FR2503525A1 - Printed circuit on a flexible base - having a protective polymer coating - Google Patents
Printed circuit on a flexible base - having a protective polymer coating Download PDFInfo
- Publication number
- FR2503525A1 FR2503525A1 FR8106769A FR8106769A FR2503525A1 FR 2503525 A1 FR2503525 A1 FR 2503525A1 FR 8106769 A FR8106769 A FR 8106769A FR 8106769 A FR8106769 A FR 8106769A FR 2503525 A1 FR2503525 A1 FR 2503525A1
- Authority
- FR
- France
- Prior art keywords
- printed circuit
- varnish
- flexible
- flexible base
- polymer coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/224—Anti-weld compositions; Braze stop-off compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
- H05K3/287—Photosensitive compositions
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
Description
CIRCUIT IMPRIME A SUPPORT SOUPLE PRESENTANT
UN REVETEMENT PROTEGEANT LES CONDUCTEURS IMPRIMES,
L'invention est relative à un circuit imprimé souple.PRINTED CIRCUIT WITH FLEXIBLE SUPPORT
A COATING PROTECTING THE PRINTED CONDUCTORS,
The invention relates to a flexible printed circuit.
Par circuit imprimé souple on entend un circuit imprimé dont la plaquette isolante formant son support est en une matière souple, notamment le polyimide connu sous la marque Kapton, par opposition aux circuits imprimés dont le support est une plaquette rigide
Les composants électroniques ou électriques à relier par un circuit imprimé se terminent en général par des fils conducteurs introduits dans des trous de la plaquette et soudés à une pellicule de cuivre, ou piste, aboutissant à ce trou afin que soit assurée une connexion électrique entre cette piste et le composant et pour fixer ce composant à la plaquette.By flexible printed circuit is meant a printed circuit whose insulating plate forming its support is made of a flexible material, in particular the polyimide known under the brand Kapton, as opposed to printed circuits whose support is a rigid plate
The electronic or electrical components to be connected by a printed circuit generally end in conductive wires introduced into holes in the wafer and soldered to a copper film, or track, leading to this hole so that an electrical connection is ensured between this track and component and to attach that component to the board.
Au cours de l'opération de soudage, la soudure peut déborder des zones prévues, ce qui risque de provoquer des courts-circuits indésirables entre les pistes de cuivre. C'est pourquoi, jusqu'a' présent, préalablement au soudage, on colle sur la plaquette souple une feuille de matière plastique isolante dans laquelle sont décou- pées des ouvertures correspondant aux zones à souder. During the soldering operation, the solder may extend beyond the intended areas, which may cause undesirable short circuits between the copper tracks. This is why, until now, prior to welding, a sheet of insulating plastic material has been glued onto the flexible wafer, in which openings corresponding to the zones to be welded are cut.
La pellicule isolante reste à demeure sur le circuit imprimé souple et constitue ensuite une protection permanente de ce dernier. The insulating film remains permanently on the flexible printed circuit and then constitutes permanent protection of the latter.
Cette technique de protection à l'aide d'une feuille isolante des circuits imprimés souples est complexe et onéreuse. This protection technique using an insulating sheet of flexible printed circuits is complex and expensive.
L'invention remédie à cet inconvénient. The invention overcomes this drawback.
Elle est caractérisée en ce que la protection du circuit imprimé souple est assurée par un vernis adhérant au support souple et restant souple après polymérisation. Ce vernis est de préférence photodurcissable et comprend un polythiol et un polyène provenant d'un vinyl-acétal et/ou le vernis vendu sous la référence SM 19 par la Société THIOKOL Corporation. It is characterized in that the protection of the flexible printed circuit is ensured by a varnish adhering to the flexible support and remaining flexible after polymerization. This varnish is preferably photocurable and comprises a polythiol and a polyene originating from a vinyl acetal and / or the varnish sold under the reference SM 19 by the company THIOKOL Corporation.
La protection du circuit imprimé souple est ainsi beaucoup plus simple et moins onéreuse qu'avec la technique antérieurement connue car l'application d'un vernis est une operazon qu j'-=ffectile de façon particulièrement simple. The protection of the flexible printed circuit is thus much simpler and less expensive than with the previously known technique because the application of a varnish is an operazon that I - = ffectile in a particularly simple way.
