FR2699366B1 - Système d'alignement d'un appareil d'essai. - Google Patents

Système d'alignement d'un appareil d'essai.

Info

Publication number
FR2699366B1
FR2699366B1 FR9314940A FR9314940A FR2699366B1 FR 2699366 B1 FR2699366 B1 FR 2699366B1 FR 9314940 A FR9314940 A FR 9314940A FR 9314940 A FR9314940 A FR 9314940A FR 2699366 B1 FR2699366 B1 FR 2699366B1
Authority
FR
France
Prior art keywords
test apparatus
alignment system
alignment
test
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9314940A
Other languages
English (en)
Other versions
FR2699366A1 (fr
Inventor
Mark A Swart
Charles J Johnston
Loan David R Van
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Everett Charles Technologies Inc
Original Assignee
Everett Charles Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Everett Charles Technologies Inc filed Critical Everett Charles Technologies Inc
Publication of FR2699366A1 publication Critical patent/FR2699366A1/fr
Application granted granted Critical
Publication of FR2699366B1 publication Critical patent/FR2699366B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G01R1/07328—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
FR9314940A 1992-12-14 1993-12-13 Système d'alignement d'un appareil d'essai. Expired - Fee Related FR2699366B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/990,573 US5408189A (en) 1990-05-25 1992-12-14 Test fixture alignment system for printed circuit boards

Publications (2)

Publication Number Publication Date
FR2699366A1 FR2699366A1 (fr) 1994-06-17
FR2699366B1 true FR2699366B1 (fr) 1996-09-06

Family

ID=25536293

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9314940A Expired - Fee Related FR2699366B1 (fr) 1992-12-14 1993-12-13 Système d'alignement d'un appareil d'essai.

Country Status (6)

Country Link
US (1) US5408189A (fr)
JP (1) JPH06273347A (fr)
DE (1) DE4342654C2 (fr)
FR (1) FR2699366B1 (fr)
GB (1) GB2274211B (fr)
IT (1) IT1272069B (fr)

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JP3821171B2 (ja) * 1995-11-10 2006-09-13 オー・エイチ・ティー株式会社 検査装置及び検査方法
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US6283464B1 (en) 1996-05-24 2001-09-04 International Business Machines Corporation Adjustable tooling pin for a card test fixture
US5914613A (en) 1996-08-08 1999-06-22 Cascade Microtech, Inc. Membrane probing system with local contact scrub
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DE29616272U1 (de) * 1996-09-18 1998-01-29 Atg Test Systems Gmbh Adapter zum Prüfen von elektrischen Leiterplatten
DE19703982B4 (de) * 1997-02-03 2004-06-09 Atg Test Systems Gmbh & Co.Kg Verfahren zum Prüfen von Leiterplatten
US6051983A (en) * 1997-11-03 2000-04-18 International Business Machines Corporation Positive side support test assembly
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FR2785044B1 (fr) * 1998-10-27 2001-01-26 Gemplus Card Int Gabarit universel de controle geometrique d'une carte
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US6552528B2 (en) * 2001-03-15 2003-04-22 Advantest Corporation Modular interface between a device under test and a test head
US6640610B2 (en) * 2001-03-30 2003-11-04 Analog Devices, Inc. Automatic integrated mechanical and electrical angular motion detector test system
US6970634B2 (en) * 2001-05-04 2005-11-29 Cascade Microtech, Inc. Fiber optic wafer probe
US7523848B2 (en) * 2001-07-24 2009-04-28 Kulicke And Soffa Industries, Inc. Method and apparatus for measuring the size of free air balls on a wire bonder
US6705507B2 (en) * 2001-07-24 2004-03-16 Kulicke & Soffa Investments, Inc. Die attach system and process using cornercube offset tool
US7527186B2 (en) * 2001-07-24 2009-05-05 Kulicke And Soffa Industries, Inc. Method and apparatus for mapping a position of a capillary tool tip using a prism
AU2002327490A1 (en) 2001-08-21 2003-06-30 Cascade Microtech, Inc. Membrane probing system
US6836135B2 (en) * 2001-08-31 2004-12-28 Cascade Microtech, Inc. Optical testing device
US7102374B2 (en) * 2002-08-16 2006-09-05 Credence Systems Corporation Spray cooling thermal management system and method for semiconductor probing, diagnostics, and failure analysis
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US7184626B1 (en) * 2003-04-07 2007-02-27 Luxtera, Inc Wafer-level testing of optical and optoelectronic chips
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US7110115B2 (en) * 2003-06-30 2006-09-19 Motorola, Inc. Method and arrangement for aligning an optical component on a printed wiring board
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US7453278B2 (en) * 2005-04-22 2008-11-18 Hewlett-Packard Development Company, L.P. Methods of using a blade probe for probing a node of a circuit
US7158852B2 (en) * 2005-04-22 2007-01-02 The Boeing Company Methods for controlling dimensional variations in workpieces subjected to machining operations
JP3976276B2 (ja) * 2005-06-10 2007-09-12 日本航空電子工業株式会社 検査装置
US20100131236A1 (en) * 2005-10-05 2010-05-27 Centre De Recherche Industrielle Du Quebec Apparatus and Method for Measuring Deflection of a Printed Circuit Board
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CN104835160B (zh) * 2015-05-08 2017-12-12 中国航空工业集团公司沈阳发动机设计研究所 一种定位装置及具有其的标定组件及方法
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JP7182951B2 (ja) * 2018-08-27 2022-12-05 株式会社日本マイクロニクス 検査装置及び検査方法
CN110133881B (zh) * 2019-05-24 2021-08-03 苏州凌云视界智能设备有限责任公司 一种点灯治具
CN114019343B (zh) * 2021-09-16 2024-05-14 中国船舶重工集团公司第七0九研究所 一种大规模集成电路测试系统的校准转接板定位装置
CN114501806A (zh) * 2021-12-24 2022-05-13 苏州市讯达模具有限公司 一种柔性线路板连续压合装置及其使用方法

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Also Published As

Publication number Publication date
ITTO930946A0 (it) 1993-12-14
GB9325447D0 (en) 1994-02-16
DE4342654C2 (de) 1999-09-09
GB2274211B (en) 1996-12-18
JPH06273347A (ja) 1994-09-30
ITTO930946A1 (it) 1995-06-14
US5408189A (en) 1995-04-18
DE4342654A1 (de) 1994-07-14
IT1272069B (it) 1997-06-11
GB2274211A (en) 1994-07-13
FR2699366A1 (fr) 1994-06-17

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