FR2611166B1 - Procede et appareil de serigraphie, notamment pour circuits imprimes - Google Patents

Procede et appareil de serigraphie, notamment pour circuits imprimes

Info

Publication number
FR2611166B1
FR2611166B1 FR888802161A FR8802161A FR2611166B1 FR 2611166 B1 FR2611166 B1 FR 2611166B1 FR 888802161 A FR888802161 A FR 888802161A FR 8802161 A FR8802161 A FR 8802161A FR 2611166 B1 FR2611166 B1 FR 2611166B1
Authority
FR
France
Prior art keywords
screen printing
printed circuits
printed
circuits
printing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR888802161A
Other languages
English (en)
Other versions
FR2611166A1 (fr
Inventor
Tetsuo Takahashi
Akio Sasaki
Kunio Mogi
Hajime Shimazaki
Masakazu Hasegawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP62037900A external-priority patent/JPS63205234A/ja
Priority claimed from JP62037899A external-priority patent/JPS63205235A/ja
Priority claimed from JP62040149A external-priority patent/JPH0624840B2/ja
Application filed by TDK Corp filed Critical TDK Corp
Publication of FR2611166A1 publication Critical patent/FR2611166A1/fr
Application granted granted Critical
Publication of FR2611166B1 publication Critical patent/FR2611166B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J15/00—Devices or arrangements of selective printing mechanisms, e.g. ink-jet printers or thermal printers, specially adapted for supporting or handling copy material in continuous form, e.g. webs
    • B41J15/04—Supporting, feeding, or guiding devices; Mountings for web rolls or spindles
    • B41J15/08—Supporting, feeding, or guiding devices; Mountings for web rolls or spindles characterised by being applied to printers having transversely- moving carriages
    • B41J15/14—Supporting, feeding, or guiding devices; Mountings for web rolls or spindles characterised by being applied to printers having transversely- moving carriages and detached from the carriage
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/08—Machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/08—Machines
    • B41F15/0804—Machines for printing sheets
    • B41F15/0813—Machines for printing sheets with flat screens
    • B41F15/0818—Machines for printing sheets with flat screens with a stationary screen and a moving squeegee
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/14—Details
    • B41F15/34—Screens, Frames; Holders therefor
    • B41F15/36—Screens, Frames; Holders therefor flat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00—Inking and printing with a printer's forme
    • B41M1/12—Stencil printing; Silk-screen printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41P—INDEXING SCHEME RELATING TO PRINTING, LINING MACHINES, TYPEWRITERS, AND TO STAMPS
    • B41P2215/00—Screen printing machines
    • B41P2215/10—Screen printing machines characterised by their constructional features
    • B41P2215/14—Devices or methods for reducing snap effect
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0139—Blade or squeegee, e.g. for screen printing or filling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Screen Printers (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
FR888802161A 1987-02-23 1988-02-23 Procede et appareil de serigraphie, notamment pour circuits imprimes Expired - Fee Related FR2611166B1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP62037900A JPS63205234A (ja) 1987-02-23 1987-02-23 スクリ−ン印刷法及び装置
JP62037899A JPS63205235A (ja) 1987-02-23 1987-02-23 スクリーン印刷装置
JP62040149A JPH0624840B2 (ja) 1987-02-25 1987-02-25 スクリ−ン印刷装置における版合わせ方法

Publications (2)

Publication Number Publication Date
FR2611166A1 FR2611166A1 (fr) 1988-08-26
FR2611166B1 true FR2611166B1 (fr) 1992-01-24

Family

ID=27289636

Family Applications (1)

Application Number Title Priority Date Filing Date
FR888802161A Expired - Fee Related FR2611166B1 (fr) 1987-02-23 1988-02-23 Procede et appareil de serigraphie, notamment pour circuits imprimes

Country Status (5)

Country Link
US (2) US4893556A (fr)
KR (1) KR930007621B1 (fr)
DE (2) DE3805363A1 (fr)
FR (1) FR2611166B1 (fr)
GB (1) GB2202795B (fr)

