FR2478878A1 - Produit semi-fini en vue de la fabrication de couvercles metalliques pour fermer des boitiers en materiau ceramique - Google Patents
Produit semi-fini en vue de la fabrication de couvercles metalliques pour fermer des boitiers en materiau ceramique Download PDFInfo
- Publication number
- FR2478878A1 FR2478878A1 FR8105146A FR8105146A FR2478878A1 FR 2478878 A1 FR2478878 A1 FR 2478878A1 FR 8105146 A FR8105146 A FR 8105146A FR 8105146 A FR8105146 A FR 8105146A FR 2478878 A1 FR2478878 A1 FR 2478878A1
- Authority
- FR
- France
- Prior art keywords
- metal support
- layer
- product according
- nickel
- alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/60—Seals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/10—Containers or parts thereof
- H10W76/12—Containers or parts thereof characterised by their shape
- H10W76/15—Containers comprising an insulating or insulated base
- H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Ceramic Products (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19803010076 DE3010076A1 (de) | 1980-03-15 | 1980-03-15 | Halbzeug fuer die herstellung von metalldeckeln zum verschliessen von gehaeusen aus keramischem werkstoff |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2478878A1 true FR2478878A1 (fr) | 1981-09-25 |
| FR2478878B3 FR2478878B3 (enFirst) | 1983-01-21 |
Family
ID=6097363
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR8105146A Granted FR2478878A1 (fr) | 1980-03-15 | 1981-03-13 | Produit semi-fini en vue de la fabrication de couvercles metalliques pour fermer des boitiers en materiau ceramique |
Country Status (3)
| Country | Link |
|---|---|
| DE (1) | DE3010076A1 (enFirst) |
| FR (1) | FR2478878A1 (enFirst) |
| GB (1) | GB2073082B (enFirst) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA1201211A (en) * | 1982-08-05 | 1986-02-25 | Olin Corporation | Hermetically sealed semiconductor casing |
| US4656499A (en) * | 1982-08-05 | 1987-04-07 | Olin Corporation | Hermetically sealed semiconductor casing |
| DE3587003T2 (de) * | 1984-04-30 | 1993-06-17 | Allied Signal Inc | Nickel/indium-legierung fuer die herstellung eines hermetisch verschlossenen gehaeuses fuer halbleiteranordnungen und andere elektronische anordnungen. |
| JP3078544B2 (ja) | 1998-09-24 | 2000-08-21 | 住友特殊金属株式会社 | 電子部品用パッケージ、その蓋体用の蓋材およびその蓋材の製造方法 |
| JP6387818B2 (ja) | 2014-12-11 | 2018-09-12 | 日立金属株式会社 | 気密封止用蓋材の製造方法 |
-
1980
- 1980-03-15 DE DE19803010076 patent/DE3010076A1/de not_active Ceased
-
1981
- 1981-03-03 GB GB8106610A patent/GB2073082B/en not_active Expired
- 1981-03-13 FR FR8105146A patent/FR2478878A1/fr active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| FR2478878B3 (enFirst) | 1983-01-21 |
| GB2073082A (en) | 1981-10-14 |
| DE3010076A1 (de) | 1981-09-24 |
| GB2073082B (en) | 1983-11-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CA2100114A1 (en) | Copper-Bismuth Alloys | |
| DE69920458D1 (de) | Metalllegierungen für die reflektions- oder halbreflektierende schicht eines optischen speichermediums | |
| FR2478878A1 (fr) | Produit semi-fini en vue de la fabrication de couvercles metalliques pour fermer des boitiers en materiau ceramique | |
| WO2002086358A1 (fr) | Joint d'etancheite metallique elastique ferme a parties saillantes desaxees | |
| EP0991122A2 (fr) | Pattes de connexion pour composant electronique | |
| JP2001335923A5 (ja) | スパッタリングターゲットとそれを用いた薄膜およびデバイス | |
| FR2541824A1 (fr) | Dispositif de puissance a semi-conducteur constitue par une multiplicite d'elements semblables montes en parallele | |
| FR2485262A1 (fr) | Boitier d'encapsulation resistant a de fortes pressions externes | |
| FR2591518A1 (fr) | Materiau a faible teneur en phosphore, en forme de bande et/ou de filament | |
| FR2494859A1 (fr) | Monture de lunettes | |
| FR2799337A1 (fr) | Procede de realisation de connexions electriques sur la surface d'un boitier semi-conducteur a gouttes de connexion electrique | |
| JPS584955A (ja) | 金めつきされた電子部品パツケ−ジ | |
| FR2584241A1 (fr) | Bande revetue de nickel | |
| FR2477782A1 (fr) | Dispositif d'accord en hyperfrequences, du type a contacts glissants, et filtre comportant un tel dispositif | |
| FR2494495A1 (fr) | Cartouche coupe-circuit d'appareil et procede pour sa fabrication | |
| EP0318386B1 (fr) | Procédé de brasage de pièces à base de métaux réfractaires | |
| FR2498497A1 (fr) | Dispositif pour la coulee continue de metaux | |
| JPH0712567B2 (ja) | 単結晶ダイヤモンドチツプ | |
| JPS62265702A (ja) | サ−ミスタ−とリ−ド線の結合装置 | |
| JPH0870075A (ja) | リードフレーム及びリードフレーム用素材 | |
| EP0084339B1 (fr) | Support d'électrode pour accumulateur électrique | |
| JPS5810338A (ja) | リ−ドスイツチ用リ−ド片の製造方法 | |
| JPH061787B2 (ja) | 半導体装置用基板 | |
| JPH0888307A (ja) | リードフレーム材およびリードフレーム | |
| JPH0196376A (ja) | スパッタリング用クラッドターゲット材 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |