FR2473214A1 - Plaquette de resistances en ligne a tres faible pas et barrette d'impression thermique utilisant cette plaquette de resistances en ligne - Google Patents
Plaquette de resistances en ligne a tres faible pas et barrette d'impression thermique utilisant cette plaquette de resistances en ligne Download PDFInfo
- Publication number
- FR2473214A1 FR2473214A1 FR8000171A FR8000171A FR2473214A1 FR 2473214 A1 FR2473214 A1 FR 2473214A1 FR 8000171 A FR8000171 A FR 8000171A FR 8000171 A FR8000171 A FR 8000171A FR 2473214 A1 FR2473214 A1 FR 2473214A1
- Authority
- FR
- France
- Prior art keywords
- connections
- metal
- resistors
- strip
- resistive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007651 thermal printing Methods 0.000 title abstract description 5
- 239000000758 substrate Substances 0.000 claims abstract description 9
- 229910052751 metal Inorganic materials 0.000 claims description 23
- 239000002184 metal Substances 0.000 claims description 23
- 210000001520 comb Anatomy 0.000 claims description 2
- 238000005530 etching Methods 0.000 claims 1
- 150000002500 ions Chemical class 0.000 claims 1
- 230000008018 melting Effects 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 238000000926 separation method Methods 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 3
- 239000000126 substance Substances 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 8
- 238000001465 metallisation Methods 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 150000001768 cations Chemical class 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000005304 optical glass Substances 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/142—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals or tapping points being coated on the resistive element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/16—Resistor networks not otherwise provided for
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/22—Elongated resistive element being bent or curved, e.g. sinusoidal, helical
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Electronic Switches (AREA)
- Non-Adjustable Resistors (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR8000171A FR2473214A1 (fr) | 1980-01-04 | 1980-01-04 | Plaquette de resistances en ligne a tres faible pas et barrette d'impression thermique utilisant cette plaquette de resistances en ligne |
| DE8080401824T DE3070601D1 (en) | 1980-01-04 | 1980-12-18 | Plate with a row of resistors with very small spacing |
| EP80401824A EP0032087B1 (fr) | 1980-01-04 | 1980-12-18 | Plaquette de résistances en ligne à très faible pas |
| JP5381A JPS56160002A (en) | 1980-01-04 | 1981-01-05 | Wafer for in-line resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR8000171A FR2473214A1 (fr) | 1980-01-04 | 1980-01-04 | Plaquette de resistances en ligne a tres faible pas et barrette d'impression thermique utilisant cette plaquette de resistances en ligne |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2473214A1 true FR2473214A1 (fr) | 1981-07-10 |
| FR2473214B1 FR2473214B1 (enExample) | 1983-04-29 |
Family
ID=9237245
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR8000171A Granted FR2473214A1 (fr) | 1980-01-04 | 1980-01-04 | Plaquette de resistances en ligne a tres faible pas et barrette d'impression thermique utilisant cette plaquette de resistances en ligne |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP0032087B1 (enExample) |
| JP (1) | JPS56160002A (enExample) |
| DE (1) | DE3070601D1 (enExample) |
| FR (1) | FR2473214A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8359740B2 (en) | 2008-12-19 | 2013-01-29 | 3D Plus | Process for the wafer-scale fabrication of electronic modules for surface mounting |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4401881A (en) * | 1980-03-21 | 1983-08-30 | Tokyo Shibaura Denki Kabushiki Kaisha | Two-dimensional thermal head |
| EP0211331A3 (en) * | 1985-08-02 | 1989-10-25 | Hitachi, Ltd. | Heat-sensitive recording head and method of manufacturing same |
| EP0559295B1 (en) * | 1989-03-01 | 1996-07-03 | Canon Kabushiki Kaisha | Method of manufacturing a substrate for a liquid jet recording head |
| US5211754A (en) * | 1989-03-01 | 1993-05-18 | Canon Kabushiki Kaisha | Method of manufacturing a substrate for a liquid jet recording head, substrate manufactured by the method, liquid jet recording head formed by use of the substrate, and liquid jet recording apparatus having the head |
| US5140345A (en) * | 1989-03-01 | 1992-08-18 | Canon Kabushiki Kaisha | Method of manufacturing a substrate for a liquid jet recording head and substrate manufactured by the method |
| DE19755753A1 (de) * | 1997-12-16 | 1999-06-17 | Bosch Gmbh Robert | Widerstandsbauelement und Verfahren zu seiner Herstellung |
| CN108831642B (zh) * | 2018-08-09 | 2023-09-05 | 株洲中车奇宏散热技术有限公司 | 一种由电阻带构成电阻器单元的强化方法及电阻器单元 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR1604199A (enExample) * | 1968-12-30 | 1971-07-26 | ||
| US4037315A (en) * | 1975-04-28 | 1977-07-26 | Tektronix, Inc. | Thermal printing head |
| EP0001520A1 (fr) * | 1977-09-29 | 1979-04-18 | Societe Francaise De L'electro-Resistance | Résistance électrique plane de haute précision et de valeur ohmique ajustable et procédé pour ajuster cette valeur ohmique |
| US4176445A (en) * | 1977-06-03 | 1979-12-04 | Angstrohm Precision, Inc. | Metal foil resistor |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4343833A (en) * | 1979-06-26 | 1982-08-10 | Mitsubishi Denki Kabushiki Kaisha | Method of manufacturing thermal head |
-
1980
- 1980-01-04 FR FR8000171A patent/FR2473214A1/fr active Granted
- 1980-12-18 EP EP80401824A patent/EP0032087B1/fr not_active Expired
- 1980-12-18 DE DE8080401824T patent/DE3070601D1/de not_active Expired
-
1981
- 1981-01-05 JP JP5381A patent/JPS56160002A/ja active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR1604199A (enExample) * | 1968-12-30 | 1971-07-26 | ||
| US4037315A (en) * | 1975-04-28 | 1977-07-26 | Tektronix, Inc. | Thermal printing head |
| US4176445A (en) * | 1977-06-03 | 1979-12-04 | Angstrohm Precision, Inc. | Metal foil resistor |
| EP0001520A1 (fr) * | 1977-09-29 | 1979-04-18 | Societe Francaise De L'electro-Resistance | Résistance électrique plane de haute précision et de valeur ohmique ajustable et procédé pour ajuster cette valeur ohmique |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8359740B2 (en) | 2008-12-19 | 2013-01-29 | 3D Plus | Process for the wafer-scale fabrication of electronic modules for surface mounting |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2473214B1 (enExample) | 1983-04-29 |
| EP0032087A3 (en) | 1981-07-29 |
| EP0032087A2 (fr) | 1981-07-15 |
| DE3070601D1 (en) | 1985-06-05 |
| JPS56160002A (en) | 1981-12-09 |
| EP0032087B1 (fr) | 1985-05-02 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |