FR2685604B1 - Procede et appareil d'alimentation en composants electroniques. - Google Patents

Procede et appareil d'alimentation en composants electroniques.

Info

Publication number
FR2685604B1
FR2685604B1 FR9208630A FR9208630A FR2685604B1 FR 2685604 B1 FR2685604 B1 FR 2685604B1 FR 9208630 A FR9208630 A FR 9208630A FR 9208630 A FR9208630 A FR 9208630A FR 2685604 B1 FR2685604 B1 FR 2685604B1
Authority
FR
France
Prior art keywords
electronic components
supplying electronic
supplying
components
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9208630A
Other languages
English (en)
Other versions
FR2685604A1 (fr
Inventor
Tetsuo Takahashi
Shinichi Araya
Kunio Mogi
Kuniaki Takahashi
Koujiitou Takeshi Kudou
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP3354898A external-priority patent/JPH07118597B2/ja
Priority claimed from JP4031360A external-priority patent/JPH05198975A/ja
Application filed by TDK Corp filed Critical TDK Corp
Publication of FR2685604A1 publication Critical patent/FR2685604A1/fr
Application granted granted Critical
Publication of FR2685604B1 publication Critical patent/FR2685604B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0452—Mounting machines or lines comprising a plurality of tools for guiding different components to the same mounting place
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H05K13/021—Loading or unloading of containers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/086—Supply management, e.g. supply of components or of substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
FR9208630A 1991-12-21 1992-07-10 Procede et appareil d'alimentation en composants electroniques. Expired - Fee Related FR2685604B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP3354898A JPH07118597B2 (ja) 1991-12-21 1991-12-21 チップ部品フィーダモジュール及び該モジュールの取付構造
JP4031360A JPH05198975A (ja) 1992-01-23 1992-01-23 電子部品供給方法

Publications (2)

Publication Number Publication Date
FR2685604A1 FR2685604A1 (fr) 1993-06-25
FR2685604B1 true FR2685604B1 (fr) 1994-05-13

Family

ID=26369812

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9208630A Expired - Fee Related FR2685604B1 (fr) 1991-12-21 1992-07-10 Procede et appareil d'alimentation en composants electroniques.

Country Status (5)

Country Link
US (1) US5319846A (fr)
KR (1) KR970004507B1 (fr)
DE (1) DE4222709A1 (fr)
FR (1) FR2685604B1 (fr)
GB (1) GB2262516B (fr)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2970183B2 (ja) * 1992-03-03 1999-11-02 松下電器産業株式会社 ウエハの搬送保管方法とウエハキャリア
JP3301880B2 (ja) * 1995-01-17 2002-07-15 松下電器産業株式会社 部品装着方法及び装置
JP3079934B2 (ja) * 1995-01-23 2000-08-21 株式会社村田製作所 チップ部品の自動補給装置
JP3552810B2 (ja) 1995-09-27 2004-08-11 松下電器産業株式会社 部品供給部の部品一括交換方法と装置
US5671530A (en) * 1995-10-30 1997-09-30 Delco Electronics Corporation Flip-chip mounting assembly and method with vertical wafer feeder
JP3655398B2 (ja) * 1996-08-19 2005-06-02 松下電器産業株式会社 部品実装装置
JP3402968B2 (ja) * 1996-11-18 2003-05-06 ヤマハ発動機株式会社 実装装置
US6205745B1 (en) * 1998-05-27 2001-03-27 Lucent Technologies Inc. High speed flip-chip dispensing
US5966903A (en) * 1998-05-27 1999-10-19 Lucent Technologies Inc. High speed flip-chip dispensing
JP3548817B2 (ja) * 1998-11-09 2004-07-28 株式会社村田製作所 部品搬送装置
US6629007B1 (en) * 1998-12-25 2003-09-30 Matsushita Electric Industrial Co., Ltd. Apparatus and method for notifying lack of component in advance, component mounting apparatus, and article of manufacture comprising computer usable medium
US6662966B2 (en) 2001-06-28 2003-12-16 Smtc Corporation Surface mount manufacturing storage system
GB0322686D0 (en) * 2003-09-27 2003-10-29 Koninkl Philips Electronics Nv Display device arrangement & container
JP4617244B2 (ja) * 2005-11-08 2011-01-19 富士通株式会社 部品供給装置及び部品供給方法
DE102006022371A1 (de) * 2006-05-12 2007-11-15 Siemens Ag Betrieb einer Fertigungsanlage für elektronische Baugruppen
US7401695B2 (en) 2006-06-07 2008-07-22 The Gillette Company Component control device, systems, and methods
KR101563306B1 (ko) * 2009-01-19 2015-10-27 한화테크윈 주식회사 전자 부품 공급 장치 및 이를 갖는 칩 마운터
US10111369B2 (en) * 2012-03-12 2018-10-23 Micronic Mydata AB Method and device for automatic storage of tape guides
WO2014010083A1 (fr) * 2012-07-13 2014-01-16 富士機械製造株式会社 Système de montage de composants
CN110996648B (zh) * 2013-09-18 2021-04-20 迈康尼股份公司 用于识别smt系统中的工具箱的方法、系统和装置
CN106031325B (zh) * 2014-02-14 2019-04-02 株式会社富士 供料器更换装置
WO2017085782A1 (fr) * 2015-11-17 2017-05-26 富士機械製造株式会社 Procédé pour processus de montage, système de montage, dispositif de commande de remplacement, et machine de montage de composants
JP6561317B2 (ja) * 2016-06-01 2019-08-21 パナソニックＩｐマネジメント株式会社 部品実装システム
NL1042075B1 (nl) * 2016-09-26 2018-04-04 Wanninkhof Holding B V Werkwijze voor het plaatsen van een component op een substraat alsmede een inrichting voor het uitvoeren van een dergelijke werkwijze.
EP3595993A1 (fr) * 2017-03-17 2020-01-22 Berkshire Grey, Inc. Systèmes et procédés de traitement d'objets comprenant un système de portique linéaire