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DE3928527A1 (de) * 1989-08-29 1991-03-14 Ind Siebdruck Systeme Neckarwe Flachbett-siebdruckmaschine zum bedrucken einer elektrischen leiterplatte
DE4011223A1 (de) * 1990-04-06 1990-09-13 Apt Automation U Produktionste Schablonendruckvorrichtung
US5174201A (en) * 1991-06-07 1992-12-29 International Business Machines Corporation Thick film mask separation detection system
US5339739A (en) * 1993-03-03 1994-08-23 Charles Di Pietro Emulsion coating apparatus
US5681387A (en) * 1993-04-30 1997-10-28 Jabil Circuit Company Segmented squeegee blade
US5847689A (en) * 1993-10-22 1998-12-08 Elliot; Daniel J. Apparatus and method for registering silk screens
US5806424A (en) * 1993-10-22 1998-09-15 Elliot; Daniel J. Apparatus and method for registering silk screens
DE4342303C2 (de) * 1993-12-11 1995-12-14 Isele Herbert Schablonen- bzw. Siebdruckanlage mit rahmenlosem Schablonen- bzw. Siebspannsystem und geschlossenem Rakelkopf
JPH07164614A (ja) * 1993-12-16 1995-06-27 Matsushita Electric Ind Co Ltd スクリーン印刷装置
WO1996005059A1 (fr) * 1994-08-12 1996-02-22 F. Xaver Leipold Gmbh & Co. Kg Machine d'impression serigraphique ou a pochoir
DE4444189C2 (de) * 1994-08-12 1999-09-09 Leipold Xaver F Gmbh & Co Kg Durch- oder Siebdruckmaschine
WO1996005915A1 (fr) * 1994-08-22 1996-02-29 Charles Dipietro Appareil applicateur d'emulsion
US5988856A (en) * 1994-08-31 1999-11-23 Massachusetts Institute Of Technology Apparatus for real-time estimation of printing medium properties and method for the use thereof
US5483884A (en) * 1994-10-31 1996-01-16 At&T Corp. Method and apparatus for setting up a stencil printer
US5553538A (en) * 1995-01-30 1996-09-10 Motorola, Inc. Method and apparatus for stencil printing printed circuit boards
GB2304630B (en) * 1995-08-31 1998-05-20 Tani Denki Kogyo Kk Squeegee arrangement for screen printing
JP2896343B2 (ja) * 1996-05-14 1999-05-31 谷電機工業株式会社 印刷用スキージー装置
DE69737281T2 (de) * 1996-12-10 2007-12-20 Matsushita Electric Industrial Co., Ltd., Kadoma Vorrichtung und Verfahren zum Drucken von Lötpaste
US5996487A (en) * 1997-04-11 1999-12-07 Matsushita Electric Industrial Co., Ltd. Solder paste screen printing apparatus and solder paste screen printing method
DE19724829C2 (de) * 1997-06-12 1999-03-25 Sekurit Saint Gobain Deutsch Siebdruckautomat zum Bedrucken von Glasscheiben
JP2000263752A (ja) * 1999-01-11 2000-09-26 Micro Tekku Kk スクリーン印刷機及びスクリーン印刷方法
GB2367034B (en) * 2000-07-18 2004-06-09 Matsushita Electric Ind Co Ltd Screen printing apparatus and method of the same
JP3721982B2 (ja) 2000-12-04 2005-11-30 松下電器産業株式会社 回路形成基板の製造方法および回路形成基板の製造装置
JPWO2002055304A1 (ja) * 2001-01-16 2004-05-13 粕谷　普烈 スクリーン印刷用スクリーン、スクリーン版、スクリーン枠、スクリーンの貼り合せ方法、スクリーンの張設方法、絵画用キャンバス、宣伝用シート及び平面鏡
ES2635134T3 (es) 2002-05-02 2017-10-02 Asm Assembly Systems Weymouth Ltd Unidad de pantalla de impresión
DE10245635B4 (de) * 2002-09-30 2006-05-18 Osram Opto Semiconductors Gmbh Siebdruckvorrichtung und Siebdruckverfahren
