EP0559295B1 - Method of manufacturing a substrate for a liquid jet recording head - Google Patents
Method of manufacturing a substrate for a liquid jet recording head Download PDFInfo
- Publication number
- EP0559295B1 EP0559295B1 EP93201057A EP93201057A EP0559295B1 EP 0559295 B1 EP0559295 B1 EP 0559295B1 EP 93201057 A EP93201057 A EP 93201057A EP 93201057 A EP93201057 A EP 93201057A EP 0559295 B1 EP0559295 B1 EP 0559295B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- recording head
- jet recording
- substrate
- filler
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 25
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 15
- 239000007788 liquid Substances 0.000 title claims description 52
- 238000000034 method Methods 0.000 claims abstract description 34
- 239000011241 protective layer Substances 0.000 claims abstract description 34
- 239000000945 filler Substances 0.000 claims abstract description 25
- 239000010410 layer Substances 0.000 claims description 37
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 36
- 229910052681 coesite Inorganic materials 0.000 claims description 18
- 229910052906 cristobalite Inorganic materials 0.000 claims description 18
- 239000000377 silicon dioxide Substances 0.000 claims description 18
- 229910052682 stishovite Inorganic materials 0.000 claims description 18
- 229910052905 tridymite Inorganic materials 0.000 claims description 18
- 239000011810 insulating material Substances 0.000 claims description 12
- 238000005520 cutting process Methods 0.000 claims description 11
- LTPBRCUWZOMYOC-UHFFFAOYSA-N Beryllium oxide Chemical compound O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 claims description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 4
- 229910011255 B2O3 Inorganic materials 0.000 claims description 2
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 claims description 2
- 238000001182 laser chemical vapour deposition Methods 0.000 claims description 2
- 229910003465 moissanite Inorganic materials 0.000 claims description 2
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 2
- 229910052718 tin Inorganic materials 0.000 claims description 2
- ZNOKGRXACCSDPY-UHFFFAOYSA-N tungsten(VI) oxide Inorganic materials O=[W](=O)=O ZNOKGRXACCSDPY-UHFFFAOYSA-N 0.000 claims description 2
- 238000004544 sputter deposition Methods 0.000 abstract description 6
- 239000000976 ink Substances 0.000 description 48
- 239000010408 film Substances 0.000 description 18
- 238000007599 discharging Methods 0.000 description 17
- 239000000428 dust Substances 0.000 description 14
- 239000011148 porous material Substances 0.000 description 11
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 8
- 230000007547 defect Effects 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- 238000005530 etching Methods 0.000 description 7
- MGWGWNFMUOTEHG-UHFFFAOYSA-N 4-(3,5-dimethylphenyl)-1,3-thiazol-2-amine Chemical compound CC1=CC(C)=CC(C=2N=C(N)SC=2)=C1 MGWGWNFMUOTEHG-UHFFFAOYSA-N 0.000 description 5
- JCXJVPUVTGWSNB-UHFFFAOYSA-N nitrogen dioxide Inorganic materials O=[N]=O JCXJVPUVTGWSNB-UHFFFAOYSA-N 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 229910000077 silane Inorganic materials 0.000 description 4
- 238000009835 boiling Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 229910003862 HfB2 Inorganic materials 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910017083 AlN Inorganic materials 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- PBCFLUZVCVVTBY-UHFFFAOYSA-N tantalum pentoxide Inorganic materials O=[Ta](=O)O[Ta](=O)=O PBCFLUZVCVVTBY-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14088—Structure of heating means
- B41J2/14112—Resistive element
- B41J2/14129—Layer structure
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1601—Production of bubble jet print heads
- B41J2/1603—Production of bubble jet print heads of the front shooter type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1601—Production of bubble jet print heads
- B41J2/1604—Production of bubble jet print heads of the edge shooter type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1628—Manufacturing processes etching dry etching
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1632—Manufacturing processes machining
- B41J2/1634—Manufacturing processes machining laser machining
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1642—Manufacturing processes thin film formation thin film formation by CVD [chemical vapor deposition]
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1643—Manufacturing processes thin film formation thin film formation by plating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1645—Manufacturing processes thin film formation thin film formation by spincoating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1646—Manufacturing processes thin film formation thin film formation by sputtering
Definitions
- This invention relates to a method of manufacturing a substrate for a liquid jet recording head and to a substrate and a liquid jet recording head manufactured by the method.
- heat energy is used to cause a change of state in a liquid resulting in the production of bubbles which cause liquid to be discharged from a discharge opening as droplets which adhere to a recording surface to enable recording of information such as characters and images.
- Non-impact recording methods have recently been receiving more attention because the recording process produces negligible noise.
- the so-called ink jet recording method (also called the liquid jet recording method) is a very promising method because it is capable of high-speed recording and, moreover, does not require a special fixation process to record on plain paper.
- Various systems using this method and apparatus for carrying out this method have been proposed. Some of these methods have been improved and put into commercial practice and efforts are still being made to make other methods practical.
- liquid jet recording methods described in, for example, Japanese Laid-open Patent Application No. 54-59936 (corresponding to US-A-4723129, US-A-4740796) and German Patent Application Publication No. 2843064 differ from other liquid jet recording methods in that heat energy is used to cause liquid droplet discharge.
- the application of heat energy to the liquid causes a change in state of the liquid.
- This state change results in a large increase in volume which forces liquid to be discharged as a droplet from a discharge opening (hereinafter referred to as an orifice) provided at, for example, a front end of a recording head unit.
- the liquid droplet is discharged from the orifice toward a recording medium on which it adheres to enable recording of information.
- the liquid jet recording method disclosed in JP-A-54-59936 can be very effectively applied to the so-called drop-on demand recording method and can be easily realised by providing multiple orifices at high density on the recording head unit over a width corresponding to the full line width of the recording region of the recording medium. This has the advantage of enabling high resolution and high quality images to be obtained at high speeds.
- An embodiment of the recording head of an apparatus for the above-described recording system is provided with a liquid discharge portion having an orifice for discharging ink droplets, a liquid ink path provided with a heat supplying portion communicating with the orifice for enabling heat energy to be applied to cause ink to be discharged from the orifice and an electro-thermal transducer corresponding to the heat-supplying portion for generating the heat energy.
- a typical example of this electro-thermal transducer comprises a pair of electrodes, a heat generating resistance layer connected to these electrodes and a heat generating region (a heat generating portion) provided at a position corresponding to the portion between the electrodes.
- the heat generating resistance layer and electrodes are generally formed as layers on the surface portion of the base plate of the ink jet recording head.
- An example of a prior-art construction of the base plate in which such an electro-thermal transducer is formed is shown in Figures 1A and 1B of the accompanying drawings and will be described hereinafter with reference to these figures.
- Figure 1A is a partial plan view showing the vicinity of an electro-thermal transducer on a substrate (hereinafter also referred to as the base plate) of an ink jet recording head
- Figure 1B is a partial cross-sectional view of the portion indicated by dot-and-dash line XY in Figure 1A.
- the base plate 101 is formed by a lower layer 106, a heat generating resistance layer 107, electrodes 103, 104, a first upper protective layer 108, a second upper protective layer 109 and a third upper protective layer 110 provided in succession on a supporting member 105.
- the heat generating resistance layer 107 and electrodes 103 and 104 are patterned into a predetermined shape by etching. Thus, in portions other than the portion forming the heat generating region 102, these layers are patterned almost into one and the same shape. In the portion forming the heat generating region 102, the electrodes are not provided and the heat generating resistance layer 107 forms a heat generating portion 111.
- the first upper protective layer 110 are provided over the whole surface of the base plate 101, while the second upper protective layer 109 is patterned so as not to be provided on the heat generating region 102.
- each layer provided on the surface portion of the base plate as described above is suitably chosen based on the characteristics, such as heat-resistance, liquid-resistance, heat conductivity and insulative properties, required for the respective portion or layer.
- the main function of the first upper protective layer 108 in the above-described example of the prior art is to provide the insulation between the common electrode 103 and the selected electrode 104.
- the main function of the second upper protective layer 109 is to prevent the permeation of liquid and to provide liquid-resistance.
- the main function of the third upper protective layer 110 is to reinforce liquid-resistance and mechanical strength.
- the third protective layer 110 is in contact with ink, and care must be taken with regard to the effect on insulative properties and the like of defects in the film forming this layer.
- Possible defects are pin-holes and dust in the film.
- pin-holes may be removed by anode-oxidizing the surface of the film portion, but the effect of entry of dust into the film cannot be sufficiently removed.
- the first and third protective layers 108 and 110 need to be thin (for example, 3 ⁇ m at greatest) for efficient heat conduction.
- the vacuum accumulation method is therefore preferred for forming these layers. Because of the system used, it is not possible to avoid a certain probability of entry of dust into a film formed using the vacuum accumulation method. This is because, for example, when a vacuum is established or re-established in a vacuum container after film formation, part of the film which has peeled from the wall of the vacuum container adheres to the base plate and forms dust in the film.
- the presence of defects in the protective layers of the heat generating portion due to the entry of dust into the film significantly reduces the durability of the head.
- the base plate is one on which, for example, about twenty-four heat discharging portions are formed, the probability of the base plate becoming unsatisfactory is low and therefore, it will pose no problem in terms of yield to regard base plates containing dust as being unsatisfactory.
- the probability of heat discharging portions which suffer from the entry of dust into the base plate may become high and if all of these are regarded as being unsatisfactory a reduction in yield will result.
- the short-circuiting wiring portion is cut by the use of a laser beam to separate the wirings.
- a laser beam results, as shown in Figures 2A-1 and 2B-1 of the accompanying drawings, in damage to the heat generating resistance layer 202 on the support member 201 of the substrate for recording head, so forming a large hole (recess) 206.
- the ink may sometimes permeate into the portion where the hole 206 is formed, so corroding the electrodes 203, and finally sometimes leading to the disconnection of the wirings.
- the reference numeral 205 designates that portion of the electrode which has been corroded by the ink.
- Patent Abstracts of Japan Vol. 6, No. 86 (M-131) 25/201782 & JP-A-57 024 274 discloses a method of manufacturing a liquid jet recording head wherein a heating resistor layer is patterned by a laser beam melting method before or after an electrode layer is patterned by etching.
- a method of manufacturing a substrate for a liquid jet recording head having a support member, an electro-thermal transducer provided on said support member and having a heat generating resistance layer and electrodes connected to said heat generating resistance layer, including cutting away a short-circuited wiring portion of said electrodes; characterised by the steps of: providing a filler in a recess created by said cutting step; and providing a protective layer on said filler and said electrodes.
- a method of manufacturing a substrate for an ink jet recording head in accordance with the invention enables the provision of a recording head which is free of the possibility of recording liquid permeating from a recess created by the short-circuited wiring portion of electrodes being cut to thereby corrode the wiring and which is high in reliability.
- the present invention also provides a substrate for a liquid jet recording head in accordance with claim 7 and a liquid jet recording head in accordance with claim 8.
- the filler is embedded into the recess created in the support member by cutting the short-circuited wiring portion of the electrodes by a laser beam or the like, whereby the great level difference of the recess is eliminated, and the protective layer is provided on the embedded filler and the electrodes so that the covering property of the protective layer may be improved and therefore, the permeation of recording liquid into the electrodes can be eliminated to thereby prevent the corrosion of the electrodes.
- an insulating material is used as the embedded filler, whereby the reliability of the recording head during the long-term use thereof in the recording liquid can be improved.
- Figures 3A and 3B are a top plan view and a side cross-sectional view, respectively, of a base plate (also called a substrate) for a recording head.
- a base plate also called a substrate
- Figures 3A and 3B on a lower layer comprising SiO 2 on which a supporting member 105 comprising Si is formed, a heat generating resistance member, a layer comprising HfB 2 and Al conductive layer to form electrode are formed by the use of the vacuum thin film making technique.
- the patterns of a heat generaitng resistance member 102 and electrodes 103 and 104 are formed by the photolithography technique.
- a first protective layer 108 formed of SiO 2 is formed with a thickness of 0.5 ⁇ m by sputtering.
- the base plate is inspected by means of an optical microscope, and the base plate having a defect 112 in the protective layer 108 for the heat generating resistance member 102 is extracted.
- This extracted base plate is then placed into a powerful ultrasonic wave tank, and dust (foreign substance) in the defect 112 is removed.
- the reference character 112A designates the pore from which the foreign substance has been removed.
- the base plate is placed into a vacuum chamber and silane (SiH 4 ) and NO 2 are poured thereinto to provide an atmosphere of 1 Torr.
- a laser beam is applied to the pore 112A, and in this portion, silane (SiH 4 ) and NO 2 are caused to react to each other.
- a filler 113 comprising SiO 2 is accumulated in the pore 112A.
- the amount of SiO 2 accumulated in the pore is adjusted by adjusting the application time of the laser beam.
- upper protective layers 109 and 110 are formed as shown in Figure 6, whereupon the manufacturing process for the base plate is completed.
- SiO 2 layer 116 is formed into film having a thickness of 0.5 ⁇ m on the base plate as shown in Figure 4 by sputtering.
- Resist 114 (OFPR 800; trade name, manufactured by TOK Co., Ltd.) is then applied with a thickness of 4 ⁇ m by spin coat. A pattern having a window 114A formed corresponding to the pore is formed by the photolithography technique.
- resist 115 (OFPR 800; trade name, manufactured by TOK Co., Ltd.) is applied with a thickness of 1 ⁇ m by spin coat. The thickness of the resist 115 applied later is smaller than the thickness of the resist 114 applied earlier and therefore is not flattened, but assumes a shape as shown in Figure 8.
- CF 4 and H 2 are poured at a ratio of 1 : 1 by the use of a reactive ion etching apparatus, and etching is effected at a power of 400 W.
- the etching speed of the resist is 500 ⁇ /min. and that of SiO 2 is 500 ⁇ /min. and therefore, the resist and SiO 2 are etched at an equal speed.
