EP0559295B1 - Methode zur Herstellung eines Substrats für einen Flüssigkeitsstrahl-Aufzeichnungskopf - Google Patents

Methode zur Herstellung eines Substrats für einen Flüssigkeitsstrahl-Aufzeichnungskopf Download PDF

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Publication number
EP0559295B1
EP0559295B1 EP93201057A EP93201057A EP0559295B1 EP 0559295 B1 EP0559295 B1 EP 0559295B1 EP 93201057 A EP93201057 A EP 93201057A EP 93201057 A EP93201057 A EP 93201057A EP 0559295 B1 EP0559295 B1 EP 0559295B1
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EP
European Patent Office
Prior art keywords
recording head
jet recording
substrate
filler
electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP93201057A
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English (en)
French (fr)
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EP0559295A1 (de
Inventor
Hirokazu c/o Canon Kabushiki Kaisha Komuro
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Canon Inc
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Canon Inc
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Filing date
Publication date
Priority claimed from JP4883889A external-priority patent/JP2659238B2/ja
Priority claimed from JP4883989A external-priority patent/JPH02227255A/ja
Application filed by Canon Inc filed Critical Canon Inc
Publication of EP0559295A1 publication Critical patent/EP0559295A1/de
Application granted granted Critical
Publication of EP0559295B1 publication Critical patent/EP0559295B1/de
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • B41J2/14088—Structure of heating means
    • B41J2/14112—Resistive element
    • B41J2/14129—Layer structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1601—Production of bubble jet print heads
    • B41J2/1603—Production of bubble jet print heads of the front shooter type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1601—Production of bubble jet print heads
    • B41J2/1604—Production of bubble jet print heads of the edge shooter type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B41J2/1628—Manufacturing processes etching dry etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1632—Manufacturing processes machining
    • B41J2/1634—Manufacturing processes machining laser machining
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1642—Manufacturing processes thin film formation thin film formation by CVD [chemical vapor deposition]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1643—Manufacturing processes thin film formation thin film formation by plating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1645—Manufacturing processes thin film formation thin film formation by spincoating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1646—Manufacturing processes thin film formation thin film formation by sputtering

