FR2499770B1 - Procede de production de transducteurs de pression a haute temperature, dispositif a utiliser comme transducteurs de pression et semi-conducteurs et structure a utiliser comme semi-conducteur - Google Patents
Procede de production de transducteurs de pression a haute temperature, dispositif a utiliser comme transducteurs de pression et semi-conducteurs et structure a utiliser comme semi-conducteurInfo
- Publication number
- FR2499770B1 FR2499770B1 FR828202223A FR8202223A FR2499770B1 FR 2499770 B1 FR2499770 B1 FR 2499770B1 FR 828202223 A FR828202223 A FR 828202223A FR 8202223 A FR8202223 A FR 8202223A FR 2499770 B1 FR2499770 B1 FR 2499770B1
- Authority
- FR
- France
- Prior art keywords
- pressure transducers
- semiconductors
- semiconductor
- high temperature
- producing high
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D48/00—Individual devices not covered by groups H10D1/00 - H10D44/00
- H10D48/50—Devices controlled by mechanical forces, e.g. pressure
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49082—Resistor making
- Y10T29/49103—Strain gauge making
Landscapes
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Fluid Pressure (AREA)
- Pressure Sensors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US06/233,728 US4400869A (en) | 1981-02-12 | 1981-02-12 | Process for producing high temperature pressure transducers and semiconductors |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2499770A1 FR2499770A1 (fr) | 1982-08-13 |
| FR2499770B1 true FR2499770B1 (fr) | 1985-07-26 |
Family
ID=22878456
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR828202223A Expired FR2499770B1 (fr) | 1981-02-12 | 1982-02-11 | Procede de production de transducteurs de pression a haute temperature, dispositif a utiliser comme transducteurs de pression et semi-conducteurs et structure a utiliser comme semi-conducteur |
| FR8212816A Expired FR2513441B1 (fr) | 1981-02-12 | 1982-07-22 | Dispositifs transducteurs de pression et semi-conducteurs miniaturises pour temperatures elevees |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR8212816A Expired FR2513441B1 (fr) | 1981-02-12 | 1982-07-22 | Dispositifs transducteurs de pression et semi-conducteurs miniaturises pour temperatures elevees |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US4400869A (enExample) |
| JP (1) | JPS57148378A (enExample) |
| DE (2) | DE3204602A1 (enExample) |
| FR (2) | FR2499770B1 (enExample) |
| GB (1) | GB2093272B (enExample) |
Families Citing this family (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58138033A (ja) * | 1982-02-10 | 1983-08-16 | Toshiba Corp | 半導体基板及び半導体装置の製造方法 |
| US4498229A (en) * | 1982-10-04 | 1985-02-12 | Becton, Dickinson And Company | Piezoresistive transducer |
| US4467656A (en) * | 1983-03-07 | 1984-08-28 | Kulite Semiconductor Products, Inc. | Transducer apparatus employing convoluted semiconductor diaphragms |
| JPS60253279A (ja) * | 1984-05-29 | 1985-12-13 | Toyota Central Res & Dev Lab Inc | 半導体歪み測定器 |
| CA1251514A (en) * | 1985-02-20 | 1989-03-21 | Tadashi Sakai | Ion selective field effect transistor sensor |
| US4739298A (en) * | 1985-02-28 | 1988-04-19 | Kulite Semiconductor Products, Inc. | High temperature transducers and methods of manufacturing |
| GB2174241A (en) * | 1985-04-25 | 1986-10-29 | Transamerica Delaval Inc | Transducer devices |
| US4782028A (en) * | 1987-08-27 | 1988-11-01 | Santa Barbara Research Center | Process methodology for two-sided fabrication of devices on thinned silicon |
| US4904978A (en) * | 1988-04-29 | 1990-02-27 | Solartron Electronics, Inc. | Mechanical sensor for high temperature environments |
| JPH0748564B2 (ja) * | 1988-05-07 | 1995-05-24 | シャープ株式会社 | シリコンマイクロセンサ |
| US5310610A (en) * | 1988-05-07 | 1994-05-10 | Sharp Kabushiki Kaisha | Silicon micro sensor and manufacturing method therefor |
| DE3918769C2 (de) * | 1988-06-08 | 2001-12-13 | Denso Corp | Halbleiterdrucksensor und Verfahren zu seiner Herstellung |
| US5155061A (en) * | 1991-06-03 | 1992-10-13 | Allied-Signal Inc. | Method for fabricating a silicon pressure sensor incorporating silicon-on-insulator structures |
| JPH05190872A (ja) * | 1992-01-16 | 1993-07-30 | Oki Electric Ind Co Ltd | 半導体圧力センサおよびその製造方法 |
| JP3300060B2 (ja) * | 1992-10-22 | 2002-07-08 | キヤノン株式会社 | 加速度センサー及びその製造方法 |
| US7400042B2 (en) * | 2005-05-03 | 2008-07-15 | Rosemount Aerospace Inc. | Substrate with adhesive bonding metallization with diffusion barrier |
| US7538401B2 (en) | 2005-05-03 | 2009-05-26 | Rosemount Aerospace Inc. | Transducer for use in harsh environments |
| US7628309B1 (en) | 2005-05-03 | 2009-12-08 | Rosemount Aerospace Inc. | Transient liquid phase eutectic bonding |
| US20070013014A1 (en) * | 2005-05-03 | 2007-01-18 | Shuwen Guo | High temperature resistant solid state pressure sensor |
| US20080277747A1 (en) * | 2007-05-08 | 2008-11-13 | Nazir Ahmad | MEMS device support structure for sensor packaging |
| US8643127B2 (en) * | 2008-08-21 | 2014-02-04 | S3C, Inc. | Sensor device packaging |
| US7775119B1 (en) | 2009-03-03 | 2010-08-17 | S3C, Inc. | Media-compatible electrically isolated pressure sensor for high temperature applications |
| RU2507491C1 (ru) * | 2012-07-20 | 2014-02-20 | Российская Федерация, От Имени Которой Выступает Министерство Промышленности И Торговли Российской Федерации | Высокотемпературный полупроводниковый преобразователь давления |
| WO2018092130A1 (en) * | 2016-11-17 | 2018-05-24 | Ezmems Ltd. | High resistance strain gauges and methods of production thereof |
| CN109411427B (zh) * | 2018-09-06 | 2020-06-09 | 中国电子科技集团公司第二十九研究所 | 一种微流道散热器及其制造方法 |
| US10770206B1 (en) * | 2019-04-08 | 2020-09-08 | Government Of The United States As Represented By The Secretary Of The Air Force | System and method for fabricating a strain sensing device directly on a structure |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3713068A (en) * | 1971-06-07 | 1973-01-23 | Itt | Bonded assemblies and methods of making the same |
| US3800264A (en) * | 1972-03-14 | 1974-03-26 | Kulite Semiconductor Products | High temperature transducers and housing including fabrication methods |
| US3868719A (en) * | 1973-04-02 | 1975-02-25 | Kulite Semiconductor Products | Thin ribbon-like glass backed transducers |
| US3922705A (en) * | 1973-06-04 | 1975-11-25 | Gen Electric | Dielectrically isolated integral silicon diaphram or other semiconductor product |
| US3858150A (en) * | 1973-06-21 | 1974-12-31 | Motorola Inc | Polycrystalline silicon pressure sensor |
| US3873956A (en) * | 1973-09-04 | 1975-03-25 | Kulite Semiconductor Products | Integrated transducer assemblies |
| US4065970A (en) * | 1976-05-17 | 1978-01-03 | Becton, Dickinson Electronics Company | Diffused semiconductor pressure gauge |
| US4204185A (en) * | 1977-10-13 | 1980-05-20 | Kulite Semiconductor Products, Inc. | Integral transducer assemblies employing thin homogeneous diaphragms |
-
1981
- 1981-02-12 US US06/233,728 patent/US4400869A/en not_active Expired - Fee Related
-
1982
- 1982-01-04 GB GB8200061A patent/GB2093272B/en not_active Expired
- 1982-01-19 JP JP57006726A patent/JPS57148378A/ja active Pending
- 1982-02-10 DE DE19823204602 patent/DE3204602A1/de active Granted
- 1982-02-10 DE DE3249594A patent/DE3249594C2/de not_active Expired - Lifetime
- 1982-02-11 FR FR828202223A patent/FR2499770B1/fr not_active Expired
- 1982-07-22 FR FR8212816A patent/FR2513441B1/fr not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| DE3204602C2 (enExample) | 1988-03-10 |
| US4400869A (en) | 1983-08-30 |
| GB2093272A (en) | 1982-08-25 |
| FR2513441B1 (fr) | 1985-08-23 |
| DE3249594C2 (enExample) | 1990-01-18 |
| FR2499770A1 (fr) | 1982-08-13 |
| GB2093272B (en) | 1985-04-11 |
| DE3204602A1 (de) | 1982-09-09 |
| FR2513441A1 (fr) | 1983-03-25 |
| JPS57148378A (en) | 1982-09-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| TP | Transmission of property | ||
| ST | Notification of lapse |