FR2489593B1 - Dispositif redresseur a semi-conducteurs - Google Patents
Dispositif redresseur a semi-conducteursInfo
- Publication number
- FR2489593B1 FR2489593B1 FR8116863A FR8116863A FR2489593B1 FR 2489593 B1 FR2489593 B1 FR 2489593B1 FR 8116863 A FR8116863 A FR 8116863A FR 8116863 A FR8116863 A FR 8116863A FR 2489593 B1 FR2489593 B1 FR 2489593B1
- Authority
- FR
- France
- Prior art keywords
- rectifier device
- semiconductor rectifier
- semiconductor
- rectifier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/115—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
- H02K11/04—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection for rectification
- H02K11/049—Rectifiers associated with stationary parts, e.g. stator cores
- H02K11/05—Rectifiers associated with casings, enclosures or brackets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
- Y10S257/909—Macrocell arrays, e.g. gate arrays with variable size or configuration of cells
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55122660A JPS5746662A (en) | 1980-09-04 | 1980-09-04 | Semiconductor rectifier |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2489593A1 FR2489593A1 (fr) | 1982-03-05 |
FR2489593B1 true FR2489593B1 (fr) | 1985-11-22 |
Family
ID=14841471
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR8116863A Expired FR2489593B1 (fr) | 1980-09-04 | 1981-09-04 | Dispositif redresseur a semi-conducteurs |
Country Status (6)
Country | Link |
---|---|
US (1) | US4604643A (fr) |
JP (1) | JPS5746662A (fr) |
DE (1) | DE3134922A1 (fr) |
ES (1) | ES8206095A1 (fr) |
FR (1) | FR2489593B1 (fr) |
IT (1) | IT1138560B (fr) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5968958A (ja) * | 1982-10-12 | 1984-04-19 | Mitsubishi Electric Corp | ゲ−トタ−ンオフサイリスタ組立体 |
US4538169A (en) * | 1982-11-04 | 1985-08-27 | Motorola, Inc. | Integrated alternator bridge heat sink |
JPS59108339A (ja) * | 1982-12-14 | 1984-06-22 | Toshiba Corp | 半導体整流装置 |
JPS59108340A (ja) * | 1982-12-14 | 1984-06-22 | Toshiba Corp | 半導体整流装置 |
JPS59201457A (ja) * | 1983-04-28 | 1984-11-15 | Toshiba Corp | 半導体装置 |
DE3335184A1 (de) * | 1983-09-28 | 1985-04-04 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zum herstellen von halbleiterbausteinen |
DE3406538A1 (de) * | 1984-02-23 | 1985-08-29 | Bbc Brown Boveri & Cie | Leistungshalbleitermodul und verfahren zur herstellung |
DE3406537A1 (de) * | 1984-02-23 | 1985-08-29 | Brown, Boveri & Cie Ag, 6800 Mannheim | Anordnung eines leistungshalbleiterbauelementes auf einem isolierenden und mit leiterbahnen versehenen substrat |
DE3538933A1 (de) * | 1985-11-02 | 1987-05-14 | Bbc Brown Boveri & Cie | Leistungshalbleitermodul |
US4985752A (en) * | 1988-08-01 | 1991-01-15 | Sundstrand Corporation | Hermetically sealed compression bonded circuit assembly having a suspension for compression bonded semiconductor elements |
US4954876A (en) * | 1988-08-01 | 1990-09-04 | Sundstrand Corporation | Hermetically sealed compression bonded circuit assembly having flexible walls at points of application of pressure for compression bonding circuit elements |
US4994890A (en) * | 1989-11-27 | 1991-02-19 | Snap-On Tools Corporation | Rectifier structure with individual links |
US5731970A (en) * | 1989-12-22 | 1998-03-24 | Hitachi, Ltd. | Power conversion device and semiconductor module suitable for use in the device |
US5087962A (en) * | 1991-02-25 | 1992-02-11 | Motorola Inc. | Insulated lead frame using plasma sprayed dielectric |
DE4403996A1 (de) * | 1994-02-09 | 1995-08-10 | Bosch Gmbh Robert | Gleichrichteranordnung für einen Drehstromgenerator |
JP3206717B2 (ja) * | 1996-04-02 | 2001-09-10 | 富士電機株式会社 | 電力用半導体モジュール |
US5889319A (en) * | 1996-07-19 | 1999-03-30 | Ericsson, Inc. | RF power package with a dual ground |
