FR2503525A1 - Circuit imprime a support souple presentant un revetement protegeant les conducteurs imprimes - Google Patents
Circuit imprime a support souple presentant un revetement protegeant les conducteurs imprimes Download PDFInfo
- Publication number
- FR2503525A1 FR2503525A1 FR8106769A FR8106769A FR2503525A1 FR 2503525 A1 FR2503525 A1 FR 2503525A1 FR 8106769 A FR8106769 A FR 8106769A FR 8106769 A FR8106769 A FR 8106769A FR 2503525 A1 FR2503525 A1 FR 2503525A1
- Authority
- FR
- France
- Prior art keywords
- printed circuit
- varnish
- flexible
- flexible base
- polymer coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011248 coating agent Substances 0.000 title claims abstract description 4
- 238000000576 coating method Methods 0.000 title claims abstract description 4
- 229920000642 polymer Polymers 0.000 title 1
- 230000001681 protective effect Effects 0.000 title 1
- 239000002966 varnish Substances 0.000 claims abstract description 20
- DMYOHQBLOZMDLP-UHFFFAOYSA-N 1-[2-(2-hydroxy-3-piperidin-1-ylpropoxy)phenyl]-3-phenylpropan-1-one Chemical compound C1CCCCN1CC(O)COC1=CC=CC=C1C(=O)CCC1=CC=CC=C1 DMYOHQBLOZMDLP-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229920001079 Thiokol (polymer) Polymers 0.000 claims abstract description 4
- -1 acetyl-vinyl Chemical group 0.000 claims abstract description 3
- 150000004291 polyenes Chemical class 0.000 claims abstract description 3
- 229920006295 polythiol Polymers 0.000 claims abstract description 3
- 239000011253 protective coating Substances 0.000 claims abstract 2
- 239000004642 Polyimide Substances 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- 238000006116 polymerization reaction Methods 0.000 claims description 3
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 claims description 2
- 229920002554 vinyl polymer Polymers 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 abstract description 3
- 239000004020 conductor Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 2
- 230000001464 adherent effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/224—Anti-weld compositions; Braze stop-off compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
- H05K3/287—Photosensitive compositions
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR8106769A FR2503525A1 (fr) | 1981-04-03 | 1981-04-03 | Circuit imprime a support souple presentant un revetement protegeant les conducteurs imprimes |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR8106769A FR2503525A1 (fr) | 1981-04-03 | 1981-04-03 | Circuit imprime a support souple presentant un revetement protegeant les conducteurs imprimes |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2503525A1 true FR2503525A1 (fr) | 1982-10-08 |
| FR2503525B3 FR2503525B3 (enExample) | 1983-12-09 |
Family
ID=9257002
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR8106769A Granted FR2503525A1 (fr) | 1981-04-03 | 1981-04-03 | Circuit imprime a support souple presentant un revetement protegeant les conducteurs imprimes |
Country Status (1)
| Country | Link |
|---|---|
| FR (1) | FR2503525A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4873123A (en) * | 1986-10-06 | 1989-10-10 | International Business Machines Corporation | Flexible electrical connection and method of making same |
-
1981
- 1981-04-03 FR FR8106769A patent/FR2503525A1/fr active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4873123A (en) * | 1986-10-06 | 1989-10-10 | International Business Machines Corporation | Flexible electrical connection and method of making same |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2503525B3 (enExample) | 1983-12-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4081601A (en) | Bonding contact members to circuit boards | |
| US5291179A (en) | Printed circuit board | |
| EP0413335A3 (en) | Method of mutually connecting electrode terminals | |
| JP3365882B2 (ja) | 電子部品端子の半田上がり防止構造 | |
| KR950024376A (ko) | 기판에 단자 핀을 장착하는 장치 | |
| KR910017615A (ko) | 반도체 소자를 설치하는 방법 | |
| US4859263A (en) | Process for the manufacture of printed circuits | |
| US3499218A (en) | Multilayer circuit boards and methods of making the same | |
| NL8006693A (nl) | Elektrische schakeling omvattende inrichting en werkwijze voor het vervaardigen daarvan. | |
| FR2503525A1 (fr) | Circuit imprime a support souple presentant un revetement protegeant les conducteurs imprimes | |
| US4967042A (en) | System for enhancing current carrying capacity of printed wiring board | |
| US6246012B1 (en) | Electroplated conductive carbon fibers with adhesive | |
| FR2468279A1 (fr) | Procede de fabrication de plaques comportant au moins un circuit imprime | |
| JPS5937549B2 (ja) | ワイヤ−取付方法 | |
| JP2755520B2 (ja) | プリント配線板のスルーホール形成方法 | |
| JPS5834993A (ja) | 電子部品の取付方法 | |
| JP4786461B2 (ja) | 配線基板のコネクタ接続用端子の製造方法 | |
| JP3101396B2 (ja) | 基板の端子部構造 | |
| JP2000332373A5 (enExample) | ||
| JP2781890B2 (ja) | 電磁継電器のベースの製造方法 | |
| JPH07176841A (ja) | 配線板 | |
| JPH0613735A (ja) | プリント基板 | |
| JPS58115886A (ja) | プリント配線板の製造方法 | |
| JPH03220708A (ja) | 電子部品 | |
| KR930005352B1 (ko) | 인쇄회로기판(pcb)의 도금방법 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |