GB2174241A - Transducer devices - Google Patents
Transducer devices Download PDFInfo
- Publication number
- GB2174241A GB2174241A GB08510558A GB8510558A GB2174241A GB 2174241 A GB2174241 A GB 2174241A GB 08510558 A GB08510558 A GB 08510558A GB 8510558 A GB8510558 A GB 8510558A GB 2174241 A GB2174241 A GB 2174241A
- Authority
- GB
- United Kingdom
- Prior art keywords
- elements
- substrate
- strain
- transducer
- devices
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/84—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being other than a semiconductor body, e.g. being an insulating body
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
- G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
- G01L1/2287—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges constructional details of the strain gauges
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
- G01L9/0052—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
- G01L9/0052—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements
- G01L9/0055—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements bonded on a diaphragm
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
- G01L9/006—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of metallic strain gauges fixed to an element other than the pressure transmitting diaphragm
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Measuring Fluid Pressure (AREA)
- Pressure Sensors (AREA)
Abstract
A method of making transducer devices is described which comprises providing on one surface of a supporting substrate an array of electrically strain-sensitive elements 16 and dividing the supporting substrate into portions 22 bearing strain-sensitive elements to provide a plurality of transducer devices. A strain measuring device is also described which embodies a transducer device made according to the method. <IMAGE>
Description
SPECIFICATION
Transducer devices
This invention relates to transducer devices and concerns devices comprising an electrically strain-sensitive film element formed on a support. In such devices, when the support is deformed the element is subjected to strain, causing a change in the electrical properties of the element. In one type of device the strainsensitive element comprises a length of conducting material of which the electrical resistance is altered by the strain; in another type of device the strain-sensitive element is piezoelectric so that an electrical potential is generated across it by the strain. In both cases the element is connected to an electric circuit to detect the change in electrical property and deduce therefrom the mode and/or magnitude of the deformation to which the support is subjected.
Transducer devices of this type are used in large numbers for many purposes, including measuring the deformation of the diaphragm in diaphragm pressure gauges, and they are commonly very small, typically having dimensions of 1 mm X 10 mm in the case of beams for attachment to separate diaphragms, or a 3 mm to 10 mm circle or square in the case of diaphragms which directly support the strain sensitive elements. The strain-sensitive elements applied to the support in the form of a thin film are commonly of quite complex shape and are made on the support by a complex series of steps, including individual alignment of the elements with photographic and shim masks, which may be troublesome and expensive.
Another difficulty in the case of beams for attachment to separate diaphragms is that the support of such a transducer device has to be rigidly and strongly connected to the member, such as a diaphragm of which the deformation or movement is to be detected. This connection is conveniently achieved by soldering.
However, when the support is made of a material, such as stainless steel, which is not readily wetted by the solders which are commonly used for this purpose, obtaining a satisfactory soldered connection becomes difficult.
The present invention is intended to provide a method of making such transducer devices which enables the devices to be made in large numbers at relatively low cost. By means of the invention it is possible to make transducer beam devices readily solderable to a member with which they are to be used.
According to one aspect of the invention, a method of making transducer devices comprises providing on one surface of a supporting substrate an array of electrically strain-sensitive elements and dividing the supporting substrate into portions bearing strain-sensitive elements to provide a plurality of transducer devices.
The substrate may be of metal, and may comprise a thin wafer of a metal such as stainless steel bearing on its surface a layer of electrically insulating material on which the
strain-sensitive elements are formed. The elements may be formed by depositing a film of electrically strain-sensitive material on the surface and photoengraving and etching the film to form the elements of the required shape.
The strain-sensitive elements may comprise areas of material having an electrical resistance which varies according to the strain imposed on the elements so that measurement of the resistance or change in resistance allows the magnitude of the strain to be deduced; typically four resistors could be provided and interconnected to form a four-arm bridge. In another device, the strain-sensitive elements may be piezoelectric and the strain deduced from the electric potential set up in the elements on deformation.