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1161391B (it) * 1978-03-30 1987-03-18 Longinotti Enrico Perfezionamento nelle apparecchiature di movimentazione di mattonelle o simili con l'usilio di vassoi su cui le mattonelle sono deposte per la stagionatura
JPS60171799A (ja) * 1984-02-17 1985-09-05 松下電器産業株式会社 電子部品自動装着装置
JPH081982B2 (ja) * 1985-04-17 1996-01-10 株式会社日立製作所 電子部品搭載方法及び装置
US4808059A (en) * 1986-07-15 1989-02-28 Peak Systems, Inc. Apparatus and method for transferring workpieces
US4914808A (en) * 1987-10-16 1990-04-10 Sanyo Electric Co., Ltd Automatic electronic parts mounting apparatus for repeatedly mounting in forward and reverse sequences
CA1320005C (fr) * 1988-06-16 1993-07-06 Kotaro Harigane Dispositif de montage d'element electronique
US5143253A (en) * 1988-09-02 1992-09-01 Tdk Corporation Chip packaging means and supply mechanism for supplying chips by using the chip packaging means
JPH02103015U (fr) * 1989-02-03 1990-08-16
EP0391707A1 (fr) * 1989-04-05 1990-10-10 Sanyo Electric Co., Ltd. Appareil d'alimentation de composants
JPH07100265B2 (ja) * 1989-04-27 1995-11-01 松下電器産業株式会社 部品装着装置
KR910011112A (ko) * 1989-11-07 1991-06-29 이우에 사또시 부품 공급 시스템
FR2661310B1 (fr) * 1990-04-20 1996-08-23 Eurosoft Robotique Chargeur de composants pour machine de pose automatique de composants electroniques et procede de reperage et d'identification d'un tel chargeur.
JPH0448698A (ja) * 1990-06-14 1992-02-18 Sony Corp 電子部品取付装置

Also Published As

Publication number Publication date
GB2262516B (en) 1995-03-22
GB2262516A (en) 1993-06-23
GB9214195D0 (en) 1992-08-12
DE4222709A1 (de) 1993-06-24
US5319846A (en) 1994-06-14
FR2685604A1 (fr) 1993-06-25
KR970004507B1 (ko) 1997-03-28
KR930016001A (ko) 1993-07-24

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20060331