EP1032114B1 (fr) * | 1999-02-26 | 2011-10-26 | Valeo Equipements Electriques Moteur | Module électrique pour alternateur de véhicule, notamment automobile, et assemblage comportant un tel alternateur et un tel module |
FR2800932B1 (fr) * | 1999-11-10 | 2002-03-01 | Valeo Equip Electr Moteur | Module electronique pour alternateur de vehicule, notamment automobile, et assemblage comportant un tel alternateur et un tel module |
FR2790340B1 (fr) * | 1999-02-26 | 2001-05-18 | Valeo Equip Electr Moteur | Alternateur pour vehicule automobile a redresseur et regulateur |
DE19946259A1 (de) * | 1999-09-27 | 2001-03-29 | Philips Corp Intellectual Pty | Gleichrichteranordnung |
DE10022268B4 (de) * | 2000-05-08 | 2005-03-31 | Infineon Technologies Ag | Halbleiterbauelement mit zwei Halbleiterkörpern in einem gemeinsamen Gehäuse |
KR100652177B1 (ko) * | 2001-02-28 | 2006-11-29 | 미쓰비시덴키 가부시키가이샤 | 회전전기의 통전기판 |
JP6698705B2 (ja) * | 2016-01-14 | 2020-05-27 | 三菱電機株式会社 | 半導体装置 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1100697A (en) * | 1965-11-22 | 1968-01-24 | Matsushita Electronics Corp | Alternator semiconductor diode and rectifying circuit assembly |
GB1328351A (en) * | 1969-12-31 | 1973-08-30 | Lucas Industries Ltd | Full wave rectifier assemblies |
JPS4846559U (fr) * | 1971-09-30 | 1973-06-18 | ||
DE2208794A1 (de) * | 1972-02-24 | 1973-08-30 | Siemens Ag | Gleichrichterbruecke |
US3820153A (en) * | 1972-08-28 | 1974-06-25 | Zyrotron Ind Inc | Plurality of semiconductor elements mounted on common base |
US3925809A (en) * | 1973-07-13 | 1975-12-09 | Ford Motor Co | Semi-conductor rectifier heat sink |
DE7512573U (de) * | 1975-04-19 | 1975-09-04 | Semikron Gesellschaft Fuer Gleichri | Halbleitergleichrichteranordnung |
US4069497A (en) * | 1975-08-13 | 1978-01-17 | Emc Technology, Inc. | High heat dissipation mounting for solid state devices and circuits |
JPS542067A (en) * | 1977-06-07 | 1979-01-09 | Hitachi Ltd | Semiconductor device |
JPS54118507A (en) * | 1978-03-06 | 1979-09-14 | Hitachi Ltd | Ac generator for vehicle |
US4218694A (en) * | 1978-10-23 | 1980-08-19 | Ford Motor Company | Rectifying apparatus including six semiconductor diodes sandwiched between ceramic wafers |
US4249034A (en) * | 1978-11-27 | 1981-02-03 | General Electric Company | Semiconductor package having strengthening and sealing upper chamber |
AT363147B (de) * | 1978-12-13 | 1981-07-10 | Wienerberger Baustoffind Ag | Verfahren zur herstellung eines elektrischen schichtwiderstandes, insbesondere fuer leistungswiderstaende oder heizelemente |
JPS6020943Y2 (ja) * | 1979-08-29 | 1985-06-22 | 三菱電機株式会社 | 半導体装置 |
US4259061A (en) * | 1979-12-07 | 1981-03-31 | International Business Machines Corporation | Method of achieving uniform sintering shrinkage in a laminated planar green ceramic substrate and apparatus therefor |
US4320251A (en) * | 1980-07-28 | 1982-03-16 | Solamat Inc. | Ohmic contacts for solar cells by arc plasma spraying |
-
1980
- 1980-09-04 JP JP55122660A patent/JPS5746662A/ja active Granted
-
1981
- 1981-09-03 IT IT23757/81A patent/IT1138560B/it active
- 1981-09-03 ES ES505186A patent/ES8206095A1/es not_active Expired
- 1981-09-03 DE DE19813134922 patent/DE3134922A1/de active Granted
- 1981-09-04 FR FR8116863A patent/FR2489593B1/fr not_active Expired
-
1984
- 1984-10-30 US US06/665,509 patent/US4604643A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
FR2489593A1 (fr) | 1982-03-05 |
ES505186A0 (es) | 1982-06-16 |
ES8206095A1 (es) | 1982-06-16 |
DE3134922C2 (fr) | 1990-05-23 |
IT1138560B (it) | 1986-09-17 |
IT8123757A0 (it) | 1981-09-03 |
DE3134922A1 (de) | 1982-04-01 |
JPS5746662A (en) | 1982-03-17 |
US4604643A (en) | 1986-08-05 |
JPS641938B2 (fr) | 1989-01-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
CD | Change of name or company name | ||
ST | Notification of lapse |