ITTO930946A1 - Sistema di allineamento per apparecchiatura di prova - Google Patents

Sistema di allineamento per apparecchiatura di prova

Info

Publication number
ITTO930946A1
ITTO930946A1 IT000946A ITTO930946A ITTO930946A1 IT TO930946 A1 ITTO930946 A1 IT TO930946A1 IT 000946 A IT000946 A IT 000946A IT TO930946 A ITTO930946 A IT TO930946A IT TO930946 A1 ITTO930946 A1 IT TO930946A1
Authority
IT
Italy
Prior art keywords
test equipment
alignment system
alignment
test
equipment
Prior art date
Application number
IT000946A
Other languages
English (en)
Inventor
Charles J Johnston
Mark A Swart
Loan David R Van
Original Assignee
Everett Charles Tech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Everett Charles Tech filed Critical Everett Charles Tech
Publication of ITTO930946A0 publication Critical patent/ITTO930946A0/it
Publication of ITTO930946A1 publication Critical patent/ITTO930946A1/it
Application granted granted Critical
Publication of IT1272069B publication Critical patent/IT1272069B/it

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G01R1/07328—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Measuring Leads Or Probes (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
ITTO930946A 1992-12-14 1993-12-14 Sistema di allineamento per apparecchiatura di prova IT1272069B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/990,573 US5408189A (en) 1990-05-25 1992-12-14 Test fixture alignment system for printed circuit boards

Publications (3)

Publication Number Publication Date
ITTO930946A0 ITTO930946A0 (it) 1993-12-14
ITTO930946A1 true ITTO930946A1 (it) 1995-06-14
IT1272069B IT1272069B (it) 1997-06-11

Family

ID=25536293

Family Applications (1)

Application Number Title Priority Date Filing Date
ITTO930946A IT1272069B (it) 1992-12-14 1993-12-14 Sistema di allineamento per apparecchiatura di prova

Country Status (6)

Country Link
US (1) US5408189A (it)
JP (1) JPH06273347A (it)
DE (1) DE4342654C2 (it)
FR (1) FR2699366B1 (it)
GB (1) GB2274211B (it)
IT (1) IT1272069B (it)

Families Citing this family (99)

* Cited by examiner, † Cited by third party
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FR2704893B1 (fr) * 1993-05-05 1995-08-11 Tesa Serrure de sûreté et clé plate pour une telle serrure.
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US5856924A (en) * 1994-05-06 1999-01-05 Brost; Randolph C. Processor and method for developing a set of admissible fixture designs for a workpiece
US5715167A (en) * 1995-07-13 1998-02-03 General Electric Company Fixture for calibrated positioning of an object
KR0163688B1 (ko) * 1995-07-28 1999-03-20 전주범 내부회로 측정장치
KR0158421B1 (ko) * 1995-09-19 1998-12-15 배순훈 인쇄회로기판의 자삽불량 검사장치 및 방법
JP3821171B2 (ja) * 1995-11-10 2006-09-13 オー・エイチ・ティー株式会社 検査装置及び検査方法
US6283464B1 (en) 1996-05-24 2001-09-04 International Business Machines Corporation Adjustable tooling pin for a card test fixture
US5892366A (en) * 1996-05-24 1999-04-06 International Business Machines Corporation Adjustable tooling pin for a card test fixture
US5914613A (en) 1996-08-08 1999-06-22 Cascade Microtech, Inc. Membrane probing system with local contact scrub
JP3011401B2 (ja) * 1996-08-29 2000-02-21 日本電産リード株式会社 上側治具位置決め機構付きプリント基板検査装置および上側治具位置決め方法
DE29616272U1 (de) * 1996-09-18 1998-01-29 atg test systems GmbH, 97877 Wertheim Adapter zum Prüfen von elektrischen Leiterplatten
DE19703982B4 (de) * 1997-02-03 2004-06-09 Atg Test Systems Gmbh & Co.Kg Verfahren zum Prüfen von Leiterplatten
US6051983A (en) * 1997-11-03 2000-04-18 International Business Machines Corporation Positive side support test assembly
US6039439A (en) * 1998-06-19 2000-03-21 Lexmark International, Inc. Ink jet heater chip module
US6449831B1 (en) 1998-06-19 2002-09-17 Lexmark International, Inc Process for making a heater chip module
US6256882B1 (en) 1998-07-14 2001-07-10 Cascade Microtech, Inc. Membrane probing system
DE19847146A1 (de) * 1998-10-13 2000-05-04 Test Plus Electronic Gmbh Testadapter
US6369593B1 (en) * 1998-10-13 2002-04-09 Test Plus Electronic Gmbh Load board test fixture
FR2785044B1 (fr) * 1998-10-27 2001-01-26 Gemplus Card Int Gabarit universel de controle geometrique d'une carte
US6489586B1 (en) 1999-04-29 2002-12-03 Cad-Tech, Inc. Method and apparatus for verification of assembled printed circuit boards
US6445202B1 (en) 1999-06-30 2002-09-03 Cascade Microtech, Inc. Probe station thermal chuck with shielding for capacitive current
JP2001127499A (ja) * 1999-10-26 2001-05-11 Matsushita Electric Ind Co Ltd 検査方法および検査装置
US6633797B1 (en) * 1999-11-03 2003-10-14 Srinivas Akella Automated reconfigurable object manipulation device with an array of pins
US6384617B1 (en) 1999-11-17 2002-05-07 Agilent Technologies, Inc. Signal transfer device for probe test fixture
US6262571B1 (en) 1999-11-17 2001-07-17 Agilent Technologies, Inc. Adjustable electrical connector for test fixture nest
US6538425B1 (en) * 1999-11-29 2003-03-25 Fuji Machine Mfg. Co., Ltd. Method of measuring accuracy of electric-component mounting system
US6336276B1 (en) 2000-01-18 2002-01-08 Agilent Technologies, Inc. Customizable nest for positioning a device under test
US6469495B1 (en) 2000-02-23 2002-10-22 Agilent Technologies, Inc. RF isolation test device accommodating multiple nest plates for testing different devices and providing variable testing options
US6563297B1 (en) 2000-02-23 2003-05-13 Agilent Technologies, Inc. RF isolation test device having ease of accessibility
US6509753B2 (en) 2000-02-23 2003-01-21 Agilent Technologies, Inc. Customizable nest that requires no machining or tools
US6492823B1 (en) 2000-02-23 2002-12-10 Agilent Technologies, Inc. Customizable nest providing for adjustable audio isolation for testing wireless devices
US6752391B1 (en) 2000-02-23 2004-06-22 Agilent Technologies, Inc. Customizable nest with the option of conversion to a permanent nest
US6377038B1 (en) 2000-02-23 2002-04-23 Agilent Technologies, Inc. RF isolation test device having a box within a box configuration for RF sheilding reference to related applications
DE20005123U1 (de) 2000-03-20 2001-08-02 Atg Test Systems Gmbh Vorrichtung zum Prüfen von Leiterplatten
US6405448B1 (en) * 2000-07-07 2002-06-18 Industrial Powder Coatings, Inc. Hang pattern verification tool
US6914423B2 (en) 2000-09-05 2005-07-05 Cascade Microtech, Inc. Probe station
US6965226B2 (en) 2000-09-05 2005-11-15 Cascade Microtech, Inc. Chuck for holding a device under test
DE20114544U1 (de) 2000-12-04 2002-02-21 Cascade Microtech Inc Wafersonde
AT412027B (de) * 2001-02-12 2004-08-26 Austria Tech & System Tech Verfahren und vorrichtung zum lokalisieren von möglicherweise fehlerhaften stiften in einem prüfadapter sowie stiftziehwerkzeug
US6552528B2 (en) * 2001-03-15 2003-04-22 Advantest Corporation Modular interface between a device under test and a test head
US6640610B2 (en) * 2001-03-30 2003-11-04 Analog Devices, Inc. Automatic integrated mechanical and electrical angular motion detector test system
US6970634B2 (en) * 2001-05-04 2005-11-29 Cascade Microtech, Inc. Fiber optic wafer probe
US7523848B2 (en) * 2001-07-24 2009-04-28 Kulicke And Soffa Industries, Inc. Method and apparatus for measuring the size of free air balls on a wire bonder
US6705507B2 (en) * 2001-07-24 2004-03-16 Kulicke & Soffa Investments, Inc. Die attach system and process using cornercube offset tool
US7527186B2 (en) * 2001-07-24 2009-05-05 Kulicke And Soffa Industries, Inc. Method and apparatus for mapping a position of a capillary tool tip using a prism
US7355420B2 (en) 2001-08-21 2008-04-08 Cascade Microtech, Inc. Membrane probing system
US6836135B2 (en) * 2001-08-31 2004-12-28 Cascade Microtech, Inc. Optical testing device
US7102374B2 (en) * 2002-08-16 2006-09-05 Credence Systems Corporation Spray cooling thermal management system and method for semiconductor probing, diagnostics, and failure analysis
TW590219U (en) * 2003-03-12 2004-06-01 Hon Hai Prec Ind Co Ltd Tester for mainboards
US7184626B1 (en) * 2003-04-07 2007-02-27 Luxtera, Inc Wafer-level testing of optical and optoelectronic chips
US7492172B2 (en) 2003-05-23 2009-02-17 Cascade Microtech, Inc. Chuck for holding a device under test
US7057404B2 (en) 2003-05-23 2006-06-06 Sharp Laboratories Of America, Inc. Shielded probe for testing a device under test
US7110115B2 (en) * 2003-06-30 2006-09-19 Motorola, Inc. Method and arrangement for aligning an optical component on a printed wiring board
US7250626B2 (en) 2003-10-22 2007-07-31 Cascade Microtech, Inc. Probe testing structure
US7187188B2 (en) 2003-12-24 2007-03-06 Cascade Microtech, Inc. Chuck with integrated wafer support
US7427868B2 (en) 2003-12-24 2008-09-23 Cascade Microtech, Inc. Active wafer probe
JP2008512680A (ja) 2004-09-13 2008-04-24 カスケード マイクロテック インコーポレイテッド 両面プロービング構造体
US7535247B2 (en) 2005-01-31 2009-05-19 Cascade Microtech, Inc. Interface for testing semiconductors
US7656172B2 (en) 2005-01-31 2010-02-02 Cascade Microtech, Inc. System for testing semiconductors
US7158852B2 (en) * 2005-04-22 2007-01-02 The Boeing Company Methods for controlling dimensional variations in workpieces subjected to machining operations
US7453278B2 (en) * 2005-04-22 2008-11-18 Hewlett-Packard Development Company, L.P. Methods of using a blade probe for probing a node of a circuit
JP3976276B2 (ja) * 2005-06-10 2007-09-12 日本航空電子工業株式会社 検査装置
US20100131236A1 (en) * 2005-10-05 2010-05-27 Centre De Recherche Industrielle Du Quebec Apparatus and Method for Measuring Deflection of a Printed Circuit Board
DE102006006255A1 (de) * 2006-02-10 2007-08-23 Atg Test Systems Gmbh Fingertester zum Prüfen von unbestückten Leiterplatten und Verfahren zum Prüfen unbestückter Leiterplatten mit einem Fingertester
US7403028B2 (en) 2006-06-12 2008-07-22 Cascade Microtech, Inc. Test structure and probe for differential signals
US7764072B2 (en) 2006-06-12 2010-07-27 Cascade Microtech, Inc. Differential signal probing system
US7723999B2 (en) 2006-06-12 2010-05-25 Cascade Microtech, Inc. Calibration structures for differential signal probing
US20080197868A1 (en) * 2007-02-20 2008-08-21 Troy Fossum Circuit board testing device with self aligning plates
CN101296604A (zh) * 2007-04-24 2008-10-29 鸿富锦精密工业（深圳）有限公司 屏蔽箱体
US7629812B2 (en) * 2007-08-03 2009-12-08 Dsm Solutions, Inc. Switching circuits and methods for programmable logic devices
US7876114B2 (en) 2007-08-08 2011-01-25 Cascade Microtech, Inc. Differential waveguide probe
US7710148B2 (en) * 2008-06-02 2010-05-04 Suvolta, Inc. Programmable switch circuit and method, method of manufacture, and devices and systems including the same
US7888957B2 (en) 2008-10-06 2011-02-15 Cascade Microtech, Inc. Probing apparatus with impedance optimized interface
WO2010059247A2 (en) 2008-11-21 2010-05-27 Cascade Microtech, Inc. Replaceable coupon for a probing apparatus
US8319503B2 (en) 2008-11-24 2012-11-27 Cascade Microtech, Inc. Test apparatus for measuring a characteristic of a device under test
DE102009004555A1 (de) 2009-01-14 2010-09-30 Atg Luther & Maelzer Gmbh Verfahren zum Prüfen von Leiterplatten
GB0907394D0 (en) * 2009-04-30 2009-06-10 Antonis Jan An optical probe
US8400139B2 (en) * 2010-03-26 2013-03-19 Infineon Technologies Ag Sensor package having a sensor chip
DE102010023187A1 (de) * 2010-06-09 2011-12-15 Dtg International Gmbh Vorrichtung und Verfahren zum Untersuchen von Leiterplatten
DK2609398T3 (da) * 2010-08-27 2014-09-08 Northq Aps Et eftermonterbart system til automatisk aflæsning af forbrugsmålere og en skabelon til at rette huset af en optisk sensor deri ind.
CN102486480A (zh) * 2010-12-04 2012-06-06 鸿富锦精密工业（深圳）有限公司 主板测试支架
US20120242828A1 (en) * 2011-03-24 2012-09-27 Lmk Enterprises, Inc. Method and apparatus for aligning a component with a target
CN102955122A (zh) * 2011-08-18 2013-03-06 鸿富锦精密工业（深圳）有限公司 电路板测试装置
CN102368078A (zh) * 2011-10-19 2012-03-07 昆山迈致治具科技有限公司 电路板检测治具的定位机构
ITTO20130324A1 (it) * 2013-04-22 2014-10-23 St Microelectronics Srl Dispositivo vibrante per il posizionamento di un pezzo miniaturizzato in una sede di test, e metodo di posizionamento
CN106463046A (zh) * 2014-06-04 2017-02-22 瑞典爱立信有限公司 光电测量系统、测量探头及其方法
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CN104835160B (zh) * 2015-05-08 2017-12-12 中国航空工业集团公司沈阳发动机设计研究所 一种定位装置及具有其的标定组件及方法
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US10158357B1 (en) 2016-04-05 2018-12-18 Vlt, Inc. Method and apparatus for delivering power to semiconductors
US10903734B1 (en) 2016-04-05 2021-01-26 Vicor Corporation Delivering power to semiconductor loads
US11336167B1 (en) 2016-04-05 2022-05-17 Vicor Corporation Delivering power to semiconductor loads
US10785871B1 (en) * 2018-12-12 2020-09-22 Vlt, Inc. Panel molded electronic assemblies with integral terminals
US10215797B2 (en) * 2017-04-05 2019-02-26 Hall Labs Llc Smart blinds PCB test apparatus
JP7182951B2 (ja) * 2018-08-27 2022-12-05 株式会社日本マイクロニクス 検査装置及び検査方法
CN110133881B (zh) * 2019-05-24 2021-08-03 苏州凌云视界智能设备有限责任公司 一种点灯治具
CN114019343B (zh) * 2021-09-16 2024-05-14 中国船舶重工集团公司第七0九研究所 一种大规模集成电路测试系统的校准转接板定位装置