- that portion of the heat generating resistance member to which the resist has been applied is such that the thickness of SiO 2 116 is 0.5 ⁇ m, whereas the thickness of the resist 115 is 1 ⁇ m and therefore, the surface formed by etching becomes flat and accordingly, the resist is etched while keeping its original shape.
- etching is terminated.
- the shape of the base plate becomes such as shown in Figure 9.
- the resists 114 and 115 are peeled off, and a second protective layer 109 formed of organic polyimide is formed as a protective layer for electrodes 103 and 104.
- Ta is formed into film as a third protective layer 110 by sputtering, to thereby provide such a shape as shown in Figure 10.
- a recording head constructed of a base plate having a defect of about 3 ⁇ m diameter.
- the applied pulse use was made of a rectangular pulse having a frequency of 2 kHz and a pulse width of 10 ⁇ s, and the applied voltage was 1.2 times as great as the voltage value for ordinary discharge.
- the life of the recording head filled pore was more than 5 times that of the comparative example.
- the defects of the base plate can be reduced and the yield is improved with a result that the manufacturing cost of the recording head can be reduced.
- Figures 11A-1 to 11A-4 and 11B-1 to 11B-4 show the steps of an embodiment of the present invention
- Figures 11A-1 to 11A-4 are plan views showing the course of the steps
- Figures 11B-1 to 11B-4 are corresponding cross-sectional views along line X - Y in Figures 11A-1 to 11A-4 which show the course of the steps.
- the reference numeral 201 designates a support member for a substrate (also called a base plate) 201A for a recording head
- the reference numeral 201B denotes a lower layer formed on the support member
- the reference numeral 202 denotes a heat generating resistance layer provided on the lower layer 201B
- the reference numeral 203 designates lead-out electrodes of aluminum connected to the heat generating resistance layer 202
- the reference numeral 204 denotes an upper protective layer formed of SiO 2 and provided on the heat generating resistance layer 202 and the electrodes 203
- the reference numeral 206 designates a hole (a recess) created in the support member 201 by cutting by a laser beam
- the reference numeral 207 denotes a short-circuited wiring portion
- the reference numeral 208 designates a filler formed of an insulating material such as SiO 2 embedded in the hole 206.
- the electro-thermal transducer has at least the heat generating resistance layer 202 and the electrodes
- the heat generating resistance layer 202 formed of HfB 2 is laminated on the lower layer 201B formed of heat-oxidized SiO 2 on the Si (silicon) support member 201, and the electrodes 203 of aluminum are deposited thereon by evaporation with a thickness of 500 nm (5000 ⁇ ) and are subjected to patterning and wiring.
- the portion 207 is short-circuited.
- this short-circuited wiring portion 207 is cut by a laser beam.
- the short-circuited wiring portion 207 was actually short three times by a laser beam having a wavelength of 1.06 ⁇ m, a beam intensity of 20 mJ/pulse and a pulse width of 20 nS, the short-circuited wiring portion 207 could be cut.
- Figure 11A-2 shows the state of that portion after cut, and it is seen that as shown in Figure 11B-2, a hole 206 is formed on the support member 201 at the cut portion thereof.
- the insulating material 208 as a filler is embedded into this hole 206.
- the depth of the hole 206 is 2 ⁇ m. Therefore, the substrate 201 - 204 is placed into a vacuum chamber, not shown, and a mixture gas of silane (SiH 4 ) and nitrogen dioxide (NO 2 ) is caused to flow into the chamber to thereby provide an atmosphere of 1 Torr.
- SiH 4 silane
- NO 2 nitrogen dioxide
- FIG. 11A-3 The state in which the hole 206 has been filled with the insulating material 208 which is SiO 2 by such laser CVD (vapor phase growing method) is shown in Figure 11A-3.
- the filler 208 which is the insulating material is formed with said application time adjusted so that there may hardly be provided a level difference with respect to the height of the electrodes 203 of the wiring.
- the layer 204 of SiO 2 as an upper protective layer is formed with a thickness of 1 ⁇ m on the filler 208 and the electrodes 203 by the sputtering method.
- the protective layer 204 of SiO 2 sufficiently covers the hole 206 formed by cutting the short-circuited wiring portion of the electrodes 203 by the laser beam and the lead-out electrodes 203.
- Figure 12 shows an example of a recording head made by forming discharge openings of recording liquid in the recording head substrate made in this manner, and actually mounting an integrated circuit thereon.
- the reference numeral 211 designates heat generating portions (heater portions)
- the reference numeral 402 denotes discharge opening
- the reference numeral 403 designates an ink path wall forming liquid paths
- the reference numeral 404 denotes a common liquid chamber
- the reference numeral 405 designates a top plate
- the reference numeral 406 denotes ink supply ports.
- the liquid jet recording head shown in Figure 12 was subjected to an ink permeation test for a long period of time, but there occurred no corrosion of the electrodes 203 by the permeation of ink from the portion in which the hole 206 was created, i.e., the portion filled with the filler 208. Accordingly, it could be confirmed that the reliability of the recording head can be enhanced by filling the recess created in that portion of the support member in which the short-circuited wiring portion was cut by the laser beam as in the present embodiment with a filler such as an insulating material.
- the filler embedded into the hole may preferably be an insulating material, because there is the possibility of short-circuiting being caused between the wirings if the filler is not an insulating material.
- the insulating material embedded into the recess is SiO 2 , but of course, another insulating material may be used. That is, at least one kind selected from SiO 2 , Si 3 N 4 , SiC, Ta 2 O 5 , Al 2 O 3 , AlN, BN, B 2 O 3 , BeO, TiN, TiO 2 and WO 3 can be used as a preferred material.
- the direction of ink discharge is the surface direction of the heater portion 211, but the present invention is also applicable to a liquid jet recording head as shown in Figure 13 wherein ink is discharged in a direction almost perpendicular to the heater portion 211.
- the recess formed in the support member of the substrate by cutting the short-circuited wiring portion by a laser beam or the like is filled with a filler and the great level difference of the recess is eliminated so that the covering property of the upper protective layer for protecting the wiring may be improved and therefore, the permeation of the recording liquid into the electrode wiring portion can be prevented and the wiring is not corroded with a result that disconnection does not occur and the long-term reliability of the recording head can be improved.
- FIG 14 is a schematic perspective view showing an example of the ink jet recording apparatus IJRA to which the present invention is applied.
- a carriage HC which engages with a spiral groove 5004 of a lead screw 5005 being rotatable through driving force transmitting gears 5011, 5009 in conjunction with the reciprocal rotation of a drive motor 5013 has a pin (not shown) and is reciprocated in the directions of arrows a, b.
- 5002 is a paper holding plate and presses paper against a platen 5000 throughout the range of the movement of the carriage.
- 5007, 5008 are photocouplers, which are used as home position detecting means for detecting the presence of the lever 5006 of the carriage in the predetermined area to switch the direction of rotation of the motor 5013.
- 5016 is a member which holds a capping member 5022 for capping the front surface of a cartridge recording head IJC integrally provided with an ink tank.
- 5015 is a suction means for suction of the inside of the cap and effects suction recovery of the head through a opening 5023 in the cap.