Definitions

  • This invention relates to a method of manufacturing a substrate for a liquid jet recording head and to a substrate and a liquid jet recording head manufactured by the method.
  • heat energy is used to cause a change of state in a liquid resulting in the production of bubbles which cause liquid to be discharged from a discharge opening as droplets which adhere to a recording surface to enable recording of information such as characters and images.
  • Non-impact recording methods have recently been receiving more attention because the recording process produces negligible noise.
  • the so-called ink jet recording method (also called the liquid jet recording method) is a very promising method because it is capable of high-speed recording and, moreover, does not require a special fixation process to record on plain paper.
  • Various systems using this method and apparatus for carrying out this method have been proposed. Some of these methods have been improved and put into commercial practice and efforts are still being made to make other methods practical.
  • liquid jet recording methods described in, for example, Japanese Laid-open Patent Application No. 54-59936 (corresponding to US-A-4723129, US-A-4740796) and German Patent Application Publication No. 2843064 differ from other liquid jet recording methods in that heat energy is used to cause liquid droplet discharge.
  • the application of heat energy to the liquid causes a change in state of the liquid.
  • This state change results in a large increase in volume which forces liquid to be discharged as a droplet from a discharge opening (hereinafter referred to as an orifice) provided at, for example, a front end of a recording head unit.
  • the liquid droplet is discharged from the orifice toward a recording medium on which it adheres to enable recording of information.
  • the liquid jet recording method disclosed in JP-A-54-59936 can be very effectively applied to the so-called drop-on demand recording method and can be easily realised by providing multiple orifices at high density on the recording head unit over a width corresponding to the full line width of the recording region of the recording medium. This has the advantage of enabling high resolution and high quality images to be obtained at high speeds.
  • An embodiment of the recording head of an apparatus for the above-described recording system is provided with a liquid discharge portion having an orifice for discharging ink droplets, a liquid ink path provided with a heat supplying portion communicating with the orifice for enabling heat energy to be applied to cause ink to be discharged from the orifice and an electro-thermal transducer corresponding to the heat-supplying portion for generating the heat energy.
  • a typical example of this electro-thermal transducer comprises a pair of electrodes, a heat generating resistance layer connected to these electrodes and a heat generating region (a heat generating portion) provided at a position corresponding to the portion between the electrodes.
  • the heat generating resistance layer and electrodes are generally formed as layers on the surface portion of the base plate of the ink jet recording head.
  • An example of a prior-art construction of the base plate in which such an electro-thermal transducer is formed is shown in Figures 1A and 1B of the accompanying drawings and will be described hereinafter with reference to these figures.
  • Figure 1A is a partial plan view showing the vicinity of an electro-thermal transducer on a substrate (hereinafter also referred to as the base plate) of an ink jet recording head
  • Figure 1B is a partial cross-sectional view of the portion indicated by dot-and-dash line XY in Figure 1A.
  • the base plate 101 is formed by a lower layer 106, a heat generating resistance layer 107, electrodes 103, 104, a first upper protective layer 108, a second upper protective layer 109 and a third upper protective layer 110 provided in succession on a supporting member 105.
  • the heat generating resistance layer 107 and electrodes 103 and 104 are patterned into a predetermined shape by etching. Thus, in portions other than the portion forming the heat generating region 102, these layers are patterned almost into one and the same shape. In the portion forming the heat generating region 102, the electrodes are not provided and the heat generating resistance layer 107 forms a heat generating portion 111.
  • the first upper protective layer 110 are provided over the whole surface of the base plate 101, while the second upper protective layer 109 is patterned so as not to be provided on the heat generating region 102.
  • each layer provided on the surface portion of the base plate as described above is suitably chosen based on the characteristics, such as heat-resistance, liquid-resistance, heat conductivity and insulative properties, required for the respective portion or layer.
  • the main function of the first upper protective layer 108 in the above-described example of the prior art is to provide the insulation between the common electrode 103 and the selected electrode 104.
  • the main function of the second upper protective layer 109 is to prevent the permeation of liquid and to provide liquid-resistance.
  • the main function of the third upper protective layer 110 is to reinforce liquid-resistance and mechanical strength.
  • the third protective layer 110 is in contact with ink, and care must be taken with regard to the effect on insulative properties and the like of defects in the film forming this layer.
  • Possible defects are pin-holes and dust in the film.
  • pin-holes may be removed by anode-oxidizing the surface of the film portion, but the effect of entry of dust into the film cannot be sufficiently removed.
  • the first and third protective layers 108 and 110 need to be thin (for example, 3 ⁇ m at greatest) for efficient heat conduction.
  • the vacuum accumulation method is therefore preferred for forming these layers. Because of the system used, it is not possible to avoid a certain probability of entry of dust into a film formed using the vacuum accumulation method. This is because, for example, when a vacuum is established or re-established in a vacuum container after film formation, part of the film which has peeled from the wall of the vacuum container adheres to the base plate and forms dust in the film.
  • the presence of defects in the protective layers of the heat generating portion due to the entry of dust into the film significantly reduces the durability of the head.
  • the base plate is one on which, for example, about twenty-four heat discharging portions are formed, the probability of the base plate becoming unsatisfactory is low and therefore, it will pose no problem in terms of yield to regard base plates containing dust as being unsatisfactory.
  • the probability of heat discharging portions which suffer from the entry of dust into the base plate may become high and if all of these are regarded as being unsatisfactory a reduction in yield will result.
  • the short-circuiting wiring portion is cut by the use of a laser beam to separate the wirings.
  • a laser beam results, as shown in Figures 2A-1 and 2B-1 of the accompanying drawings, in damage to the heat generating resistance layer 202 on the support member 201 of the substrate for recording head, so forming a large hole (recess) 206.
  • the ink may sometimes permeate into the portion where the hole 206 is formed, so corroding the electrodes 203, and finally sometimes leading to the disconnection of the wirings.
  • the reference numeral 205 designates that portion of the electrode which has been corroded by the ink.
  • Patent Abstracts of Japan Vol. 6, No. 86 (M-131) 25/201782 & JP-A-57 024 274 discloses a method of manufacturing a liquid jet recording head wherein a heating resistor layer is patterned by a laser beam melting method before or after an electrode layer is patterned by etching.
  • a method of manufacturing a substrate for a liquid jet recording head having a support member, an electro-thermal transducer provided on said support member and having a heat generating resistance layer and electrodes connected to said heat generating resistance layer, including cutting away a short-circuited wiring portion of said electrodes; characterised by the steps of: providing a filler in a recess created by said cutting step; and providing a protective layer on said filler and said electrodes.
  • a method of manufacturing a substrate for an ink jet recording head in accordance with the invention enables the provision of a recording head which is free of the possibility of recording liquid permeating from a recess created by the short-circuited wiring portion of electrodes being cut to thereby corrode the wiring and which is high in reliability.
  • the present invention also provides a substrate for a liquid jet recording head in accordance with claim 7 and a liquid jet recording head in accordance with claim 8.
  • the filler is embedded into the recess created in the support member by cutting the short-circuited wiring portion of the electrodes by a laser beam or the like, whereby the great level difference of the recess is eliminated, and the protective layer is provided on the embedded filler and the electrodes so that the covering property of the protective layer may be improved and therefore, the permeation of recording liquid into the electrodes can be eliminated to thereby prevent the corrosion of the electrodes.
  • an insulating material is used as the embedded filler, whereby the reliability of the recording head during the long-term use thereof in the recording liquid can be improved.
  • Figures 3A and 3B are a top plan view and a side cross-sectional view, respectively, of a base plate (also called a substrate) for a recording head.
  • a base plate also called a substrate
  • Figures 3A and 3B on a lower layer comprising SiO 2 on which a supporting member 105 comprising Si is formed, a heat generating resistance member, a layer comprising HfB 2 and Al conductive layer to form electrode are formed by the use of the vacuum thin film making technique.
  • the patterns of a heat generaitng resistance member 102 and electrodes 103 and 104 are formed by the photolithography technique.
  • a first protective layer 108 formed of SiO 2 is formed with a thickness of 0.5 ⁇ m by sputtering.
  • the base plate is inspected by means of an optical microscope, and the base plate having a defect 112 in the protective layer 108 for the heat generating resistance member 102 is extracted.
  • This extracted base plate is then placed into a powerful ultrasonic wave tank, and dust (foreign substance) in the defect 112 is removed.
  • the reference character 112A designates the pore from which the foreign substance has been removed.
  • the base plate is placed into a vacuum chamber and silane (SiH 4 ) and NO 2 are poured thereinto to provide an atmosphere of 1 Torr.
  • a laser beam is applied to the pore 112A, and in this portion, silane (SiH 4 ) and NO 2 are caused to react to each other.
  • a filler 113 comprising SiO 2 is accumulated in the pore 112A.
  • the amount of SiO 2 accumulated in the pore is adjusted by adjusting the application time of the laser beam.
  • upper protective layers 109 and 110 are formed as shown in Figure 6, whereupon the manufacturing process for the base plate is completed.
  • SiO 2 layer 116 is formed into film having a thickness of 0.5 ⁇ m on the base plate as shown in Figure 4 by sputtering.
  • Resist 114 (OFPR 800; trade name, manufactured by TOK Co., Ltd.) is then applied with a thickness of 4 ⁇ m by spin coat. A pattern having a window 114A formed corresponding to the pore is formed by the photolithography technique.
  • resist 115 (OFPR 800; trade name, manufactured by TOK Co., Ltd.) is applied with a thickness of 1 ⁇ m by spin coat. The thickness of the resist 115 applied later is smaller than the thickness of the resist 114 applied earlier and therefore is not flattened, but assumes a shape as shown in Figure 8.
  • CF 4 and H 2 are poured at a ratio of 1 : 1 by the use of a reactive ion etching apparatus, and etching is effected at a power of 400 W.
  • the etching speed of the resist is 500 ⁇ /min. and that of SiO 2 is 500 ⁇ /min. and therefore, the resist and SiO 2 are etched at an equal speed.
  • that portion of the heat generating resistance member to which the resist has been applied is such that the thickness of SiO 2 116 is 0.5 ⁇ m, whereas the thickness of the resist 115 is 1 ⁇ m and therefore, the surface formed by etching becomes flat and accordingly, the resist is etched while keeping its original shape.
  • etching is terminated.
  • the shape of the base plate becomes such as shown in Figure 9.
  • the resists 114 and 115 are peeled off, and a second protective layer 109 formed of organic polyimide is formed as a protective layer for electrodes 103 and 104.
  • Ta is formed into film as a third protective layer 110 by sputtering, to thereby provide such a shape as shown in Figure 10.