The surface of the substrate may be provided with stress-concentrating grooves to accentuate the strain imposed on the elements on deformation of the substrate.
The beam transducer devices made by the method of the invention are generally used for detecting displacement or deformation of a deformable member, such as a diaphragm, to which they are attached and for this purpose they have to be rigidly attached to the member. The device may be attached to a support, such as a diaphragm, by various means including soldering, brazing, welding, diffusion, electrostatic or mallory bonding. The device may often be attached by soldering, using for example a hard silver or gold eutectic alloy solder, and it is then necessary for the solder to wet the material of the substrate to give a satisfactory bond. However, some substrate materials which are desirable for other reasons, notably stainless steel, are not wetted by the solders normally used.
The diaphragm transducer devices made by the method of the invention are generally used for detecting strain in the device itself. In this case the attachment of the edges of the diaphragm to a supporting member must necessarily be done in a dimensionally stable manner and may similarly use, for example, a hard silver or gold eutectic alloy solder.
One embodiment of the invention allows the surface of such a substrate material to be rendered wettable by the solder. In this embodiment, before division of the substrate, portions of the surface of the substrate remote from (that is, on the other side from) the deposited elements are electroplated with a suitable metal or alloy. This may be done by coating the surface of the substrate bearing the strain-sensitive elements with an electrically insulating layer such as a wax, providing the remote surface of the substrate with protective strips having voids therebetween at which the sheet is exposed, electroplating the assembly so formed to deposit metal in the voids, and removing the protective layer and protective strips.
In order to divide the substrate bearing the strainsensitive elements into individual devices the substrate may be mounted on a wax layer on its side remote from the elements and cut into individual elements, for example by means of a dicing or slitting saw or by spark erosion, followed by removal of the wax.
A method of making a transducer device according to one embodiment of the invention and one method of using the device will now be described by way of example with reference to the accompanying drawings in which:
Figure 1 shows a sheet for use in making the devices,
Figure 2 is a side view of the sheet of
Figure 1,
Figure 3 shows part of the sheet of Fig. 1 bearing a strain-sensitive element,
Figures 4-9 show schematically a method of electroplating and dividing the sheet, and
Figures 10-13 show a pressure port provided with a transducer device.
Figures 14 and 15 show sheets similar to that of Figure 1 with cutting patterns illustrated for making transducer elements in the form of hexagonal and circular diaphragm respectively.
In the drawings, the various Figures are not drawn to the same scale.
Referring to the drawings, a supporting substrate in the form of a sheet for making transducer elements comprises a square stainless steel wafer 10 of 0.3 mm thickness and 60 mm side. One side of the wafer is polished to provide a flat surface 12a having a surface texture of the order of 100 nm and this surface is coated with a film 14 of electrically insulating material such as silicon dioxide. On this insulating film there are formed an array comprising a plurality of electrically strain-sensitive elements 16 as shown in Figure 3. Each element comprises four resistive elements 1 6a to 16d interconnected by a length of electrically conducting material 18, the electrical resistance of said elements 16a to 16d altering when the material is subjected to mechanical strain.Terminal portions 20 are provided at intervals along the length of the conductor 18 whereby the resistive elements 16a to 16d can be connected as a strain-gauge bridge, for example. Each element comprises a thin layer of conducting material disposed on the coated surface. The elements may be formed by depositing a continuous layer of the strain-sensitive material on the entire surface of the sheet, photoengraving the material to the desired pattern and etching the photoengraved layer to produce an array of elements of the configuration shown in Figure 3. This process may use a cermet or polysilicon material for forming the element.
The elements are 360 in number and distributed regularly over the wafer so that each is enclosed in a strip 22 of dimensions 1 mm X 10 mm. After formation of the strain-sensitive elements the wafer may be cut into individual strips 22 to provide the transducer elements.
When the transducer elements are used to detect displacement of deformation of a member to which they are attached, deformation of the strip 22 causes mechanical strain in element 16 so that its electrical resistance alters. The change in resistance may be measured by suitable devices attached to terminals 20 to provide a measure of the magnitude of the deformation of strip 22.