- 5017 is a cleaning blade and 5019 is a member for moving the blade forward and afterward, the both being supported on a mainbody supporting member 5018.
- the shape of the blade is not limited to that shown in the figure, and any one of well known blades may be employed for this example.
- a lever for starting suction for suction recovery which moves in conjunction with the movement of a cam 5020 engaged with the carriage, whereby the driving force of the drive motor is transmitted by a conventional transmitting means such as clutch transfer and the like to be utilized for control.
- the present invention brings about excellent effects particularly in a recording head, recording device of the bubble jet system among the ink jet recording system.
- the on-demand type is effective because, by applying at least one driving signal which gives rapid temperature elevation exceeding nucleus boiling corresponding to the recording information on an electricity-heat convertors arranged corresponding to the sheets or liquid channels holding liquid (ink), heat energy is generated at the electricity-heat converters to effect film boiling at the heat acting surface of the recording head, and consequently the bubbles within the liquid (ink) can be formed corresponding one by one to the driving signals.
- the constitution of the recording head in addition to the combination constitutions of discharging orifice, liquid channel, electricity-heat converter (linear liquid channel or right angle liquid channel) as disclosed in the above-mentioned respective specifications, the constitution by use of U.S. Patent 4,558,333, 4,459,600 disclosing the constitution having the heat acting portion arranged in the flexed region is also included in the present invention.
- the present invention can be also effectively made the constitution as disclosed in Japanese Patent Laid-Open Application No. 59-123670 which discloses the constitution using a slit common to a plurality of electricity-heat converters as the discharging portion of the electricity-heat converter or Japanese Patent laid-Open Application No. 59-138461 which discloses the constitution having the opening for absorbing pressure wave of heat energy correspondent to the discharging portion.
- the recording head of the full line type having a length corresponding to the maximum width of recording medium which can be recorded by the recording device
- either the constitution which satisfies its length by combination of a plurality of recording heads as disclosed in the above-mentioned specifications or the constitution as one recording head integrally formed may be used, and the present invention can exhibit the effects as described above further effectively.
- the present invention is effective for a recording head of the freely exchangeable chip type which enables electrical connection to the main device or supply of ink from the main device by being mounted on the main device, or for the case by use of a recording head of the cartridge type provided integrally on the recording head itself.
- a restoration means for the recording head, a preliminary auxiliary means, etc. provided as the constitution of the recording device of the present invention is preferable, because the effect of the present invention can be further stabilized.
- Specific examples of these may include, for the recording head, capping means, cleaning means, pressurization or aspiration means, electricity-heat converters or another heating element or preliminary heating means according to a combination of these, and it is also effective for performing stable recording to perform preliminary mode which performs discharging separate from recording.
- the present invention is extremely effective for not only the recording mode only of a primary stream color such as black etc., but also a device equipped with at least one of plural different colors or full color by color mixing, whether the recording head may be either integrally constituted or combined in plural number.
- any ink which is solid or softened at room temperature may also be used in the present invention.
- the ink jet recording apparatus it is a common practice to control the temperature of ink itself within a range of 30 to 70 °C, thus adjusting the viscosity of the ink to be within the stable ejection range. Accordingly any ink which is liquid upon applying a recording signal may be used. Furthermore, any ink which is liquefied upon application of thermal energy may also be used in the present invention.
- Such a type of inks include, for example, one which upon application of thermal energy depending on recording signal, is liquefied to be ejected in the form of ink droplet and one which is being solidified at the time of arriving at a recording medium.
- Such a type of inks are used for the purpose of, for example, positively utilizing thermal energy as the energy for phase change of ink from solid to liquid to prevent temperature elevation due to thermal energy or using an ink which is solidified when left to stand to prevent evaporation of ink.
- the ink When such an ink is to be used, the ink may be held in the form of liquid or solid in recessed portions or through holes of a porous sheet while facing the electro-thermal transducer as shown in, for example, Japanese Laid-Open Patent Application Nos. 54-56847 and 60-71260.
- the most useful system for use of the inks as described above is the system effecting film boiling as described above.
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Abstract
Description
- This invention relates to a method of manufacturing a substrate for a liquid jet recording head and to a substrate and a liquid jet recording head manufactured by the method. In a liquid jet recording head heat energy is used to cause a change of state in a liquid resulting in the production of bubbles which cause liquid to be discharged from a discharge opening as droplets which adhere to a recording surface to enable recording of information such as characters and images.
- Non-impact recording methods have recently been receiving more attention because the recording process produces negligible noise. Among these, the so-called ink jet recording method (also called the liquid jet recording method) is a very promising method because it is capable of high-speed recording and, moreover, does not require a special fixation process to record on plain paper. Various systems using this method and apparatus for carrying out this method have been proposed. Some of these methods have been improved and put into commercial practice and efforts are still being made to make other methods practical.
- Among these, the liquid jet recording methods described in, for example, Japanese Laid-open Patent Application No. 54-59936 (corresponding to US-A-4723129, US-A-4740796) and German Patent Application Publication No. 2843064 differ from other liquid jet recording methods in that heat energy is used to cause liquid droplet discharge.
- Thus, typically, in the recording methods disclosed in the above-mentioned publications, the application of heat energy to the liquid causes a change in state of the liquid. This state change results in a large increase in volume which forces liquid to be discharged as a droplet from a discharge opening (hereinafter referred to as an orifice) provided at, for example, a front end of a recording head unit. The liquid droplet is discharged from the orifice toward a recording medium on which it adheres to enable recording of information.
- The liquid jet recording method disclosed in JP-A-54-59936 can be very effectively applied to the so-called drop-on demand recording method and can be easily realised by providing multiple orifices at high density on the recording head unit over a width corresponding to the full line width of the recording region of the recording medium. This has the advantage of enabling high resolution and high quality images to be obtained at high speeds.
- An embodiment of the recording head of an apparatus for the above-described recording system is provided with a liquid discharge portion having an orifice for discharging ink droplets, a liquid ink path provided with a heat supplying portion communicating with the orifice for enabling heat energy to be applied to cause ink to be discharged from the orifice and an electro-thermal transducer corresponding to the heat-supplying portion for generating the heat energy.
- A typical example of this electro-thermal transducer comprises a pair of electrodes, a heat generating resistance layer connected to these electrodes and a heat generating region (a heat generating portion) provided at a position corresponding to the portion between the electrodes. The heat generating resistance layer and electrodes are generally formed as layers on the surface portion of the base plate of the ink jet recording head. An example of a prior-art construction of the base plate in which such an electro-thermal transducer is formed is shown in Figures 1A and 1B of the accompanying drawings and will be described hereinafter with reference to these figures.
- Figure 1A is a partial plan view showing the vicinity of an electro-thermal transducer on a substrate (hereinafter also referred to as the base plate) of an ink jet recording head, and Figure 1B is a partial cross-sectional view of the portion indicated by dot-and-dash line XY in Figure 1A.