  • a recording head constructed of a base plate having a defect of about 3 ⁇ m diameter.
  • the applied pulse use was made of a rectangular pulse having a frequency of 2 kHz and a pulse width of 10 ⁇ s, and the applied voltage was 1.2 times as great as the voltage value for ordinary discharge.
  • the life of the recording head filled pore was more than 5 times that of the comparative example.
  • the defects of the base plate can be reduced and the yield is improved with a result that the manufacturing cost of the recording head can be reduced.
  • Figures 11A-1 to 11A-4 and 11B-1 to 11B-4 show the steps of an embodiment of the present invention
  • Figures 11A-1 to 11A-4 are plan views showing the course of the steps
  • Figures 11B-1 to 11B-4 are corresponding cross-sectional views along line X - Y in Figures 11A-1 to 11A-4 which show the course of the steps.
  • the reference numeral 201 designates a support member for a substrate (also called a base plate) 201A for a recording head
  • the reference numeral 201B denotes a lower layer formed on the support member
  • the reference numeral 202 denotes a heat generating resistance layer provided on the lower layer 201B
  • the reference numeral 203 designates lead-out electrodes of aluminum connected to the heat generating resistance layer 202
  • the reference numeral 204 denotes an upper protective layer formed of SiO 2 and provided on the heat generating resistance layer 202 and the electrodes 203
  • the reference numeral 206 designates a hole (a recess) created in the support member 201 by cutting by a laser beam
  • the reference numeral 207 denotes a short-circuited wiring portion
  • the reference numeral 208 designates a filler formed of an insulating material such as SiO 2 embedded in the hole 206.
  • the electro-thermal transducer has at least the heat generating resistance layer 202 and the electrodes
  • the heat generating resistance layer 202 formed of HfB 2 is laminated on the lower layer 201B formed of heat-oxidized SiO 2 on the Si (silicon) support member 201, and the electrodes 203 of aluminum are deposited thereon by evaporation with a thickness of 500 nm (5000 ⁇ ) and are subjected to patterning and wiring.
  • the portion 207 is short-circuited.
  • this short-circuited wiring portion 207 is cut by a laser beam.
  • the short-circuited wiring portion 207 was actually short three times by a laser beam having a wavelength of 1.06 ⁇ m, a beam intensity of 20 mJ/pulse and a pulse width of 20 nS, the short-circuited wiring portion 207 could be cut.
  • Figure 11A-2 shows the state of that portion after cut, and it is seen that as shown in Figure 11B-2, a hole 206 is formed on the support member 201 at the cut portion thereof.
  • the insulating material 208 as a filler is embedded into this hole 206.
  • the depth of the hole 206 is 2 ⁇ m. Therefore, the substrate 201 - 204 is placed into a vacuum chamber, not shown, and a mixture gas of silane (SiH 4 ) and nitrogen dioxide (NO 2 ) is caused to flow into the chamber to thereby provide an atmosphere of 1 Torr.
  • SiH 4 silane
  • NO 2 nitrogen dioxide
  • FIG. 11A-3 The state in which the hole 206 has been filled with the insulating material 208 which is SiO 2 by such laser CVD (vapor phase growing method) is shown in Figure 11A-3.
  • the filler 208 which is the insulating material is formed with said application time adjusted so that there may hardly be provided a level difference with respect to the height of the electrodes 203 of the wiring.
  • the layer 204 of SiO 2 as an upper protective layer is formed with a thickness of 1 ⁇ m on the filler 208 and the electrodes 203 by the sputtering method.
  • the protective layer 204 of SiO 2 sufficiently covers the hole 206 formed by cutting the short-circuited wiring portion of the electrodes 203 by the laser beam and the lead-out electrodes 203.
  • Figure 12 shows an example of a recording head made by forming discharge openings of recording liquid in the recording head substrate made in this manner, and actually mounting an integrated circuit thereon.
  • the reference numeral 211 designates heat generating portions (heater portions)
  • the reference numeral 402 denotes discharge opening
  • the reference numeral 403 designates an ink path wall forming liquid paths
  • the reference numeral 404 denotes a common liquid chamber
  • the reference numeral 405 designates a top plate
  • the reference numeral 406 denotes ink supply ports.
  • the liquid jet recording head shown in Figure 12 was subjected to an ink permeation test for a long period of time, but there occurred no corrosion of the electrodes 203 by the permeation of ink from the portion in which the hole 206 was created, i.e., the portion filled with the filler 208. Accordingly, it could be confirmed that the reliability of the recording head can be enhanced by filling the recess created in that portion of the support member in which the short-circuited wiring portion was cut by the laser beam as in the present embodiment with a filler such as an insulating material.
  • the filler embedded into the hole may preferably be an insulating material, because there is the possibility of short-circuiting being caused between the wirings if the filler is not an insulating material.
  • the insulating material embedded into the recess is SiO 2 , but of course, another insulating material may be used. That is, at least one kind selected from SiO 2 , Si 3 N 4 , SiC, Ta 2 O 5 , Al 2 O 3 , AlN, BN, B 2 O 3 , BeO, TiN, TiO 2 and WO 3 can be used as a preferred material.
  • the direction of ink discharge is the surface direction of the heater portion 211, but the present invention is also applicable to a liquid jet recording head as shown in Figure 13 wherein ink is discharged in a direction almost perpendicular to the heater portion 211.
  • the recess formed in the support member of the substrate by cutting the short-circuited wiring portion by a laser beam or the like is filled with a filler and the great level difference of the recess is eliminated so that the covering property of the upper protective layer for protecting the wiring may be improved and therefore, the permeation of the recording liquid into the electrode wiring portion can be prevented and the wiring is not corroded with a result that disconnection does not occur and the long-term reliability of the recording head can be improved.
