FR2724053B1 - Ensemble de broche comportant un dispositif porte-pastille perfectionne. - Google Patents

Ensemble de broche comportant un dispositif porte-pastille perfectionne.

Info

Publication number
FR2724053B1
FR2724053B1 FR9507910A FR9507910A FR2724053B1 FR 2724053 B1 FR2724053 B1 FR 2724053B1 FR 9507910 A FR9507910 A FR 9507910A FR 9507910 A FR9507910 A FR 9507910A FR 2724053 B1 FR2724053 B1 FR 2724053B1
Authority
FR
France
Prior art keywords
pastille
improved
holding device
spindle assembly
spindle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9507910A
Other languages
English (en)
Other versions
FR2724053A1 (fr
Inventor
John S Hearne
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ontrak Systems Inc
Original Assignee
Ontrak Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ontrak Systems Inc filed Critical Ontrak Systems Inc
Publication of FR2724053A1 publication Critical patent/FR2724053A1/fr
Application granted granted Critical
Publication of FR2724053B1 publication Critical patent/FR2724053B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
    • B08B11/02—Devices for holding articles during cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B5/00—Clamps
    • B25B5/14—Clamps for work of special profile
    • B25B5/147—Clamps for work of special profile for pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/136—Associated with semiconductor wafer handling including wafer orienting means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
FR9507910A 1994-07-01 1995-06-30 Ensemble de broche comportant un dispositif porte-pastille perfectionne. Expired - Fee Related FR2724053B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/270,043 US5566466A (en) 1994-07-01 1994-07-01 Spindle assembly with improved wafer holder

Publications (2)

Publication Number Publication Date
FR2724053A1 FR2724053A1 (fr) 1996-03-01
FR2724053B1 true FR2724053B1 (fr) 1998-07-10

Family

ID=23029659

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9507910A Expired - Fee Related FR2724053B1 (fr) 1994-07-01 1995-06-30 Ensemble de broche comportant un dispositif porte-pastille perfectionne.

Country Status (4)

Country Link
US (1) US5566466A (fr)
JP (1) JP3683621B2 (fr)
DE (1) DE19524025C2 (fr)
FR (1) FR2724053B1 (fr)