L'invention fait appel à une technique courante pour protéger les circuits imprimés à support rigide. Mais les contraintes imposées à un vernis recouvrant un circuit imprimé souple sont beaucoup plus sévères que celles imposées à un vernis recouvrant une plaquette rigide. C'est pourquoi les fournisseurs de plaquettes souples de circuits imprimés déconseillent l'utilisation de vernis car ces circuits imprimés souples étant généralement soumis à des flexions accentuées ou fréquentes, le vernis risque de s'écailler. The invention uses a common technique to protect printed circuits with rigid support. However, the constraints imposed on a varnish covering a flexible printed circuit are much more severe than those imposed on a varnish covering a rigid wafer. This is why the suppliers of flexible printed circuit boards do not recommend the use of varnish because these flexible printed circuits are generally subjected to accentuated or frequent bending, the varnish is likely to flake.
Or, on a constaté qu'au contraire, moyennant un choix convenable du vernis, un circuit imprimé souple pouvait être protégé à demeure par application d'un tel vernis. However, it has been found that, on the contrary, by means of a suitable choice of varnish, a flexible printed circuit could be permanently protected by application of such a varnish.
La figure unique montre un circuit imprimé souple selon l'invention. The single figure shows a flexible printed circuit according to the invention.
Ce circuit imprimé comporte un support 10 constitué d'une feuille souple en polyimide de marque Kapton et dont la forme est, dans l'exemple, rectangulaire et sur laquelle ont été formées des pistes conductrices 11 assurant une liaison entre des composants 12, 13, tels qu'une résistance et un condensateur, et des contacts de sortie 14 le long d'un bord étroit 15 de la feuille 10. This printed circuit includes a support 10 consisting of a flexible polyimide sheet of the Kapton brand and the shape of which is, in the example, rectangular and on which conductive tracks 11 have been formed ensuring a connection between components 12, 13, such as a resistor and a capacitor, and output contacts 14 along a narrow edge 15 of the sheet 10.
Préalablement à l'opération de soudage des conducteurs sortant des composants 12 et 13 aux pistes 11 correspondantes et, éventuellement, de soudage de conducteurs sur les contacts 14, on applique le vernis 16 de référence SM 19 de la Société THIOKOL sur la feuille 10 en dehors de la zone comprenant les contacts 14 et les autres extrémités des pistes 11 sur lesquelles peut etre déposée la soudure pour la connexion des composants 12 et 13. Prior to the welding operation of the conductors leaving the components 12 and 13 to the corresponding tracks 11 and, optionally, of the welding of the conductors on the contacts 14, the varnish 16 of reference SM 19 from the company THIOKOL is applied to the sheet 10 in outside the zone comprising the contacts 14 and the other ends of the tracks 11 on which the solder can be deposited for the connection of the components 12 and 13.
Ce vernis est ensuite polymérisé par irradiation à la lumière ultraviolette. This varnish is then polymerized by irradiation with ultraviolet light.
Après polymérisation le vernis constitue une protection efficace du circuit imprimé souple et reste adhérant sans s'écailler même après une utilisation de longue durée de ce circuit imprimé souple. L'invention surmonte ainsi le préjugé courant, répandu notamment parmi les fabricants de feuilles de circuits imprimés souples, selon lequel un vernis ne pouvait être appliqué de façon efficace sur un tel circuit imprimé souple. After polymerization, the varnish provides effective protection of the flexible printed circuit and remains adherent without flaking even after long-term use of this flexible printed circuit. The invention thus overcomes the common prejudice, widespread in particular among the manufacturers of sheets of flexible printed circuits, according to which a varnish could not be applied effectively on such a flexible printed circuit.
Claims (3)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR8106769A FR2503525A1 (en) | 1981-04-03 | 1981-04-03 | Printed circuit on a flexible base - having a protective polymer coating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR8106769A FR2503525A1 (en) | 1981-04-03 | 1981-04-03 | Printed circuit on a flexible base - having a protective polymer coating |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2503525A1 true FR2503525A1 (en) | 1982-10-08 |
| FR2503525B3 FR2503525B3 (en) | 1983-12-09 |
Family
ID=9257002
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR8106769A Granted FR2503525A1 (en) | 1981-04-03 | 1981-04-03 | Printed circuit on a flexible base - having a protective polymer coating |
Country Status (1)
| Country | Link |
|---|---|
| FR (1) | FR2503525A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4873123A (en) * | 1986-10-06 | 1989-10-10 | International Business Machines Corporation | Flexible electrical connection and method of making same |
-
1981
- 1981-04-03 FR FR8106769A patent/FR2503525A1/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4873123A (en) * | 1986-10-06 | 1989-10-10 | International Business Machines Corporation | Flexible electrical connection and method of making same |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2503525B3 (en) | 1983-12-09 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |