structures for electronic devices
US8467177B2 (en) 2010-10-29 2013-06-18 Apple Inc. Displays with polarizer windows and opaque masking layers for electronic devices
US9899329B2 (en) 2010-11-23 2018-02-20 X-Celeprint Limited Interconnection structures and methods for transfer-printed integrated circuit elements with improved interconnection alignment tolerance
US8889485B2 (en) 2011-06-08 2014-11-18 Semprius, Inc. Methods for surface attachment of flipped active componenets
US8710630B2 (en) * 2011-07-11 2014-04-29 Taiwan Semiconductor Manufacturing Company, Ltd. Mechanisms for marking the orientation of a sawed die
US9638950B2 (en) 2014-05-15 2017-05-02 Apple Inc. Display with opaque border resistant to electrostatic discharge
US9799719B2 (en) 2014-09-25 2017-10-24 X-Celeprint Limited Active-matrix touchscreen
TWI681508B (zh) 2016-02-25 2020-01-01 愛爾蘭商艾克斯瑟樂普林特有限公司 有效率地微轉印微型裝置於大尺寸基板上
US10395966B2 (en) 2016-11-15 2019-08-27 X-Celeprint Limited Micro-transfer-printable flip-chip structures and methods
WO2018091459A1 (en) 2016-11-15 2018-05-24 X-Celeprint Limited Micro-transfer-printable flip-chip structures and methods
US10600671B2 (en) 2016-11-15 2020-03-24 X-Celeprint Limited Micro-transfer-printable flip-chip structures and methods
EP3602626B1 (en) * 2017-03-21 2023-05-03 Lumileds LLC Lighting device with led elements on a mounting element on a flat carrier and method of manufacturing the same
US11024608B2 (en) 2017-03-28 2021-06-01 X Display Company Technology Limited Structures and methods for electrical connection of micro-devices and substrates
JP2020008813A (ja) * 2018-07-12 2020-01-16 富士通コンポーネント株式会社 光モジュール
US11164934B2 (en) 2019-03-12 2021-11-02 X Display Company Technology Limited Tiled displays with black-matrix support screens
US11094870B2 (en) 2019-03-12 2021-08-17 X Display Company Technology Limited Surface-mountable pixel packages and pixel engines
US11287656B2 (en) * 2019-12-02 2022-03-29 Facebook Technologies, Llc Aligning a collimator assembly with LED arrays
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TWI811810B (zh) * 2021-10-13 2023-08-11 錼創顯示科技股份有限公司 微型發光二極體顯示面板
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CN118248819A (zh) * 2024-04-02 2024-06-25 上海显耀显示科技有限公司 显示面板的封装结构以及光波导结构

Citations (6)

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GB2062928A (en) * 1979-09-19 1981-05-28 Sharp Kk Electrode terminal assembly on a multilayer type liquid crystal panel
EP0319907A2 (en) * 1987-12-09 1989-06-14 Hitachi Cable, Ltd. Light emitting diode array chip and method of fabricating the same
EP0443527A2 (en) * 1990-02-20 1991-08-28 Casio Computer Company Limited Backlighted display panel device
EP0675540A1 (en) * 1994-03-24 1995-10-04 Motorola, Inc. Integrated electro-optical package
US5467215A (en) * 1994-12-21 1995-11-14 Motorola Integrated electro-optic package for reflective spatial light modulators
US5482896A (en) * 1993-11-18 1996-01-09 Eastman Kodak Company Light emitting device comprising an organic LED array on an ultra thin substrate and process for forming same

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JPH05152605A (ja) * 1991-11-28 1993-06-18 Nec Corp アレイ状光素子及びその実装基板
US5612549A (en) * 1994-03-24 1997-03-18 Motorola Integrated electro-optical package
US5621225A (en) * 1996-01-18 1997-04-15 Motorola Light emitting diode display package

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2062928A (en) * 1979-09-19 1981-05-28 Sharp Kk Electrode terminal assembly on a multilayer type liquid crystal panel
EP0319907A2 (en) * 1987-12-09 1989-06-14 Hitachi Cable, Ltd. Light emitting diode array chip and method of fabricating the same
EP0443527A2 (en) * 1990-02-20 1991-08-28 Casio Computer Company Limited Backlighted display panel device
US5482896A (en) * 1993-11-18 1996-01-09 Eastman Kodak Company Light emitting device comprising an organic LED array on an ultra thin substrate and process for forming same
EP0675540A1 (en) * 1994-03-24 1995-10-04 Motorola, Inc. Integrated electro-optical package
US5467215A (en) * 1994-12-21 1995-11-14 Motorola Integrated electro-optic package for reflective spatial light modulators

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109064913A (zh) * 2017-07-19 2018-12-21 广州超维光电科技有限责任公司 基于类舞台结构的内嵌集成式行单元
CN109064913B (zh) * 2017-07-19 2022-05-20 广州超维光电科技有限责任公司 基于类舞台结构的内嵌集成式行单元

Also Published As

Publication number Publication date
US5739800A (en) 1998-04-14
JPH09244553A (ja) 1997-09-19
KR100455969B1 (ko) 2004-12-17
KR970067059A (ko) 1997-10-13
TW351007B (en) 1999-01-21

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