Families Citing this family (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6003185A (en) * 1994-07-15 1999-12-21 Ontrak Systems, Inc. Hesitation free roller
US5957651A (en) * 1995-06-08 1999-09-28 Kokusai Electric Co., Ltd. Substrate carrying apparatus
JPH09213769A (ja) * 1996-01-31 1997-08-15 Komatsu Electron Metals Co Ltd 半導体ウェハの搬送装置
US6273483B1 (en) * 1996-03-28 2001-08-14 Mcmaster University Three orthogonal directions movable fingers for holding and/or manipulating a three-dimensional object
US5775000A (en) 1996-05-13 1998-07-07 Ebara Corporation Substrate gripper device for spin drying
US5851041A (en) * 1996-06-26 1998-12-22 Ontrak Systems, Inc. Wafer holder with spindle assembly and wafer holder actuator
US5803979A (en) * 1996-07-15 1998-09-08 Hine Design Inc. Transport apparatus for semiconductor wafers
US5862560A (en) * 1996-08-29 1999-01-26 Ontrak Systems, Inc. Roller with treading and system including the same
DE69737926T2 (de) * 1996-10-21 2008-04-10 Ebara Corp. Reinigungsvorrichtung
JP3831043B2 (ja) * 1997-01-24 2006-10-11 東京エレクトロン株式会社 回転処理装置
US6309163B1 (en) * 1997-10-30 2001-10-30 Applied Materials, Inc. Wafer positioning device with storage capability
JP3379632B2 (ja) * 1997-12-02 2003-02-24 本田技研工業株式会社 把持装置
US6648120B2 (en) * 1998-05-19 2003-11-18 Ssd Control Technology, Inc. Device for clamping and holding an elongated workpiece
DE19825381B4 (de) * 1998-05-28 2004-10-28 Institut für Halbleiterphysik Frankfurt (Oder) GmbH Verfahren zur Handhabung von Wafern großen Durchmessers während eines Temperprozesses
US6273100B1 (en) 1998-08-27 2001-08-14 Micron Technology, Inc. Surface cleaning apparatus and method
US6217034B1 (en) * 1998-09-24 2001-04-17 Kla-Tencor Corporation Edge handling wafer chuck
US6212961B1 (en) * 1999-02-11 2001-04-10 Nova Measuring Instruments Ltd. Buffer system for a wafer handling system
KR100303530B1 (ko) * 1999-02-02 2001-09-13 윤종용 이송로봇용 핸드장치
US6167893B1 (en) * 1999-02-09 2001-01-02 Novellus Systems, Inc. Dynamic chuck for semiconductor wafer or other substrate
IL128925A (en) * 1999-03-10 2004-03-28 Nova Measuring Instr Ltd Positioning assembly
JP3245833B2 (ja) * 1999-07-08 2002-01-15 日本エー・エス・エム株式会社 半導体基板アライナー装置および方法
EP1149415A1 (fr) * 1999-10-08 2001-10-31 Ade Corporation Mecanisme prehenseur centrifuge de compensation des forces dynamiques
US6612014B1 (en) * 2000-07-12 2003-09-02 Applied Materials, Inc. Dual post centrifugal wafer clip for spin rinse dry unit
US6964276B2 (en) * 2002-09-03 2005-11-15 Nova Measuring Instruments Ltd. Wafer monitoring system
US6530157B1 (en) 2001-09-04 2003-03-11 Process Integration Precise positioning device for workpieces
US6824343B2 (en) * 2002-02-22 2004-11-30 Applied Materials, Inc. Substrate support
KR100481277B1 (ko) * 2002-05-10 2005-04-07 한국디엔에스 주식회사 반도체 제조 장치 및 방법
US6932558B2 (en) * 2002-07-03 2005-08-23 Kung Chris Wu Wafer aligner
DE10258368B4 (de) * 2002-12-12 2010-01-21 Forschungszentrum Jülich GmbH Waferhalter
JP4467367B2 (ja) * 2004-06-22 2010-05-26 大日本スクリーン製造株式会社 基板反転装置、基板搬送装置、基板処理装置、基板反転方法、基板搬送方法および基板処理方法
FR2872725B1 (fr) * 2004-07-08 2007-09-28 Comau Systemes France Sa Dispositif simplifie de transfert rotatif
JP4600784B2 (ja) * 2005-06-13 2010-12-15 株式会社安川電機 アライナー装置
US8635784B2 (en) * 2005-10-04 2014-01-28 Applied Materials, Inc. Methods and apparatus for drying a substrate
KR100763009B1 (ko) * 2006-07-25 2007-10-17 재단법인 포항지능로봇연구소 관절장치 및 이를 이용한 로봇의 핸드장치
JP2008103544A (ja) * 2006-10-19 2008-05-01 Yaskawa Electric Corp アライナー装置
DE102007010224B4 (de) * 2007-02-28 2010-08-05 Vistec Semiconductor Systems Jena Gmbh Vorrichtung zum Haltern von scheibenförmigen Objekten
US8573918B2 (en) * 2009-08-26 2013-11-05 Android Industries Llc Dual mode end effector
SG185838A1 (en) * 2011-05-12 2012-12-28 Semiconductor Technologies And Instr Pte Ltd A component pane handler configured to handle component panes of multiple sizes
US9421617B2 (en) 2011-06-22 2016-08-23 Tel Nexx, Inc. Substrate holder
US9117856B2 (en) 2011-07-06 2015-08-25 Tel Nexx, Inc. Substrate loader and unloader having an air bearing support
JP6091060B2 (ja) * 2011-12-02 2017-03-08 芝浦メカトロニクス株式会社 スピン処理装置
CN103586246B (zh) * 2012-08-16 2016-03-23 沈阳芯源微电子设备有限公司 一种掩模板清洗机的夹持机构
CN203237742U (zh) * 2012-11-28 2013-10-16 富鼎电子科技(嘉善)有限公司 翻面机
TWI636518B (zh) * 2013-04-23 2018-09-21 荏原製作所股份有限公司 基板處理裝置及處理基板之製造方法
CN104551993A (zh) * 2015-01-20 2015-04-29 中信戴卡股份有限公司 一种毛刺机通用夹具
US20180215212A1 (en) * 2015-07-30 2018-08-02 Arkk Engineering Robotic tire mounter
US9887120B2 (en) * 2015-11-03 2018-02-06 Lam Research Ag Apparatus for treating surfaces of wafer-shaped articles
US10522381B2 (en) * 2017-04-07 2019-12-31 Applied Materials, Inc. Aligner apparatus and methods
US10811299B2 (en) 2018-05-04 2020-10-20 Lam Research Corporation Wafer chuck assembly
CN113241322B (zh) * 2021-07-08 2021-11-16 杭州众硅电子科技有限公司 一种多工位夹取装置
CN114485108B (zh) * 2021-12-31 2023-09-05 上海至纯洁净系统科技股份有限公司 一种基于自动配重的多晶圆旋转干燥系统及干燥方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4313266A (en) * 1980-05-01 1982-02-02 The Silicon Valley Group, Inc. Method and apparatus for drying wafers
US4651440A (en) * 1986-05-16 1987-03-24 Eastman Kodak Company Spin drying apparatus
JPH02138737A (ja) * 1987-08-31 1990-05-28 Oki Electric Ind Co Ltd 半導体ウエハの枚葉式スピン乾燥装置
JP2869835B2 (ja) * 1992-05-18 1999-03-10 東京エレクトロン株式会社 処理装置