  • FIG 14 is a schematic perspective view showing an example of the ink jet recording apparatus IJRA to which the present invention is applied.
  • a carriage HC which engages with a spiral groove 5004 of a lead screw 5005 being rotatable through driving force transmitting gears 5011, 5009 in conjunction with the reciprocal rotation of a drive motor 5013 has a pin (not shown) and is reciprocated in the directions of arrows a, b.
  • 5002 is a paper holding plate and presses paper against a platen 5000 throughout the range of the movement of the carriage.
  • 5007, 5008 are photocouplers, which are used as home position detecting means for detecting the presence of the lever 5006 of the carriage in the predetermined area to switch the direction of rotation of the motor 5013.
  • 5016 is a member which holds a capping member 5022 for capping the front surface of a cartridge recording head IJC integrally provided with an ink tank.
  • 5015 is a suction means for suction of the inside of the cap and effects suction recovery of the head through a opening 5023 in the cap.
  • 5017 is a cleaning blade and 5019 is a member for moving the blade forward and afterward, the both being supported on a mainbody supporting member 5018.
  • the shape of the blade is not limited to that shown in the figure, and any one of well known blades may be employed for this example.
  • a lever for starting suction for suction recovery which moves in conjunction with the movement of a cam 5020 engaged with the carriage, whereby the driving force of the drive motor is transmitted by a conventional transmitting means such as clutch transfer and the like to be utilized for control.
  • the present invention brings about excellent effects particularly in a recording head, recording device of the bubble jet system among the ink jet recording system.
  • the on-demand type is effective because, by applying at least one driving signal which gives rapid temperature elevation exceeding nucleus boiling corresponding to the recording information on an electricity-heat convertors arranged corresponding to the sheets or liquid channels holding liquid (ink), heat energy is generated at the electricity-heat converters to effect film boiling at the heat acting surface of the recording head, and consequently the bubbles within the liquid (ink) can be formed corresponding one by one to the driving signals.
  • the constitution of the recording head in addition to the combination constitutions of discharging orifice, liquid channel, electricity-heat converter (linear liquid channel or right angle liquid channel) as disclosed in the above-mentioned respective specifications, the constitution by use of U.S. Patent 4,558,333, 4,459,600 disclosing the constitution having the heat acting portion arranged in the flexed region is also included in the present invention.
  • the present invention can be also effectively made the constitution as disclosed in Japanese Patent Laid-Open Application No. 59-123670 which discloses the constitution using a slit common to a plurality of electricity-heat converters as the discharging portion of the electricity-heat converter or Japanese Patent laid-Open Application No. 59-138461 which discloses the constitution having the opening for absorbing pressure wave of heat energy correspondent to the discharging portion.
  • the recording head of the full line type having a length corresponding to the maximum width of recording medium which can be recorded by the recording device
  • either the constitution which satisfies its length by combination of a plurality of recording heads as disclosed in the above-mentioned specifications or the constitution as one recording head integrally formed may be used, and the present invention can exhibit the effects as described above further effectively.
  • the present invention is effective for a recording head of the freely exchangeable chip type which enables electrical connection to the main device or supply of ink from the main device by being mounted on the main device, or for the case by use of a recording head of the cartridge type provided integrally on the recording head itself.
  • a restoration means for the recording head, a preliminary auxiliary means, etc. provided as the constitution of the recording device of the present invention is preferable, because the effect of the present invention can be further stabilized.
  • Specific examples of these may include, for the recording head, capping means, cleaning means, pressurization or aspiration means, electricity-heat converters or another heating element or preliminary heating means according to a combination of these, and it is also effective for performing stable recording to perform preliminary mode which performs discharging separate from recording.
  • the present invention is extremely effective for not only the recording mode only of a primary stream color such as black etc., but also a device equipped with at least one of plural different colors or full color by color mixing, whether the recording head may be either integrally constituted or combined in plural number.
  • any ink which is solid or softened at room temperature may also be used in the present invention.
  • the ink jet recording apparatus it is a common practice to control the temperature of ink itself within a range of 30 to 70 °C, thus adjusting the viscosity of the ink to be within the stable ejection range. Accordingly any ink which is liquid upon applying a recording signal may be used. Furthermore, any ink which is liquefied upon application of thermal energy may also be used in the present invention.
  • Such a type of inks include, for example, one which upon application of thermal energy depending on recording signal, is liquefied to be ejected in the form of ink droplet and one which is being solidified at the time of arriving at a recording medium.
  • Such a type of inks are used for the purpose of, for example, positively utilizing thermal energy as the energy for phase change of ink from solid to liquid to prevent temperature elevation due to thermal energy or using an ink which is solidified when left to stand to prevent evaporation of ink.
  • the ink When such an ink is to be used, the ink may be held in the form of liquid or solid in recessed portions or through holes of a porous sheet while facing the electro-thermal transducer as shown in, for example, Japanese Laid-Open Patent Application Nos. 54-56847 and 60-71260.
  • the most useful system for use of the inks as described above is the system effecting film boiling as described above.

Claims (9)

  1. Verfahren zur Herstellung eines Substrats für einen Flüssigkeitsstrahl-Aufzeichnungskopf mit
       einem Tragelement (201), und
       einem elektrothermischen Wandler (211), der auf dem Tragelement vorgesehen ist und der eine wärmeerzeugende Widerstandsschicht (202) sowie Elektroden aufweist, die mit der wärmeerzeugenden Widerstandsschicht verbunden sind, wobei
       an den Elektroden ein Kurzschluß-Verdrahtungsabschnitt abgeschnitten wird, gekennzeichnet durch die Schritte:
       Anordnung einer Füllung (208) in einer Vertiefung, die durch den Schritt des Schneidens erzeugt wird; und
       Anordnung einer Schutzschicht (204) auf der Füllung und auf den Elektroden.
  2. Verfahren zur Herstellung eines Flüssigkeitsstrahl-Aufzeichnungskopfes unter Herstellung eines Substrats durch das Verfahren nach Anspruch 1 und durch Ausbildung von Ausstoßöffnungen (402) an dem Substrat.
  3. Verfahren nach Anspruch 1 oder 2, dadurch gekennzeichnet, daß ein Isoliermaterial als Füllung verwendet wird.
  4. Verfahren nach Anspruch 3, welches die Anordnung der Füllung mittels chemischer Laserdampfaufbringung umfaßt.
  5. Verfahren nach Anspruch 3 oder 4, wobei als Isoliermaterial SiO2, Si3N4, SiC, Ta4O5, Al2O3, AlN, BN, B2O3, BeO, TiN, TiO2 oder WO3 Verwendung findet.
  6. Verfahren nach Anspruch 1 oder 2, dadurch gekennzeichnet, daß der Schritt des Schneidens durch den Einsatz eines Laserstrahls ausgeführt wird.
  7. Substrat für einen Flüssigkeitsstrahl-Aufzeichnungskopf, wobei das Substrat umfaßt:
       ein Tragelement (201), und
       einen elektrothermischen Wandler (211), der auf dem Tragelement vorgesehen ist und der eine wärmeerzeugende Widerstandsschicht (202) sowie Elektroden aufweist, die mit der wärmeerzeugenden Widerstandsschicht verbunden sind, wobei
       an den Elektroden ein Kurzschluß-Verdrahtungsabschnitt abgeschnitten wird, dadurch gekennzeichnet, daß
       eine Füllung (208) in einer Vertiefung vorgesehen ist, die durch den Schritt des Abschneidens des Kurzschluß-Verdrahtungsabschnittes erzeugt wird; und daß
       eine Schutzschicht (204) auf der Füllung und auf den Elektroden vorgesehen ist.
  8. Flüssigkeitsstrahl-Aufzeichnungskopf mit einem Substrat, welches umfaßt:
       ein Tragelement (201), und
       einen elektrothermischen Wandler (211), der auf dem Tragelement vorgesehen ist und der eine wärmeerzeugende Widerstandsschicht (202) sowie Elektroden aufweist, die mit der wärmeerzeugenden Widerstandsschicht verbunden sind, wobei
       an den Elektroden ein Kurzschluß-Verdrahtungsabschnitt abgeschnitten wird, dadurch gekennzeichnet, daß
       eine Füllung (208) in einer Vertiefung vorgesehen ist, die durch den Schritt des Abschneidens des Kurzschluß-Verdrahtungsabschnittes erzeugt wird; und daß
       eine Schutzschicht (204) auf der Füllung und auf den Elektroden vorgesehen ist.
  9. Flüssigkeitsstrahl-Aufzeichnungsgerät, welches einen Flüssigkeitsstrahl-Aufzeichnungskopf gemäß Anspruch 8 aufweist.
EP93201057A 1989-03-01 1990-02-28 Methode zur Herstellung eines Substrats für einen Flüssigkeitsstrahl-Aufzeichnungskopf Expired - Lifetime EP0559295B1 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP4883889A JP2659238B2 (ja) 1989-03-01 1989-03-01 インクジェット記録ヘッド、該ヘッド用基体および該基体の製造方法
JP48838/89 1989-03-01
JP4883989A JPH02227255A (ja) 1989-03-01 1989-03-01 液体噴射記録ヘッド用基体の製造方法およびその方法により製造された基体、並びにその基体を用いた液体噴射記録ヘッド
JP48839/89 1989-03-01
EP90302165A EP0390338B1 (de) 1989-03-01 1990-02-28 Methode zur Herstellung eines Substrates für einen Flüssigkeitsstrahl-Aufzeichnungskopf