- In these figures, the
base plate 101 is formed by alower layer 106, a heatgenerating resistance layer 107,electrodes protective layer 108, a second upperprotective layer 109 and a third upperprotective layer 110 provided in succession on a supportingmember 105. - The heat generating
resistance layer 107 andelectrodes heat generating region 102, these layers are patterned almost into one and the same shape. In the portion forming theheat generating region 102, the electrodes are not provided and the heat generatingresistance layer 107 forms aheat generating portion 111. The first upperprotective layer 110 are provided over the whole surface of thebase plate 101, while the second upperprotective layer 109 is patterned so as not to be provided on theheat generating region 102. - The material used for forming each layer provided on the surface portion of the base plate as described above is suitably chosen based on the characteristics, such as heat-resistance, liquid-resistance, heat conductivity and insulative properties, required for the respective portion or layer. The main function of the first upper
protective layer 108 in the above-described example of the prior art is to provide the insulation between thecommon electrode 103 and theselected electrode 104. The main function of the second upperprotective layer 109 is to prevent the permeation of liquid and to provide liquid-resistance. The main function of the third upperprotective layer 110 is to reinforce liquid-resistance and mechanical strength. - Now, of the first and third
protective layers protective layer 110 is in contact with ink, and care must be taken with regard to the effect on insulative properties and the like of defects in the film forming this layer. Possible defects are pin-holes and dust in the film. As shown in Japanese Patent Application Publication No. 60-157872 (corresponding to US-A-4777494), pin-holes may be removed by anode-oxidizing the surface of the film portion, but the effect of entry of dust into the film cannot be sufficiently removed. - In the ink jet system in which heat is used to generate liquid droplets, the first and third
protective layers - Where about twenty-four heat discharging portions are formed on a base plate, the probability of the base plate being unsatisfactory because of the incorporation of dust is not extremely high. Therefore, few problems will result if dust in such a base plate causes the base plate to be considered unsatisfactory. However, where one thousand or more heat discharging portions are formed on a base plate, the possibility of dust in the base plate may become high and therefore may cause many problems. In either case, the durability of the head itself may become bad because of the entry of dust into the film. Thus, if dust is present in the film, the force occurring during the collapse of an ink-discharging bubble may cause the dust to separate from the film, resulting in a pin-hole. Ink may then enter such a pin-hole and so may come into contact with the heat discharging portion and react therewith. This may result in the heat discharging portion becoming disconnected.
- Thus, the presence of defects in the protective layers of the heat generating portion due to the entry of dust into the film, significantly reduces the durability of the head. Again, in such a case, if the base plate is one on which, for example, about twenty-four heat discharging portions are formed, the probability of the base plate becoming unsatisfactory is low and therefore, it will pose no problem in terms of yield to regard base plates containing dust as being unsatisfactory. However in the case of, for example, a base plate on which one thousand or more heat discharging portions are formed, the probability of heat discharging portions which suffer from the entry of dust into the base plate may become high and if all of these are regarded as being unsatisfactory a reduction in yield will result.
- When a short-circuit occurs between wirings during the manufacture of a liquid jet recording head as described above, the short-circuiting wiring portion is cut by the use of a laser beam to separate the wirings. However, the use of such a laser beam results, as shown in Figures 2A-1 and 2B-1 of the accompanying drawings, in damage to the heat generating
resistance layer 202 on thesupport member 201 of the substrate for recording head, so forming a large hole (recess) 206. An upperprotective layer 204 formed near thewirings 203 by a film forming method such sputtering in order to protect the wirings from the recording liquid (ink) cannot sufficiently cover thewiring 203 in the vicinity of thislarge hole 206. - Therefore, as indicated by arrow K in Figure 2B-2 of the accompanying drawings, during the use, the ink may sometimes permeate into the portion where the
hole 206 is formed, so corroding theelectrodes 203, and finally sometimes leading to the disconnection of the wirings. Thereference numeral 205 designates that portion of the electrode which has been corroded by the ink. - An attempt has been made to provide a second upper protective layer on the
protective layer 204. However, in the case of such a large hole 206 (usually having a depth of 1 µm or more), bubbles have collected there or have been repelled by the protective film, and the wirings cannot be well covered even with the second upper protective layer. Also, aluminum has heretofore generally been used for the wirings. Attempts have been made to find electrically conductive materials other than aluminum to prevent the above-described corrosion. However, anticorrosive conductive materials which are optimum in respect of manufacturing costs, workability and resistivity characteristics have not yet been discovered. - Thus, heretofore, it has happened that the ink has permeated from the portion in which the wirings have been cut by a laser beam and the wirings have corroded and thereby become disconnected, and this has sometimes reduced the reliability of the recording head.
- Patent Abstracts of Japan Vol. 6, No. 86 (M-131) 25/05/82 & JP-A-57 024 274 discloses a method of manufacturing a liquid jet recording head wherein a heating resistor layer is patterned by a laser beam melting method before or after an electrode layer is patterned by etching.
- According to the invention there is provided a method of manufacturing a substrate for a liquid jet recording head having a support member, an electro-thermal transducer provided on said support member and having a heat generating resistance layer and electrodes connected to said heat generating resistance layer, including cutting away a short-circuited wiring portion of said electrodes; characterised by the steps of: providing a filler in a recess created by said cutting step; and providing a protective layer on said filler and said electrodes.
- A method of manufacturing a substrate for an ink jet recording head in accordance with the invention enables the provision of a recording head which is free of the possibility of recording liquid permeating from a recess created by the short-circuited wiring portion of electrodes being cut to thereby corrode the wiring and which is high in reliability.
- The present invention also provides a substrate for a liquid jet recording head in accordance with claim 7 and a liquid jet recording head in accordance with claim 8.
- In this manner the filler is embedded into the recess created in the support member by cutting the short-circuited wiring portion of the electrodes by a laser beam or the like, whereby the great level difference of the recess is eliminated, and the protective layer is provided on the embedded filler and the electrodes so that the covering property of the protective layer may be improved and therefore, the permeation of recording liquid into the electrodes can be eliminated to thereby prevent the corrosion of the electrodes. Also, an insulating material is used as the embedded filler, whereby the reliability of the recording head during the long-term use thereof in the recording liquid can be improved.
- In the accompanying drawings:
- Figures 1A and 1B are a top plan view and a cross-sectional view, respectively, showing the construction of a base plate for ink jet head for the purpose of reference.
- Figures 2A-1, 2A-2 and 2B-1, 2B-2 are views showing for reference purposes a main portion of an ink jet apparatus.
- Figures 3A and 3B show for reference only a top plan view of a base plate and a cross-sectional view, respectively, taken along line X-Y in the plan view.
- Figures 4 to 6 show for reference cross-sectional views illustrating the process of filling a pore.
- Figures 7 to 10 show for reference cross-sectional views illustrating the process of filling a pore.
- Figures 11A-1, 11A-2, 11A-3, 11A-4 and 11B-1, 11B-2, 11B-3, 11B-4 are plan views and cross-sectional views, respectively, showing the steps of an embodiment of the present invention.
- Figure 12 shows for reference a fragmentary perspective view of a recording head.
- Figure 13 shows for reference a perspective view of a further recording head.