In order to increase the sensitivity of the transducer element the surface 12b of the wafer 10 may be provided with slots 24 positioned so that, after formation of elements 16 and division of the wafer into strips 22, the stresses to which the strips are subjected during deformation are concentrated at the grooves 24 and the sensitivity of the transducer is increased.
In use the transducer elements are normally rigidly attached by their rear surfaces 15 to members whose displacement is to be measured and this rigid connection may generally be achieved by soldering. However, the solders which are suitable for this purpose, such as gold and silver alloys, are not generally satisfactory when applied to stainless steel as they do not wet the steel satisfactorily. It is, however, possible to apply such solders, or a metal to which the liquid solders may be applied, to steel by an electroplating method and a method of doing so will now be described with reference to Figures 4 to 9.
After formation of the electrically strain-sensitive elements 16 on the wafer 10 but before division of the wafer into strips, the reverse side 15 of the wafer 10 is provided with a coating of photoresist material 26, which does not receive electroplated metal and the coating 26 is provided with stripe-shaped voids 28 corresponding to the areas of the wafer to be electroplated (Figure 4). Coating 26 with the required voids may be made by a photoresist method. The surface 12a of the wafer bearing elements 16 is then coated with an electrically insulating wax layer 30 and the wax layer is placed in contact with a glass sheet 32 (Figure 5). The sandwich thus formed is immersed in an electroplating bath of known type and an electric current is passed between the wafer 10 and the solution, using the wafer as an electrode, to carry out electroplating. The glass sheet 32 and wax layer 30, which form an impervious insulator, prevent electrodeposition taking place on the surface 12a of the wafer carrying elements and the coating 26 prevents electrodeposition on the parts of surface 15 which they cover; thus metal 34 is plated only in the voids 28 on the parts of surface 15, as shown in Figure 6.
The metal 34 plated on to the wafer is a metal capable of being wetted by and adhering to a gold or silver alloy hard solder.
The sandwich is then removed from the electroplating bath and washed, the glass sheet 32 is removed and the coating material 26 and wax layer 30 are removed by means of a suitable organic solvent such as trichlorethylene. At this stage the elements 16 on the wafer may be tested, using probes 36 (Figure 7) and any faulty elements are marked, for example by an ink mark 38 applied to the surface 14 at the appropriate location, so that the faulty elements may be identified and rejected on subsequent division of the wafer.
The wafer bearing the elements 16 is then divided into individual transducer elements by again applying a wax layer to surface 15 and cutting through the wafer and electroplated metal as shown in Figure 8, followed by removal of the wax using an organic solvent to produce individual transducer elements 22 of area 1 mm X 10 mm each provided with a single strain-sensitive element 16 and electroplated soldering points 39 as shown in Figure 9.
Figure 10 shows a pressure port 40 provided with a transducer 42 for measuring the gauge pressure within the port 42 using the transducer element of Figure 9. The pressure port 42 comprises a duct 44 terminating in a chamber 46 closed by a diaphragm assembly 48 comprising a thin steel circular diaphragm 50 surrounded by a flange 52 which is attached in a gas-tight manner as by electron beam welding to a corresponding flange 54 of the duct. The flange 52 is provided with a circular, substantially planar inner shoulder 56 surrounding the diaphragm 50 and the diaphragm has a central portion 58 of increased thickness projecting above the outside surface of the diaphragm and having a substantially flat surface coincident with the plane defined by the shoulder 56.
As shown in Figure 11 the surface of the central portion 58 and a part 60 of the shoulder are electroplated with a metal compatible with a hard gold or silver alloy solder. A transducer element as shown in Figure 9 is soldered, at its plated portions 38, to the portion 58 of the diaphragm and part 60 of the shoulder as shown in Figure 11. Soldering may be carried out by a jig and gas-jet or an oven soldering method. The solder attaches the ends of the transducer element rigidly to the diaphragm and shoulder 56 so that, when the diaphragm 50 is deformed by gas pressure inside the pressure port, the transducer element 22 is deformed and the electrical resistance of element 16 is altered, providing a measure of the magnitude of the deformation and thus of the gauge pressure within the pressure port.
Figure 13 shows a method of connecting the terminal portions 20 of the strain-sensitive element 16 to a device for measuring the resistance of the element 16. A bondout board 62 is adhered to the shoulder 56 in such a position that it does not interfere with deformation the diaphragm 50 or the transducer element 22. The board carries a printed circuit comprising leads having terminals at one end which are connected by respective wires 64 to the terminal portions 20 of the strainsensitive element 16. The other ends of the leads are connected to pins 66 on the board intended to be connected to a device (not shown) for measuring the resistance or the change in resistance of the strain gauge bridge 16a to 16d and for processing the values obtained to deduce the gas pressure within the pressure port.
Figure 14 shows a supporting sheet 110 similar to sheet 10 of Figure 1 for producing hexagonal diaphragm transducer devices 122 having strain-sensitive elements 116 formed thereon in a manner similar to that described with reference to Figures 3 to 9. The sheet 110 may be divided into individual transducer devices 122 by means of a slitting saw, for example.
Figure 15 shows a supporting sheet 210 similar to sheet 10 of Figure 1 for producing circular diaphragm transducer devices 222 having strain-sensitive elements 216 formed thereon in a manner similar to that described with reference to Figures 3 to 9. The sheet 210 may be divided into individual transducer devices 222 by means of a spark erosion, for example.
Various modifications can, of course, be made to the method as described. For example, the array of elements could be preformed and then bonded to the surface of the substrate.
Claims (17)
1. A method of making transducer devices which comprises providing on one surface of a supporting substrate an array of electrically strain-sensitive elements and dividing the supporting substrate into portions bearing strainsensitive elements to provide a plurality of transducer devices.
2. A method according to claim 1, in which the substrate is of metal having a coating of electrically insulating material thereon, on which the strain-sensitive elements are provided.
3. A method according to claim 1 or 2, in which the elements are provided by depositing a layer of electrically strain-sensitive material on the substrate and photoengraving and etching the layer to form the elements of the required shape.
4. A method according to claim 1 or 2, wherein the elements are provided by bonding to the said one surface of the substrate an array of preformed strain-sensitive elements.
5. A method according to any one of the preceding claims, in which the other surface of the substrate is provided with stress-concentrating grooves.
6. A method according to claim 5, wherein the stressconcentrating grooves are provided before the elements are formed on the said one surface.
7. A method according to claim 5 or 6, wherein the stress-grooves are provided in regions whereat the strain induced in the strainsensitive elements for a given strain in the device is enhanced.
8. A method according to any one of the preceding claims, in which at least one portion of a surface of the substrate is electroplated with a metal or alloy to enable the devices to be attached to a support.
9. A method according to claim 8, in which the device is attached to a support by solder.
10. A method according to claim 8 or 9, in which a surface of the substrate is coated with a protective layer having voids therein at which the surface of the substrate is exposed, the assembly so formed is subjected to electroplating and the protective strips are subsequently removed.
11. A method according to any one of the preceding claims, in which the substrate bearing the elements is divided into portions by mounting the substrate on a mounting member, cutting the substrate into portions and removing the portions from the mounting member.
12. A method according to claim 11, in which the mounting member comprises a wax layer.
13. A method of making transducer devices substantially as hereinbefore described with reference to Figures 1 to 9 or Figures 1 to 9 with Figure 14 or Figure 15.
14. A measuring device comprising a transducer device made according to any one of claims 1 to 13 and means for straining said transducer device.
15. A measuring device according to claim 14, wherein said means for straining said transducer device is a means responsive to pressure, force or deflection.
16. A measuring device comprising a movable or deformable diaphragm, having attached thereto a transducer device made by a method according to any one of claims 1 to 13.