JP2004351624A (ja) * 2003-05-27 2004-12-16 Matsushita Electric Ind Co Ltd クリーム半田のスクリーン印刷装置およびスクリーン印刷方法
US7806048B2 (en) * 2007-04-13 2010-10-05 Illinois Tool Works, Inc. Method and apparatus for calibrating print head pressure and applying an accurate print pressure during production
DE102007060916B3 (de) 2007-12-14 2009-06-25 Kba-Metronic Ag Vorrichtung und Verfahren zur Messung der Siebspannung des Siebgewebes in einem Siebrahmen
US20120227602A1 (en) * 2009-09-16 2012-09-13 Applied Materials, Inc. Cleaning Device for an Apparatus for Silk-Screen Printing on a Print Support
JP5582770B2 (ja) * 2009-11-30 2014-09-03 東海精機株式会社 スクリーン印刷機におけるスキージ平行調整装置及びスキージ平行調整方法
TW201223776A (en) * 2010-12-09 2012-06-16 Metal Ind Res & Dev Ct Printing apparatus with halftone strain detection and the halftone thereof
CN103171257B (zh) * 2011-12-23 2015-06-10 昆山允升吉光电科技有限公司 一种栅线互补结构的太阳能电池电极ab网板及其印刷方法
ITUD20120199A1 (it) * 2012-11-26 2014-05-27 Applied Materials Italia Srl Apparato e metodo di stampa su un substrato
DE102015205025B4 (de) 2014-03-26 2022-09-01 Koenig & Bauer Ag Verfahren zum Erzeugen der optimalen Anpresskraft einer Rakel an ein Drucksieb und eine hierfür geeignete Rotationssiebdruckmaschine
CN104608490A (zh) * 2015-01-27 2015-05-13 苏州恩欧西精密机械制造有限公司 一种刮刀行程控制系统
CN105269996A (zh) * 2015-11-11 2016-01-27 江苏劲嘉新型包装材料有限公司 大密度超细线条及复杂图案定位转移的复合印刷工艺
CN105564010B (zh) * 2015-12-31 2018-05-04 苏州恩欧西智能科技有限公司 一种防刮伤刮刀
CN106004136B (zh) 2016-05-18 2018-09-11 京东方科技集团股份有限公司 网版印刷方法及压印装置
WO2018197006A1 (fr) * 2017-04-28 2018-11-01 Applied Materials Italia S.R.L. Appareil d'impression par sérigraphie d'un matériau sur un substrat utilisé dans la fabrication d'une cellule solaire, appareil de production de cellule solaire et procédé d'impression d'écran d'un matériau sur un substrat utilisé dans la fabrication d'une cellule solaire
WO2018197007A1 (fr) * 2017-04-28 2018-11-01 Applied Materials Italia S.R.L. Appareil destiné à être utilisé dans la fabrication d'une cellule solaire, système de dépôt d'un matériau sur un substrat utilisé dans la fabrication d'une cellule solaire, et procédé de traitement d'un matériau de dépôt utilisé dans la fabrication d'une cellule solaire
CN110710001A (zh) * 2017-05-30 2020-01-17 应用材料意大利有限公司 用于制造太阳能电池的基板上的丝网印刷的设备、丝网装置、系统和方法
CN108501506B (zh) * 2018-03-15 2020-03-06 合肥京东方显示光源有限公司 一种网版和丝网印刷机

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IT209972Z2 (it) * 1987-02-20 1988-11-14 Argon Ind Mecc Srl Dispositivo di lettura ottica per il rilevamento dei segni di registro di un supporto di stampa e di un telaio di stampa.

Also Published As

Publication number Publication date
KR880009795A (ko) 1988-10-05
DE3805363A1 (de) 1988-09-01
KR930007621B1 (ko) 1993-08-14
DE3844824A1 (fr) 1991-12-12
GB2202795B (en) 1991-11-06
DE3805363C2 (fr) 1992-01-02
US5052291A (en) 1991-10-01
FR2611166A1 (fr) 1988-08-26
GB2202795A (en) 1988-10-05
GB8804199D0 (en) 1988-03-23
US4893556A (en) 1990-01-16

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