- Figure 14 is a sectional view showing a known printer to which a substrate for an ink jet recording head of the present invention may be applied.
- Figures 3A and 3B are a top plan view and a side cross-sectional view, respectively, of a base plate (also called a substrate) for a recording head. In these figures, feature elements similar to those shown in Figures 1A and 1B are given similar reference numerals and need not be described. In Figures 3A and 3B, on a lower layer comprising SiO2 on which a supporting
member 105 comprising Si is formed, a heat generating resistance member, a layer comprising HfB2 and Al conductive layer to form electrode are formed by the use of the vacuum thin film making technique. Subsequently, the patterns of a heatgeneraitng resistance member 102 andelectrodes protective layer 108 formed of SiO2 is formed with a thickness of 0.5 µm by sputtering. - After the first
protective layer 108 has been formed, the base plate is inspected by means of an optical microscope, and the base plate having adefect 112 in theprotective layer 108 for the heat generatingresistance member 102 is extracted. This extracted base plate is then placed into a powerful ultrasonic wave tank, and dust (foreign substance) in thedefect 112 is removed. The result is shown in Figure 4, wherein thereference character 112A designates the pore from which the foreign substance has been removed. - Then, in order to fill a filler in this pore, the base plate is placed into a vacuum chamber and silane (SiH4) and NO2 are poured thereinto to provide an atmosphere of 1 Torr. Subsequently, a laser beam is applied to the
pore 112A, and in this portion, silane (SiH4) and NO2 are caused to react to each other. As a result, as shown in Figure 5, afiller 113 comprising SiO2 is accumulated in thepore 112A. The amount of SiO2 accumulated in the pore is adjusted by adjusting the application time of the laser beam. When the filling of the pore is completed, upperprotective layers - As another example of filling the pore, there is a method as shown below.
- As shown in Figure 7, SiO2 layer 116 is formed into film having a thickness of 0.5 µm on the base plate as shown in Figure 4 by sputtering. Resist 114 (OFPR 800; trade name, manufactured by TOK Co., Ltd.) is then applied with a thickness of 4 µm by spin coat. A pattern having a
window 114A formed corresponding to the pore is formed by the photolithography technique. Further, resist 115 (OFPR 800; trade name, manufactured by TOK Co., Ltd.) is applied with a thickness of 1 µm by spin coat. The thickness of the resist 115 applied later is smaller than the thickness of the resist 114 applied earlier and therefore is not flattened, but assumes a shape as shown in Figure 8. - Thereafter, CF4 and H2 are poured at a ratio of 1 : 1 by the use of a reactive ion etching apparatus, and etching is effected at a power of 400 W. At this time, the etching speed of the resist is 500 Å/min. and that of SiO2 is 500 Å/min. and therefore, the resist and SiO2 are etched at an equal speed. By this etching, that portion of the heat generating resistance member to which the resist has been applied is such that the thickness of
SiO 2 116 is 0.5 µm, whereas the thickness of the resist 115 is 1 µm and therefore, the surface formed by etching becomes flat and accordingly, the resist is etched while keeping its original shape. At a point of time whereat the resist is no longer etched in said portion of the heat generatingresistance member 102, etching is terminated. As a result, the shape of the base plate becomes such as shown in Figure 9. Subsequently, the resists 114 and 115 are peeled off, and a secondprotective layer 109 formed of organic polyimide is formed as a protective layer forelectrodes protective layer 110 by sputtering, to thereby provide such a shape as shown in Figure 10. - The result of the discharge durability test of a recording head having the shape as shown in Figure 12 made by the use of the substrate formed in the manner described above will be shown below.
- As a comparative example, use was made of a recording head constructed of a base plate having a defect of about 3 µm diameter. Also, as the applied pulse, use was made of a rectangular pulse having a frequency of 2 kHz and a pulse width of 10 µs, and the applied voltage was 1.2 times as great as the voltage value for ordinary discharge.
- As a result, in the above mentioned two examples, the life of the recording head filled pore was more than 5 times that of the comparative example.
- As is apparent from the foregoing description, the insulation between the ink and the electro-thermal transducer is reliably ensured.
- As a result, it becomes difficult for the disconnection or the like of the electro-thermal transducer to occur with the use of the recording head, and the durability of the recording head is extremely improved.
- Also, the defects of the base plate can be reduced and the yield is improved with a result that the manufacturing cost of the recording head can be reduced.
- Figures 11A-1 to 11A-4 and 11B-1 to 11B-4 show the steps of an embodiment of the present invention, and Figures 11A-1 to 11A-4 are plan views showing the course of the steps, and Figures 11B-1 to 11B-4 are corresponding cross-sectional views along line X - Y in Figures 11A-1 to 11A-4 which show the course of the steps. The
reference numeral 201 designates a support member for a substrate (also called a base plate) 201A for a recording head, thereference numeral 201B denotes a lower layer formed on the support member, thereference numeral 202 denotes a heat generating resistance layer provided on thelower layer 201B, thereference numeral 203 designates lead-out electrodes of aluminum connected to the heat generatingresistance layer 202, thereference numeral 204 denotes an upper protective layer formed of SiO2 and provided on the heat generatingresistance layer 202 and theelectrodes 203, thereference numeral 206 designates a hole (a recess) created in thesupport member 201 by cutting by a laser beam, thereference numeral 207 denotes a short-circuited wiring portion, and thereference numeral 208 designates a filler formed of an insulating material such as SiO2 embedded in thehole 206. The electro-thermal transducer has at least the heat generatingresistance layer 202 and theelectrodes 203. - First, when manufacturing a recording head, the heat generating
resistance layer 202 formed of HfB2 is laminated on thelower layer 201B formed of heat-oxidized SiO2 on the Si (silicon)support member 201, and theelectrodes 203 of aluminum are deposited thereon by evaporation with a thickness of 500 nm (5000 Å) and are subjected to patterning and wiring. In this process, in Figure 11A-1, theportion 207 is short-circuited. - Subsequently, this short-circuited
wiring portion 207 is cut by a laser beam. When the short-circuitedwiring portion 207 was actually short three times by a laser beam having a wavelength of 1.06 µm, a beam intensity of 20 mJ/pulse and a pulse width of 20 nS, the short-circuitedwiring portion 207 could be cut. Figure 11A-2 shows the state of that portion after cut, and it is seen that as shown in Figure 11B-2, ahole 206 is formed on thesupport member 201 at the cut portion thereof. - Subsequently, the insulating
material 208 as a filler is embedded into thishole 206. It is to be understood that the depth of thehole 206 is 2 µm. Therefore, the substrate 201 - 204 is placed into a vacuum chamber, not shown, and a mixture gas of silane (SiH4) and nitrogen dioxide (NO2) is caused to flow into the chamber to thereby provide an atmosphere of 1 Torr. When a laser beam is applied to thehole 206, SiH4 (silane) and NO2 react to each other in thishole 206, wherebySiO 2 208 is accumulated therein. At that time, the application time of the laser beam is determined so that thehole 206 may be filled. The state in which thehole 206 has been filled with the insulatingmaterial 208 which is SiO2 by such laser CVD (vapor phase growing method) is shown in Figure 11A-3. As shown in this figure, particularly thefiller 208 which is the insulating material is formed with said application time adjusted so that there may hardly be provided a level difference with respect to the height of theelectrodes 203 of the wiring. - Subsequently, the
