JP2000332373A5 - - Google Patents
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- Publication number
- JP2000332373A5 JP2000332373A5 JP1999140674A JP14067499A JP2000332373A5 JP 2000332373 A5 JP2000332373 A5 JP 2000332373A5 JP 1999140674 A JP1999140674 A JP 1999140674A JP 14067499 A JP14067499 A JP 14067499A JP 2000332373 A5 JP2000332373 A5 JP 2000332373A5
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- electrode
- component
- circuit board
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 description 26
- 229920005989 resin Polymers 0.000 description 26
- 239000000758 substrate Substances 0.000 description 22
- 229910052751 metal Inorganic materials 0.000 description 19
- 239000002184 metal Substances 0.000 description 19
- 239000000945 filler Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 229910052797 bismuth Inorganic materials 0.000 description 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- 239000011133 lead Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 239000011135 tin Substances 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11140674A JP2000332373A (ja) | 1999-05-20 | 1999-05-20 | 電子部品実装体およびその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11140674A JP2000332373A (ja) | 1999-05-20 | 1999-05-20 | 電子部品実装体およびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000332373A JP2000332373A (ja) | 2000-11-30 |
| JP2000332373A5 true JP2000332373A5 (enExample) | 2006-05-25 |
Family
ID=15274129
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11140674A Pending JP2000332373A (ja) | 1999-05-20 | 1999-05-20 | 電子部品実装体およびその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000332373A (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008270846A (ja) * | 2003-10-03 | 2008-11-06 | Fuji Electric Device Technology Co Ltd | 半導体装置の製造方法 |
| JP4591330B2 (ja) * | 2005-11-25 | 2010-12-01 | パナソニック株式会社 | 電子部品接続構造および電子部品接続方法 |
| CN102113423B (zh) * | 2008-09-29 | 2013-07-03 | 夏普株式会社 | 基板模块及其制造方法 |
| KR101332954B1 (ko) * | 2010-06-28 | 2013-11-25 | 성균관대학교산학협력단 | 전극봉을 이용한 회로기판 조립체 및 그 제조 방법 |
-
1999
- 1999-05-20 JP JP11140674A patent/JP2000332373A/ja active Pending
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