JP2000332373A - 電子部品実装体およびその製造方法 - Google Patents

電子部品実装体およびその製造方法

Info

Publication number
JP2000332373A
JP2000332373A JP11140674A JP14067499A JP2000332373A JP 2000332373 A JP2000332373 A JP 2000332373A JP 11140674 A JP11140674 A JP 11140674A JP 14067499 A JP14067499 A JP 14067499A JP 2000332373 A JP2000332373 A JP 2000332373A
Authority
JP
Japan
Prior art keywords
electronic component
electrode
component
circuit board
conductive resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11140674A
Other languages
English (en)
Japanese (ja)
Other versions
JP2000332373A5 (enExample
Inventor
Tsutomu Mitani
力 三谷
Hiroteru Takezawa
弘輝 竹沢
Minehiro Itagaki
峰広 板垣
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP11140674A priority Critical patent/JP2000332373A/ja
Publication of JP2000332373A publication Critical patent/JP2000332373A/ja
Publication of JP2000332373A5 publication Critical patent/JP2000332373A5/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP11140674A 1999-05-20 1999-05-20 電子部品実装体およびその製造方法 Pending JP2000332373A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11140674A JP2000332373A (ja) 1999-05-20 1999-05-20 電子部品実装体およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11140674A JP2000332373A (ja) 1999-05-20 1999-05-20 電子部品実装体およびその製造方法

Publications (2)

Publication Number Publication Date
JP2000332373A true JP2000332373A (ja) 2000-11-30
JP2000332373A5 JP2000332373A5 (enExample) 2006-05-25

Family

ID=15274129

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11140674A Pending JP2000332373A (ja) 1999-05-20 1999-05-20 電子部品実装体およびその製造方法

Country Status (1)

Country Link
JP (1) JP2000332373A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007149815A (ja) * 2005-11-25 2007-06-14 Matsushita Electric Ind Co Ltd 電子部品接続構造および電子部品接続方法
JP2008270846A (ja) * 2003-10-03 2008-11-06 Fuji Electric Device Technology Co Ltd 半導体装置の製造方法
WO2010035551A1 (ja) * 2008-09-29 2010-04-01 シャープ株式会社 基板モジュールおよびその製造方法
KR101332954B1 (ko) * 2010-06-28 2013-11-25 성균관대학교산학협력단 전극봉을 이용한 회로기판 조립체 및 그 제조 방법

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008270846A (ja) * 2003-10-03 2008-11-06 Fuji Electric Device Technology Co Ltd 半導体装置の製造方法
JP2007149815A (ja) * 2005-11-25 2007-06-14 Matsushita Electric Ind Co Ltd 電子部品接続構造および電子部品接続方法
US8148253B2 (en) 2005-11-25 2012-04-03 Panasonic Corporation Electronic component soldering structure and electronic component soldering method
KR101227025B1 (ko) * 2005-11-25 2013-01-28 파나소닉 주식회사 전자 부품 접속 구조 및 전자 부품 접속 방법
WO2010035551A1 (ja) * 2008-09-29 2010-04-01 シャープ株式会社 基板モジュールおよびその製造方法
JP5008767B2 (ja) * 2008-09-29 2012-08-22 シャープ株式会社 基板モジュールおよびその製造方法
US8450753B2 (en) 2008-09-29 2013-05-28 Sharp Kabushiki Kaisha Board module and method of manufacturing same
KR101332954B1 (ko) * 2010-06-28 2013-11-25 성균관대학교산학협력단 전극봉을 이용한 회로기판 조립체 및 그 제조 방법

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