layer 204 of SiO2 as an upper protective layer is formed with a thickness of 1 µm on thefiller 208 and theelectrodes 203 by the sputtering method. As shown in Figures 11A-4 and 11B-4, theprotective layer 204 of SiO2 sufficiently covers thehole 206 formed by cutting the short-circuited wiring portion of theelectrodes 203 by the laser beam and the lead-outelectrodes 203. - Figure 12 shows an example of a recording head made by forming discharge openings of recording liquid in the recording head substrate made in this manner, and actually mounting an integrated circuit thereon. In this figure, the
reference numeral 211 designates heat generating portions (heater portions), thereference numeral 402 denotes discharge opening, thereference numeral 403 designates an ink path wall forming liquid paths, thereference numeral 404 denotes a common liquid chamber, thereference numeral 405 designates a top plate, and thereference numeral 406 denotes ink supply ports. - The liquid jet recording head shown in Figure 12 was subjected to an ink permeation test for a long period of time, but there occurred no corrosion of the
electrodes 203 by the permeation of ink from the portion in which thehole 206 was created, i.e., the portion filled with thefiller 208. Accordingly, it could be confirmed that the reliability of the recording head can be enhanced by filling the recess created in that portion of the support member in which the short-circuited wiring portion was cut by the laser beam as in the present embodiment with a filler such as an insulating material. - The filler embedded into the hole may preferably be an insulating material, because there is the possibility of short-circuiting being caused between the wirings if the filler is not an insulating material. However, in the above-described embodiment, the insulating material embedded into the recess is SiO2, but of course, another insulating material may be used. That is, at least one kind selected from SiO2, Si3N4, SiC, Ta2O5, Al2O3, AlN, BN, B2O3, BeO, TiN, TiO2 and WO3 can be used as a preferred material. Also, in the above-described all embodiments, as shown in Figure 12, the direction of ink discharge is the surface direction of the
heater portion 211, but the present invention is also applicable to a liquid jet recording head as shown in Figure 13 wherein ink is discharged in a direction almost perpendicular to theheater portion 211. - As described above, according to the present invention, the recess formed in the support member of the substrate by cutting the short-circuited wiring portion by a laser beam or the like is filled with a filler and the great level difference of the recess is eliminated so that the covering property of the upper protective layer for protecting the wiring may be improved and therefore, the permeation of the recording liquid into the electrode wiring portion can be prevented and the wiring is not corroded with a result that disconnection does not occur and the long-term reliability of the recording head can be improved.
- Figure 14 is a schematic perspective view showing an example of the ink jet recording apparatus IJRA to which the present invention is applied. A carriage HC which engages with a
spiral groove 5004 of alead screw 5005 being rotatable through drivingforce transmitting gears drive motor 5013 has a pin (not shown) and is reciprocated in the directions of arrows a, b. 5002 is a paper holding plate and presses paper against a platen 5000 throughout the range of the movement of the carriage. 5007, 5008 are photocouplers, which are used as home position detecting means for detecting the presence of thelever 5006 of the carriage in the predetermined area to switch the direction of rotation of themotor 5013. 5016 is a member which holds acapping member 5022 for capping the front surface of a cartridge recording head IJC integrally provided with an ink tank. 5015 is a suction means for suction of the inside of the cap and effects suction recovery of the head through aopening 5023 in the cap. 5017 is a cleaning blade and 5019 is a member for moving the blade forward and afterward, the both being supported on amainbody supporting member 5018. The shape of the blade is not limited to that shown in the figure, and any one of well known blades may be employed for this example. 5012 is a lever for starting suction for suction recovery, which moves in conjunction with the movement of acam 5020 engaged with the carriage, whereby the driving force of the drive motor is transmitted by a conventional transmitting means such as clutch transfer and the like to be utilized for control. - The present invention brings about excellent effects particularly in a recording head, recording device of the bubble jet system among the ink jet recording system.
- As to its representative constitution and principle, for example, one practiced by use of the basic principle disclosed in, for example, U.S. Patents 4,723,129 and 4,740,796 is preferred. This system is applicable to either of the so called on-demand type and the continuous type. Particularly, the case of the on-demand type is effective because, by applying at least one driving signal which gives rapid temperature elevation exceeding nucleus boiling corresponding to the recording information on an electricity-heat convertors arranged corresponding to the sheets or liquid channels holding liquid (ink), heat energy is generated at the electricity-heat converters to effect film boiling at the heat acting surface of the recording head, and consequently the bubbles within the liquid (ink) can be formed corresponding one by one to the driving signals. By discharging the liquid (ink) through an opening for discharging by growth and shrinkage of the bubble, at least one droplet is formed. By making the driving signals into pulse shapes, growth and shrinkage of the bubble can be effected instantly and adequately to accomplish more preferably discharging of the liquid (ink) particularly excellent in response characteristic. As the driving signals of such pulse shape, those as disclosed in U.S. Patents 4,463,359 and 4,345,262 are suitable. Further excellent recording can be performed by employment of the conditions described in U.S. Patent 4,313,124 of the invention concerning the temperature elevation rate of the above-mentioned heat acting surface.
- As the constitution of the recording head, in addition to the combination constitutions of discharging orifice, liquid channel, electricity-heat converter (linear liquid channel or right angle liquid channel) as disclosed in the above-mentioned respective specifications, the constitution by use of U.S. Patent 4,558,333, 4,459,600 disclosing the constitution having the heat acting portion arranged in the flexed region is also included in the present invention. In addition, the present invention can be also effectively made the constitution as disclosed in Japanese Patent Laid-Open Application No. 59-123670 which discloses the constitution using a slit common to a plurality of electricity-heat converters as the discharging portion of the electricity-heat converter or Japanese Patent laid-Open Application No. 59-138461 which discloses the constitution having the opening for absorbing pressure wave of heat energy correspondent to the discharging portion.
- Further, as the recording head of the full line type having a length corresponding to the maximum width of recording medium which can be recorded by the recording device, either the constitution which satisfies its length by combination of a plurality of recording heads as disclosed in the above-mentioned specifications or the constitution as one recording head integrally formed may be used, and the present invention can exhibit the effects as described above further effectively.
- In addition, the present invention is effective for a recording head of the freely exchangeable chip type which enables electrical connection to the main device or supply of ink from the main device by being mounted on the main device, or for the case by use of a recording head of the cartridge type provided integrally on the recording head itself.
- Also, addition of a restoration means for the recording head, a preliminary auxiliary means, etc. provided as the constitution of the recording device of the present invention is preferable, because the effect of the present invention can be further stabilized. Specific examples of these may include, for the recording head, capping means, cleaning means, pressurization or aspiration means, electricity-heat converters or another heating element or preliminary heating means according to a combination of these, and it is also effective for performing stable recording to perform preliminary mode which performs discharging separate from recording.