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* Cited by examiner, † Cited by third party
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CA944435A (en) * 1970-12-25 1974-03-26 Tadashi Kubota Inspection apparatus for printed circuit boards
DE2637878C3 (de) * 1976-08-23 1979-09-27 Siemens Ag, 1000 Berlin Und 8000 Muenchen Anordnung zum Prüfen der Funktionsfähigkeit einer elektrischen Baugruppe
DE3340178C1 (de) * 1983-11-07 1985-05-15 MANIA Elektronik Automatisation Entwicklung und Gerätebau GmbH Vorrichtung zum Andruecken von in einem Leiterplattenpruefgeraet zu testenden Leiterplatten und Verfahren zur Justierung der dazugehoerigen Lichtmarkenprojektoren
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DE69127283T2 (de) * 1990-05-25 1998-01-02 Everett Charles Contact Prod Ausrichtsystem und -verfahren für eine prüfhalterung
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Also Published As

Publication number Publication date
ITTO930946A0 (it) 1993-12-14
US5408189A (en) 1995-04-18
JPH06273347A (ja) 1994-09-30
FR2699366A1 (fr) 1994-06-17
GB2274211A (en) 1994-07-13
GB9325447D0 (en) 1994-02-16
DE4342654A1 (de) 1994-07-14
FR2699366B1 (fr) 1996-09-06
IT1272069B (it) 1997-06-11
DE4342654C2 (de) 1999-09-09
GB2274211B (en) 1996-12-18

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Legal Events

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0001 Granted
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19971223