FR2496341A1 - Composant d'interconnexion topologique - Google Patents

Composant d'interconnexion topologique Download PDF

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Publication number
FR2496341A1
FR2496341A1 FR8026410A FR8026410A FR2496341A1 FR 2496341 A1 FR2496341 A1 FR 2496341A1 FR 8026410 A FR8026410 A FR 8026410A FR 8026410 A FR8026410 A FR 8026410A FR 2496341 A1 FR2496341 A1 FR 2496341A1
Authority
FR
France
Prior art keywords
topological
interconnection component
component according
circuit
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR8026410A
Other languages
English (en)
French (fr)
Other versions
FR2496341B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
Christian Val
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thomson CSF SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson CSF SA filed Critical Thomson CSF SA
Priority to FR8026410A priority Critical patent/FR2496341A1/fr
Publication of FR2496341A1 publication Critical patent/FR2496341A1/fr
Application granted granted Critical
Publication of FR2496341B1 publication Critical patent/FR2496341B1/fr
Granted legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H—ELECTRICITY
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49805—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the leads being also applied on the sidewalls or the bottom of the substrate, e.g. leadless packages for surface mounting
    • H—ELECTRICITY
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5383—Multilayer substrates
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    • H01L23/64—Impedance arrangements
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
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    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/48599—Principal constituent of the connecting portion of the wire connector being Gold (Au)
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    • H01L2224/48505—Material at the bonding interface
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    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
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    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
FR8026410A 1980-12-12 1980-12-12 Composant d'interconnexion topologique Granted FR2496341A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR8026410A FR2496341A1 (fr) 1980-12-12 1980-12-12 Composant d'interconnexion topologique

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8026410A FR2496341A1 (fr) 1980-12-12 1980-12-12 Composant d'interconnexion topologique

Publications (2)

Publication Number Publication Date
FR2496341A1 true FR2496341A1 (fr) 1982-06-18
FR2496341B1 FR2496341B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1984-07-20

Family

ID=9249000

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8026410A Granted FR2496341A1 (fr) 1980-12-12 1980-12-12 Composant d'interconnexion topologique

Country Status (1)

Country Link
FR (1) FR2496341A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2565032A1 (fr) * 1984-05-25 1985-11-29 Inf Milit Spatiale Aeronaut Dispositif de repartition de potentiel electrique et boitier de composant electronique incorporant un tel dispositif
US8359740B2 (en) 2008-12-19 2013-01-29 3D Plus Process for the wafer-scale fabrication of electronic modules for surface mounting

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2191406A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1972-06-30 1974-02-01 Ibm
FR2340288A1 (fr) * 1976-02-03 1977-09-02 Ibm Procede de fabrication d'une ceramique a multicouches
FR2404990A1 (fr) * 1977-10-03 1979-04-27 Cii Honeywell Bull Substrat d'interconnexion de composants electroniques a circuits integres, muni d'un dispositif de reparation
FR2439438A1 (fr) * 1978-10-19 1980-05-16 Cii Honeywell Bull Ruban porteur de dispositifs de traitement de signaux electriques, son procede de fabrication et application de ce ruban a un element de traitement de signaux
FR2456388A1 (fr) * 1979-05-10 1980-12-05 Thomson Brandt Microboitier de circuit electronique, et circuit hybride comportant un tel microboitier

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2191406A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1972-06-30 1974-02-01 Ibm
FR2340288A1 (fr) * 1976-02-03 1977-09-02 Ibm Procede de fabrication d'une ceramique a multicouches
FR2404990A1 (fr) * 1977-10-03 1979-04-27 Cii Honeywell Bull Substrat d'interconnexion de composants electroniques a circuits integres, muni d'un dispositif de reparation
FR2439438A1 (fr) * 1978-10-19 1980-05-16 Cii Honeywell Bull Ruban porteur de dispositifs de traitement de signaux electriques, son procede de fabrication et application de ce ruban a un element de traitement de signaux
FR2456388A1 (fr) * 1979-05-10 1980-12-05 Thomson Brandt Microboitier de circuit electronique, et circuit hybride comportant un tel microboitier

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
EXBK/77 *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2565032A1 (fr) * 1984-05-25 1985-11-29 Inf Milit Spatiale Aeronaut Dispositif de repartition de potentiel electrique et boitier de composant electronique incorporant un tel dispositif
EP0166634A1 (fr) * 1984-05-25 1986-01-02 Thomson-Csf Dispositif de répartition de potentiel électrique, et boîtier de composant électronique incorporant un tel dispositif
US8359740B2 (en) 2008-12-19 2013-01-29 3D Plus Process for the wafer-scale fabrication of electronic modules for surface mounting

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Publication number Publication date
FR2496341B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1984-07-20

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