17. A measuring device substantially as hereinbefore described with reference to and as illustrated in the accompanying drawings.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB08510558A GB2174241A (en) | 1985-04-25 | 1985-04-25 | Transducer devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB08510558A GB2174241A (en) | 1985-04-25 | 1985-04-25 | Transducer devices |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| GB8510558D0 GB8510558D0 (en) | 1985-05-30 |
| GB2174241A true GB2174241A (en) | 1986-10-29 |
Family
ID=10578191
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB08510558A Withdrawn GB2174241A (en) | 1985-04-25 | 1985-04-25 | Transducer devices |
Country Status (1)
| Country | Link |
|---|---|
| GB (1) | GB2174241A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0496032A2 (en) * | 1990-08-31 | 1992-07-29 | General Electric Company | Method of making strain gauged diaphragm-type pressure transducers |
| EP0602606A2 (en) * | 1992-12-15 | 1994-06-22 | ISHIDA CO., Ltd. | Method of manufacturing strain sensors |
| WO1997039320A1 (en) * | 1996-04-13 | 1997-10-23 | Robert Bosch Gmbh | Pressure sensor |
| WO1998009145A1 (en) * | 1996-08-27 | 1998-03-05 | Robert Bosch Gmbh | Process for producing pressure sensors |
| DE10157592A1 (en) * | 2001-11-23 | 2003-06-12 | Hydac Electronic Gmbh | Method of manufacturing a variety of pressure sensors |
| WO2006016136A2 (en) | 2004-08-10 | 2006-02-16 | Dage Precision Industries Ltd. | Shear test device |
| US7905152B2 (en) | 2006-02-17 | 2011-03-15 | Nordson Corporation | Shear test apparatus and method |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2093272A (en) * | 1981-02-12 | 1982-08-25 | Becton Dickinson Co | High temperature with standing layered silicon structures especially for pressure transducers |
-
1985
- 1985-04-25 GB GB08510558A patent/GB2174241A/en not_active Withdrawn
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2093272A (en) * | 1981-02-12 | 1982-08-25 | Becton Dickinson Co | High temperature with standing layered silicon structures especially for pressure transducers |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0496032A2 (en) * | 1990-08-31 | 1992-07-29 | General Electric Company | Method of making strain gauged diaphragm-type pressure transducers |
| EP0496032A3 (en) * | 1990-08-31 | 1993-01-20 | General Electric Company | Method of making strain gauged diaphragm-type pressure transducers |
| EP0602606A2 (en) * | 1992-12-15 | 1994-06-22 | ISHIDA CO., Ltd. | Method of manufacturing strain sensors |
| EP0602606A3 (en) * | 1992-12-15 | 1994-08-31 | Ishida Seisakusho | |
| WO1997039320A1 (en) * | 1996-04-13 | 1997-10-23 | Robert Bosch Gmbh | Pressure sensor |
| DE19714703B4 (en) * | 1996-04-13 | 2014-02-13 | Robert Bosch Gmbh | pressure sensor |
| US6189205B1 (en) | 1996-08-27 | 2001-02-20 | Robert Bosch Gmbh | Process for producing pressure sensors |
| WO1998009145A1 (en) * | 1996-08-27 | 1998-03-05 | Robert Bosch Gmbh | Process for producing pressure sensors |
| DE10157592A1 (en) * | 2001-11-23 | 2003-06-12 | Hydac Electronic Gmbh | Method of manufacturing a variety of pressure sensors |
| WO2006016136A2 (en) | 2004-08-10 | 2006-02-16 | Dage Precision Industries Ltd. | Shear test device |
| WO2006016136A3 (en) * | 2004-08-10 | 2006-07-27 | Dage Prec Ind Ltd | Shear test device |
| US7730790B2 (en) | 2004-08-10 | 2010-06-08 | Nordson Corporation | Shear test device |
| US7997147B2 (en) | 2004-08-10 | 2011-08-16 | Nordson Corporation | Shear test device |
| US7905152B2 (en) | 2006-02-17 | 2011-03-15 | Nordson Corporation | Shear test apparatus and method |
Also Published As
| Publication number | Publication date |
|---|---|
| GB8510558D0 (en) | 1985-05-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |