FR2725833B1 - Structure d'etancheite pour un emballage porteur de bande et son procede de fabrication - Google Patents

Structure d'etancheite pour un emballage porteur de bande et son procede de fabrication

Info

Publication number
FR2725833B1
FR2725833B1 FR9508753A FR9508753A FR2725833B1 FR 2725833 B1 FR2725833 B1 FR 2725833B1 FR 9508753 A FR9508753 A FR 9508753A FR 9508753 A FR9508753 A FR 9508753A FR 2725833 B1 FR2725833 B1 FR 2725833B1
Authority
FR
France
Prior art keywords
band
making
sealing structure
bearing packaging
packaging
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9508753A
Other languages
English (en)
Other versions
FR2725833A1 (fr
Inventor
Yuzo Shimada
Koetsu Tamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Publication of FR2725833A1 publication Critical patent/FR2725833A1/fr
Application granted granted Critical
Publication of FR2725833B1 publication Critical patent/FR2725833B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334—Auxiliary members in encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H01L23/3185—Partial encapsulation or coating the coating covering also the sidewalls of the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
FR9508753A 1994-07-20 1995-07-19 Structure d'etancheite pour un emballage porteur de bande et son procede de fabrication Expired - Fee Related FR2725833B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6167620A JPH0831988A (ja) 1994-07-20 1994-07-20 テープキャリアパッケージの封止構造

Publications (2)

Publication Number Publication Date
FR2725833A1 FR2725833A1 (fr) 1996-04-19
FR2725833B1 true FR2725833B1 (fr) 1998-04-17

Family

ID=15853169

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9508753A Expired - Fee Related FR2725833B1 (fr) 1994-07-20 1995-07-19 Structure d'etancheite pour un emballage porteur de bande et son procede de fabrication

Country Status (3)

Country Link
US (1) US5814882A (fr)
JP (1) JPH0831988A (fr)
FR (1) FR2725833B1 (fr)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
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KR19990001459A (ko) * 1997-06-16 1999-01-15 윤종용 칩 스케일 패키지
US6448665B1 (en) * 1997-10-15 2002-09-10 Kabushiki Kaisha Toshiba Semiconductor package and manufacturing method thereof
US6495083B2 (en) 1997-10-29 2002-12-17 Hestia Technologies, Inc. Method of underfilling an integrated circuit chip
US6038136A (en) * 1997-10-29 2000-03-14 Hestia Technologies, Inc. Chip package with molded underfill
US6324069B1 (en) 1997-10-29 2001-11-27 Hestia Technologies, Inc. Chip package with molded underfill
US6566596B1 (en) 1997-12-29 2003-05-20 Intel Corporation Magnetic and electric shielding of on-board devices
US6350951B1 (en) * 1997-12-29 2002-02-26 Intel Corporation Electric shielding of on-board devices
US6224711B1 (en) * 1998-08-25 2001-05-01 International Business Machines Corporation Assembly process for flip chip package having a low stress chip and resulting structure
JP3876088B2 (ja) * 1999-01-29 2007-01-31 ローム株式会社 半導体チップおよびマルチチップ型半導体装置
US6525405B1 (en) * 2000-03-30 2003-02-25 Alphatec Holding Company Limited Leadless semiconductor product packaging apparatus having a window lid and method for packaging
US6949824B1 (en) * 2000-04-12 2005-09-27 Micron Technology, Inc. Internal package heat dissipator
WO2003060999A1 (fr) * 2002-01-17 2003-07-24 Infineon Technologies Ag Composant electronique, flan et procede pour les produire
DE10360723A1 (de) * 2003-12-23 2005-07-21 Daimlerchrysler Ag Verfahren zur Erkennung einer Fahrwerkanomalie bei einem Kraftfahrzeug
US7256482B2 (en) * 2004-08-12 2007-08-14 Texas Instruments Incorporated Integrated circuit chip packaging assembly
JP2013055500A (ja) 2011-09-02 2013-03-21 Sony Corp 固体撮像素子およびカメラシステム
JP2013055499A (ja) 2011-09-02 2013-03-21 Sony Corp 固体撮像素子およびカメラシステム
US9099391B2 (en) * 2013-03-14 2015-08-04 Infineon Technologies Austria Ag Semiconductor package with top-side insulation layer

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5886750A (ja) * 1981-11-19 1983-05-24 Matsushita Electric Ind Co Ltd 半導体装置
DE3235650A1 (de) * 1982-09-27 1984-03-29 Philips Patentverwaltung Gmbh, 2000 Hamburg Informationskarte und verfahren zu ihrer herstellung
JPS59195850A (ja) * 1983-04-20 1984-11-07 Toshiba Corp 半導体デバイス
JPS6089945A (ja) * 1983-10-24 1985-05-20 Matsushita Electric Works Ltd 封止半導体装置
JPS61166137A (ja) * 1985-01-18 1986-07-26 Nec Corp 混成集積回路のチツプコ−テイング方法
JPS61203644A (ja) * 1985-03-06 1986-09-09 Suriibondo:Kk 電子部品の製造方法
US4839713A (en) * 1987-02-20 1989-06-13 Mitsubishi Denki Kabushiki Kaisha Package structure for semiconductor device
JPH0680750B2 (ja) * 1988-02-24 1994-10-12 三菱電機株式会社 半導体装置
JPH02155256A (ja) * 1988-12-08 1990-06-14 Mitsubishi Electric Corp 半導体装置
JP2895504B2 (ja) * 1989-04-19 1999-05-24 三菱電機株式会社 半導体装置
JPH0834268B2 (ja) * 1989-06-19 1996-03-29 日本電気株式会社 樹脂封止型半導体装置
JPH0373559A (ja) * 1989-08-15 1991-03-28 Mitsubishi Electric Corp 半導体装置及びその製造方法
JPH0411758A (ja) * 1990-04-28 1992-01-16 Mitsubishi Electric Corp 半導体装置
JP2687707B2 (ja) * 1990-09-29 1997-12-08 富士電機株式会社 受光半導体装置およびその組立方法
JPH04207059A (ja) * 1990-11-30 1992-07-29 Shinko Electric Ind Co Ltd 半導体装置
JPH04267545A (ja) * 1991-02-22 1992-09-24 Nec Corp 樹脂封止型半導体装置
US5173764A (en) * 1991-04-08 1992-12-22 Motorola, Inc. Semiconductor device having a particular lid means and encapsulant to reduce die stress
JPH04360562A (ja) * 1991-06-07 1992-12-14 Nec Corp 半導体装置
JP2923096B2 (ja) * 1991-09-10 1999-07-26 株式会社日立製作所 テープキャリアパッケージおよび高周波加熱はんだ接合装置
JP2982450B2 (ja) * 1991-11-26 1999-11-22 日本電気株式会社 フィルムキャリア半導体装置及びその製造方法
JPH06204285A (ja) * 1992-12-28 1994-07-22 Toshiba Corp 半導体装置及びその製造方法
JPH06275677A (ja) * 1993-03-23 1994-09-30 Shinko Electric Ind Co Ltd 半導体装置用パッケージおよび半導体装置
US5679978A (en) * 1993-12-06 1997-10-21 Fujitsu Limited Semiconductor device having resin gate hole through substrate for resin encapsulation

Also Published As

Publication number Publication date
FR2725833A1 (fr) 1996-04-19
US5814882A (en) 1998-09-29
JPH0831988A (ja) 1996-02-02

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Legal Events

Date Code Title Description
ST Notification of lapse