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
EP90302165.7 Division 1990-02-28

Publications (2)

Publication Number Publication Date
EP0559295A1 EP0559295A1 (de) 1993-09-08
EP0559295B1 true EP0559295B1 (de) 1996-07-03

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EP93201057A Expired - Lifetime EP0559295B1 (de) 1989-03-01 1990-02-28 Methode zur Herstellung eines Substrats für einen Flüssigkeitsstrahl-Aufzeichnungskopf
EP90302165A Expired - Lifetime EP0390338B1 (de) 1989-03-01 1990-02-28 Methode zur Herstellung eines Substrates für einen Flüssigkeitsstrahl-Aufzeichnungskopf

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EP (2) EP0559295B1 (de)
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Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5660739A (en) * 1994-08-26 1997-08-26 Canon Kabushiki Kaisha Method of producing substrate for ink jet recording head, ink jet recording head and ink jet recording apparatus
JPH09109392A (ja) * 1995-10-13 1997-04-28 Canon Inc インクジェット記録ヘッドの製造方法および同方法により製造されたインクジェット記録ヘッド、並びにインクジェット記録装置
RU2151066C1 (ru) * 1998-11-03 2000-06-20 Самсунг Электроникс Ко., Лтд. Узел пластины сопла микроинжектора и способ его изготовления

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2473214A1 (fr) * 1980-01-04 1981-07-10 Thomson Csf Plaquette de resistances en ligne a tres faible pas et barrette d'impression thermique utilisant cette plaquette de resistances en ligne
JPS59194867A (ja) * 1983-04-20 1984-11-05 Canon Inc ヘッドの製造方法
US4707708A (en) * 1985-09-27 1987-11-17 Hitachi, Ltd. Thermal print head

Also Published As

Publication number Publication date
DE69014690D1 (de) 1995-01-19
DE69027685T2 (de) 1996-11-28
EP0559295A1 (de) 1993-09-08
DE69027685D1 (de) 1996-08-08
ATE139940T1 (de) 1996-07-15
DE69014690T2 (de) 1995-05-04
EP0390338A1 (de) 1990-10-03
EP0390338B1 (de) 1994-12-07
ATE115051T1 (de) 1994-12-15

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