- Further, as the recording mode of the recording device, the present invention is extremely effective for not only the recording mode only of a primary stream color such as black etc., but also a device equipped with at least one of plural different colors or full color by color mixing, whether the recording head may be either integrally constituted or combined in plural number.
- In the examples of the present invention as set forth above, the use of liquid ink is discussed but any ink which is solid or softened at room temperature may also be used in the present invention. In the ink jet recording apparatus as described above it is a common practice to control the temperature of ink itself within a range of 30 to 70 °C, thus adjusting the viscosity of the ink to be within the stable ejection range. Accordingly any ink which is liquid upon applying a recording signal may be used. Furthermore, any ink which is liquefied upon application of thermal energy may also be used in the present invention. Such a type of inks include, for example, one which upon application of thermal energy depending on recording signal, is liquefied to be ejected in the form of ink droplet and one which is being solidified at the time of arriving at a recording medium. Such a type of inks are used for the purpose of, for example, positively utilizing thermal energy as the energy for phase change of ink from solid to liquid to prevent temperature elevation due to thermal energy or using an ink which is solidified when left to stand to prevent evaporation of ink. When such an ink is to be used, the ink may be held in the form of liquid or solid in recessed portions or through holes of a porous sheet while facing the electro-thermal transducer as shown in, for example, Japanese Laid-Open Patent Application Nos. 54-56847 and 60-71260. In the present invention, the most useful system for use of the inks as described above is the system effecting film boiling as described above.
Claims (9)
- A method of manufacturing a substrate for a liquid jet recording head having a support member (201), an electro-thermal transducer (211) provided on said support member and having a heat generating resistance layer (202) and electrodes connected to said heat generating resistance layer, including cutting away a short-circuited wiring portion of said electrodes, characterised by the steps of: providing a filler (208) in a recess created by said cutting step; and providing a protective layer (204) on said filler and said electrodes.
- A method of manufacturing a liquid jet recording head comprising manufacturing a substrate by the method of claim 1 and forming discharge openings (402) on the substrate.
- A method according to claim 1 or 2, characterised in that an insulating material is used as said filler.
- A method according to claim 3, which comprises providing the filler by laser chemical vapour deposition.
- A method according to claim 3 or 4, comprising using SiO2, Si3N4, SiC, Ta4O5, A12O3, A1N, BN, B2O3, BeO, TiN, TiO2 or WO3 as the insulating material.
- A method according to claim 1 or 2, characterised in that said step of cutting is effected by the use of a laser beam.
- A substrate for a liquid jet recording head, the substrate having a support member (201), an electro-thermal transducer (211) provided on said support member and having a heat generating resistance layer (202), and electrodes connected to said heat generating resistance layer and from which a short-circuited wiring portion has been cut-away, characterised in that a filler (208) is provided in a recess formed by the cutting away of the short-circuited wiring portion and a protective layer (204) is provided on said filler and said electrodes.
- A liquid jet recording head including a substrate having a support member (201), an electrothermal transducer (211) provided on said support member and having a heat generating resistance layer (202) and electrodes connected to said heat generating resistance layer and from which a short-circuited wiring portion has been cut-away, characterised in that a filler (208) is provided in a recess formed by the cutting away of the short-circuited wiring portion and a protective layer (204) is provided on said filler and said electrodes.
- A liquid jet recording apparatus having a liquid jet recording head in accordance with claim 8.
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4883989A JPH02227255A (en) | 1989-03-01 | 1989-03-01 | Manufacture of base material for liquid jet recording head, base material manufactured thereby and liquid jet recording head using the base material |
JP48838/89 | 1989-03-01 | ||
JP48839/89 | 1989-03-01 | ||
JP4883889A JP2659238B2 (en) | 1989-03-01 | 1989-03-01 | Ink jet recording head, substrate for the head, and method of manufacturing the substrate |
EP90302165A EP0390338B1 (en) | 1989-03-01 | 1990-02-28 | Method of manufacturing a substrate for a liquid jet recording head |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP90302165.7 Division | 1990-02-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0559295A1 EP0559295A1 (en) | 1993-09-08 |
EP0559295B1 true EP0559295B1 (en) | 1996-07-03 |
Family
ID=26389165
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP93201057A Expired - Lifetime EP0559295B1 (en) | 1989-03-01 | 1990-02-28 | Method of manufacturing a substrate for a liquid jet recording head |
EP90302165A Expired - Lifetime EP0390338B1 (en) | 1989-03-01 | 1990-02-28 | Method of manufacturing a substrate for a liquid jet recording head |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP90302165A Expired - Lifetime EP0390338B1 (en) | 1989-03-01 | 1990-02-28 | Method of manufacturing a substrate for a liquid jet recording head |
Country Status (3)
Country | Link |
---|---|
EP (2) | EP0559295B1 (en) |
AT (2) | ATE115051T1 (en) |
DE (2) | DE69027685T2 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5660739A (en) * | 1994-08-26 | 1997-08-26 | Canon Kabushiki Kaisha | Method of producing substrate for ink jet recording head, ink jet recording head and ink jet recording apparatus |
JPH09109392A (en) | 1995-10-13 | 1997-04-28 | Canon Inc | Manufacture of ink jet recording head, ink jet recording head manufactured by such manufacturing method and ink jet recorder |
RU2151066C1 (en) * | 1998-11-03 | 2000-06-20 | Самсунг Электроникс Ко., Лтд. | Microinjector nozzle plate assembly and method for its manufacture |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2473214A1 (en) * | 1980-01-04 | 1981-07-10 | Thomson Csf | VERY LOW LINE ONLINE RESISTANCE PLATE AND THERMAL PRINTING BAR USING THIS ONLINE RESISTANCE PLATE |
JPS59194867A (en) * | 1983-04-20 | 1984-11-05 | Canon Inc | Manufacture of liquid jet recording head |
US4707708A (en) * | 1985-09-27 | 1987-11-17 | Hitachi, Ltd. | Thermal print head |
-
1990
- 1990-02-28 EP EP93201057A patent/EP0559295B1/en not_active Expired - Lifetime
- 1990-02-28 DE DE69027685T patent/DE69027685T2/en not_active Expired - Fee Related
- 1990-02-28 EP EP90302165A patent/EP0390338B1/en not_active Expired - Lifetime
- 1990-02-28 AT AT90302165T patent/ATE115051T1/en not_active IP Right Cessation
- 1990-02-28 DE DE69014690T patent/DE69014690T2/en not_active Expired - Fee Related
- 1990-02-28 AT AT93201057T patent/ATE139940T1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP0390338B1 (en) | 1994-12-07 |
ATE115051T1 (en) | 1994-12-15 |
EP0390338A1 (en) | 1990-10-03 |
DE69014690D1 (en) | 1995-01-19 |
EP0559295A1 (en) | 1993-09-08 |
DE69027685T2 (en) | 1996-11-28 |
DE69014690T2 (en) | 1995-05-04 |
ATE139940T1 (en) | 1996-07-15 |
DE69027685D1 (en) | 1996-08-08 |
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