FR2703365B1 - Appareil et procédé d'électro-placage. - Google Patents
Appareil et procédé d'électro-placage.Info
- Publication number
- FR2703365B1 FR2703365B1 FR9401647A FR9401647A FR2703365B1 FR 2703365 B1 FR2703365 B1 FR 2703365B1 FR 9401647 A FR9401647 A FR 9401647A FR 9401647 A FR9401647 A FR 9401647A FR 2703365 B1 FR2703365 B1 FR 2703365B1
- Authority
- FR
- France
- Prior art keywords
- electroplating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP07137993A JP3308333B2 (ja) | 1993-03-30 | 1993-03-30 | 電解メッキ装置,及び電解メッキ処理方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2703365A1 FR2703365A1 (fr) | 1994-10-07 |
FR2703365B1 true FR2703365B1 (fr) | 1995-11-10 |
Family
ID=13458816
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9401647A Expired - Lifetime FR2703365B1 (fr) | 1993-03-30 | 1994-02-14 | Appareil et procédé d'électro-placage. |
Country Status (4)
Country | Link |
---|---|
US (1) | US5441629A (fr) |
JP (1) | JP3308333B2 (fr) |
FR (1) | FR2703365B1 (fr) |
GB (1) | GB2276885B (fr) |
Families Citing this family (54)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5865976A (en) * | 1994-10-07 | 1999-02-02 | Toyoda Gosei Co., Inc. | Plating method |
DE19702366C2 (de) * | 1996-01-24 | 2002-10-31 | Toyoda Gosei Kk | Beschichtungsverfahren |
US7087143B1 (en) * | 1996-07-15 | 2006-08-08 | Semitool, Inc. | Plating system for semiconductor materials |
DE19861248B4 (de) * | 1997-04-28 | 2005-03-17 | Mitsubishi Denki K.K. | Verfahren zum Beschichten einer Oberfläche eines Wafers |
US6001235A (en) * | 1997-06-23 | 1999-12-14 | International Business Machines Corporation | Rotary plater with radially distributed plating solution |
US5893966A (en) * | 1997-07-28 | 1999-04-13 | Micron Technology, Inc. | Method and apparatus for continuous processing of semiconductor wafers |
US6033548A (en) * | 1997-07-28 | 2000-03-07 | Micron Technology, Inc. | Rotating system and method for electrodepositing materials on semiconductor wafers |
US6017437A (en) * | 1997-08-22 | 2000-01-25 | Cutek Research, Inc. | Process chamber and method for depositing and/or removing material on a substrate |
US6179983B1 (en) | 1997-11-13 | 2001-01-30 | Novellus Systems, Inc. | Method and apparatus for treating surface including virtual anode |
US6159354A (en) * | 1997-11-13 | 2000-12-12 | Novellus Systems, Inc. | Electric potential shaping method for electroplating |
US6156167A (en) * | 1997-11-13 | 2000-12-05 | Novellus Systems, Inc. | Clamshell apparatus for electrochemically treating semiconductor wafers |
US6027631A (en) * | 1997-11-13 | 2000-02-22 | Novellus Systems, Inc. | Electroplating system with shields for varying thickness profile of deposited layer |
US6126798A (en) * | 1997-11-13 | 2000-10-03 | Novellus Systems, Inc. | Electroplating anode including membrane partition system and method of preventing passivation of same |
US6416647B1 (en) * | 1998-04-21 | 2002-07-09 | Applied Materials, Inc. | Electro-chemical deposition cell for face-up processing of single semiconductor substrates |
US6022465A (en) * | 1998-06-01 | 2000-02-08 | Cutek Research, Inc. | Apparatus and method utilizing an electrode adapter for customized contact placement on a wafer |
US6228232B1 (en) | 1998-07-09 | 2001-05-08 | Semitool, Inc. | Reactor vessel having improved cup anode and conductor assembly |
WO2000003072A1 (fr) * | 1998-07-10 | 2000-01-20 | Semitool, Inc. | Procede et appareil de cuivrage pour depot autocatalytique et depot electrolytique |
US6773560B2 (en) | 1998-07-10 | 2004-08-10 | Semitool, Inc. | Dry contact assemblies and plating machines with dry contact assemblies for plating microelectronic workpieces |