Also Published As

Publication number Publication date
US5566466A (en) 1996-10-22
FR2724053A1 (fr) 1996-03-01
JPH08181098A (ja) 1996-07-12
DE19524025C2 (de) 2003-04-10
DE19524025A1 (de) 1996-01-04
JP3683621B2 (ja) 2005-08-17

Similar Documents

Publication Publication Date Title
FR2724053B1 (fr) Ensemble de broche comportant un dispositif porte-pastille perfectionne.
FR2744013B1 (fr) Dispositif de keratoprothese
FR2756923B1 (fr) Dispositif detecteur de type semi-conducteur
ITRM930562A0 (it) Dispositivo di filatura.
FR2716575B1 (fr) Dispositif opto-semiconducteur.
DE69708310T2 (de) Reinigungsgerät.
ES1034025Y (es) Dispositivo de sujecion.
BR9705807B1 (pt) dispositivo de retenÇço.
NL1009796A1 (nl) Optisch opneemapparaat.
ITRM930102A0 (it) Dispositivo di filatura.
NL1003617A1 (nl) Disk-inrichting.
ITRM930153A0 (it) Dispositivo di filatura.
NL1003618A1 (nl) Diskinrichting.
MA22979A1 (fr) Dispositif de gaulage .
FR2715456B1 (fr) Dispositif de support ponctuel.
NL192756B (nl) Installatie-inrichting.
NL1003619A1 (nl) Diskinrichting.
FR2704372B1 (fr) Dispositif de division de fréquence.
FR2684977B1 (fr) Dispositif de desempilage.
FR2757417B1 (fr) Dispositif ludique rotatif
FR2746513B1 (fr) Dispositif de support
FR2712716B1 (fr) Dispositif de garantie.
FR2756656B3 (fr) Dispositif de nettoyage de disque compact
FR2719458B1 (fr) Dispositif de support de bébé.
FR2706657B1 (fr) Dispositif de défiltrage audio-progressif.

Legal Events

Date Code Title Description
TP Transmission of property
ST Notification of lapse

Effective date: 20110228