US6303010B1 (en) | 1999-07-12 | 2001-10-16 | Semitool, Inc. | Methods and apparatus for processing the surface of a microelectronic workpiece |
US7048841B2 (en) | 1998-12-07 | 2006-05-23 | Semitool, Inc. | Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces |
US6080291A (en) * | 1998-07-10 | 2000-06-27 | Semitool, Inc. | Apparatus for electrochemically processing a workpiece including an electrical contact assembly having a seal member |
US6187152B1 (en) | 1998-07-17 | 2001-02-13 | Cutek Research, Inc. | Multiple station processing chamber and method for depositing and/or removing material on a substrate |
US6183611B1 (en) * | 1998-07-17 | 2001-02-06 | Cutek Research, Inc. | Method and apparatus for the disposal of processing fluid used to deposit and/or remove material on a substrate |
US6017820A (en) * | 1998-07-17 | 2000-01-25 | Cutek Research, Inc. | Integrated vacuum and plating cluster system |
JP4611341B2 (ja) * | 1998-11-09 | 2011-01-12 | 株式会社荏原製作所 | めっき方法及び装置 |
US6309520B1 (en) | 1998-12-07 | 2001-10-30 | Semitool, Inc. | Methods and apparatus for processing the surface of a microelectronic workpiece |
US6645356B1 (en) | 1998-12-07 | 2003-11-11 | Semitool, Inc. | Methods and apparatus for processing the surface of a microelectronic workpiece |
TW483950B (en) | 1998-12-31 | 2002-04-21 | Semitool Inc | Method, chemistry, and apparatus for high deposition rate solder electroplating on a microelectronic workpiece |
US6303500B1 (en) * | 1999-02-24 | 2001-10-16 | Micron Technology, Inc. | Method and apparatus for electroless plating a contact pad |
US6241825B1 (en) | 1999-04-16 | 2001-06-05 | Cutek Research Inc. | Compliant wafer chuck |
US6454864B2 (en) * | 1999-06-14 | 2002-09-24 | Cutek Research, Inc. | Two-piece chuck |
US8298395B2 (en) * | 1999-06-30 | 2012-10-30 | Chema Technology, Inc. | Electroplating apparatus |
US6258223B1 (en) * | 1999-07-09 | 2001-07-10 | Applied Materials, Inc. | In-situ electroless copper seed layer enhancement in an electroplating system |
US20020043466A1 (en) * | 1999-07-09 | 2002-04-18 | Applied Materials, Inc. | Method and apparatus for patching electrochemically deposited layers using electroless deposited materials |
US7645366B2 (en) * | 1999-07-12 | 2010-01-12 | Semitool, Inc. | Microelectronic workpiece holders and contact assemblies for use therewith |
US6673216B2 (en) * | 1999-08-31 | 2004-01-06 | Semitool, Inc. | Apparatus for providing electrical and fluid communication to a rotating microelectronic workpiece during electrochemical processing |
JP2002097598A (ja) | 2000-09-25 | 2002-04-02 | Mitsubishi Electric Corp | 電解メッキ装置 |
JP2002220692A (ja) * | 2001-01-24 | 2002-08-09 | Ebara Corp | めっき装置及び方法 |
JP4014827B2 (ja) * | 2001-07-25 | 2007-11-28 | シャープ株式会社 | メッキ処理装置 |
JP3695703B2 (ja) * | 2001-10-25 | 2005-09-14 | 株式会社日立製作所 | 電気めっき方法、電気めっき装置及び半導体装置の製造方法及び製造装置 |
US7118658B2 (en) * | 2002-05-21 | 2006-10-10 | Semitool, Inc. | Electroplating reactor |
US7153400B2 (en) * | 2002-09-30 | 2006-12-26 | Lam Research Corporation | Apparatus and method for depositing and planarizing thin films of semiconductor wafers |
US20040146461A1 (en) * | 2003-01-29 | 2004-07-29 | Vincenzo Giuliano | Oral contrast media composition for computerized axial tomographic examinations and method |
US7829152B2 (en) * | 2006-10-05 | 2010-11-09 | Lam Research Corporation | Electroless plating method and apparatus |
JP5168081B2 (ja) * | 2008-10-24 | 2013-03-21 | スズキ株式会社 | 多気筒シリンダブロックのめっき前処理装置及び方法 |
ES2637799T3 (es) | 2011-11-15 | 2017-10-17 | Ashwin-Ushas Corporation, Inc. | Dispositivo electrocrómico con polímeros complementarios |
US9207515B2 (en) | 2013-03-15 | 2015-12-08 | Ashwin-Ushas Corporation, Inc. | Variable-emittance electrochromic devices and methods of preparing the same |
US9303329B2 (en) | 2013-11-11 | 2016-04-05 | Tel Nexx, Inc. | Electrochemical deposition apparatus with remote catholyte fluid management |
US9632059B2 (en) | 2015-09-03 | 2017-04-25 | Ashwin-Ushas Corporation, Inc. | Potentiostat/galvanostat with digital interface |
US9482880B1 (en) | 2015-09-15 | 2016-11-01 | Ashwin-Ushas Corporation, Inc. | Electrochromic eyewear |
US9945045B2 (en) | 2015-12-02 | 2018-04-17 | Ashwin-Ushas Corporation, Inc. | Electrochemical deposition apparatus and methods of using the same |
CN106637322B (zh) * | 2017-02-28 | 2018-05-18 | 扬州大学 | 一种半导体硅片微点电镀槽 |
CN108560033B (zh) * | 2018-04-11 | 2021-02-19 | 佛山市戴盟科技有限公司 | 一种工件阳极氧化处理工艺 |
CN111560638B (zh) * | 2020-07-06 | 2021-06-29 | 苏州清飙科技有限公司 | 晶圆电镀设备 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2431949A (en) * | 1943-11-24 | 1947-12-02 | Gen Motors Corp | Apparatus for electroplating the inside of bearing shells and the like |
FR1406461A (fr) * | 1962-01-26 | 1965-07-23 | Siemens Ag | Procédé de fabrication d'un dispositif semi-conducteur |
US3841990A (en) * | 1971-12-25 | 1974-10-15 | Toyo Kogyo Co | Apparatus for simultaneously electroplating inside surfaces of annular bodies |
NL7316245A (nl) * | 1973-10-04 | 1975-04-08 | Galentan Ag | Werkwijze voor het selectief aanbrengen van een llaag op de door een isolerend lichaam ge- e metaaldelen van electrische bouwelementen. |
US4192729A (en) * | 1978-04-03 | 1980-03-11 | Burroughs Corporation | Apparatus for forming an aluminum interconnect structure on an integrated circuit chip |
JPS5819170Y2 (ja) * | 1980-08-16 | 1983-04-19 | 征一郎 相合 | 半導体ウェハ−のめっき装置 |
IT1129345B (it) * | 1980-10-29 | 1986-06-04 | Fiat Ricerche | Disp*sitivo per il trattamento elettrolitico della superficie di pezzi maccanici particolarmente di cilindri di motori a combustione interna |
US4530635A (en) * | 1983-06-15 | 1985-07-23 | The Perkin-Elmer Corporation | Wafer transferring chuck assembly |
JPH0669019B2 (ja) * | 1984-03-12 | 1994-08-31 | 株式会社ニコン | 半導体製造装置 |
US4590094A (en) * | 1984-10-29 | 1986-05-20 | International Business Machines Corporation | Inverted apply using bubble dispense |
JPS6396292A (ja) * | 1986-10-13 | 1988-04-27 | Mitsubishi Electric Corp | 電解メツキ装置 |
JPH0194620A (ja) * | 1987-10-06 | 1989-04-13 | Mitsubishi Electric Corp | スピン塗布装置 |
JP2628886B2 (ja) * | 1988-05-19 | 1997-07-09 | 三菱電機株式会社 | 電解メッキ装置 |
JPH0781197B2 (ja) * | 1989-05-22 | 1995-08-30 | 日本電気株式会社 | 半導体基板鍍金装置 |
JPH0344023A (ja) * | 1989-07-11 | 1991-02-25 | Seiko Instr Inc | レジスト塗布装置 |
US5087909A (en) * | 1989-08-18 | 1992-02-11 | Westinghouse Electric Corp. | Method and apparatus for radio frequency signal detection |
JP2641594B2 (ja) * | 1990-04-16 | 1997-08-13 | 三菱電機株式会社 | メッキ装置 |
JPH07107199B2 (ja) * | 1990-05-25 | 1995-11-15 | 島田理化工業株式会社 | ウエハ処理装置 |
-
1993
- 1993-03-30 JP JP07137993A patent/JP3308333B2/ja not_active Expired - Lifetime
-
1994
- 1994-02-07 US US08/192,853 patent/US5441629A/en not_active Expired - Lifetime
- 1994-02-14 FR FR9401647A patent/FR2703365B1/fr not_active Expired - Lifetime
- 1994-02-25 GB GB9403686A patent/GB2276885B/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
GB9403686D0 (en) | 1994-04-13 |
GB2276885A (en) | 1994-10-12 |
GB2276885B (en) | 1996-10-23 |
JPH06280098A (ja) | 1994-10-04 |
US5441629A (en) | 1995-08-15 |
FR2703365A1 (fr) | 1994-10-07 |
JP3308333B2 (ja) | 2002-07-29 |
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