FR2456390A1 - Grille d'encapsulation, microboitier de circuit electronique utilisant cette grille et procede d'encapsulation de circuit electronique en microboitier - Google Patents

Grille d'encapsulation, microboitier de circuit electronique utilisant cette grille et procede d'encapsulation de circuit electronique en microboitier

Info

Publication number
FR2456390A1
FR2456390A1 FR7911989A FR7911989A FR2456390A1 FR 2456390 A1 FR2456390 A1 FR 2456390A1 FR 7911989 A FR7911989 A FR 7911989A FR 7911989 A FR7911989 A FR 7911989A FR 2456390 A1 FR2456390 A1 FR 2456390A1
Authority
FR
France
Prior art keywords
integrated circuit
single piece
external contacts
piece component
grid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7911989A
Other languages
English (en)
French (fr)
Other versions
FR2456390B1 (cg-RX-API-DMAC10.html
Inventor
Christian Val
Claude Vergnolle
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thomson CSF SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson CSF SA filed Critical Thomson CSF SA
Priority to FR7911989A priority Critical patent/FR2456390A1/fr
Publication of FR2456390A1 publication Critical patent/FR2456390A1/fr
Application granted granted Critical
Publication of FR2456390B1 publication Critical patent/FR2456390B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H10W40/778—
    • H10W70/429—
    • H10W74/111—
    • H10W72/534—
    • H10W72/5363—
    • H10W72/5449—
    • H10W72/5522—
    • H10W72/5524—
    • H10W72/932—
    • H10W90/756—

Landscapes

  • Wire Bonding (AREA)
FR7911989A 1979-05-11 1979-05-11 Grille d'encapsulation, microboitier de circuit electronique utilisant cette grille et procede d'encapsulation de circuit electronique en microboitier Granted FR2456390A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR7911989A FR2456390A1 (fr) 1979-05-11 1979-05-11 Grille d'encapsulation, microboitier de circuit electronique utilisant cette grille et procede d'encapsulation de circuit electronique en microboitier

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7911989A FR2456390A1 (fr) 1979-05-11 1979-05-11 Grille d'encapsulation, microboitier de circuit electronique utilisant cette grille et procede d'encapsulation de circuit electronique en microboitier

Publications (2)

Publication Number Publication Date
FR2456390A1 true FR2456390A1 (fr) 1980-12-05
FR2456390B1 FR2456390B1 (cg-RX-API-DMAC10.html) 1983-01-21

Family

ID=9225343

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7911989A Granted FR2456390A1 (fr) 1979-05-11 1979-05-11 Grille d'encapsulation, microboitier de circuit electronique utilisant cette grille et procede d'encapsulation de circuit electronique en microboitier

Country Status (1)

Country Link
FR (1) FR2456390A1 (cg-RX-API-DMAC10.html)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2495377A1 (fr) * 1980-11-28 1982-06-04 Western Electric Co Encapsulation pour un circuit integre
DE3046192A1 (de) * 1980-12-08 1982-07-15 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Traegerelement fuer ic-bausteine
EP0090608A3 (en) * 1982-03-30 1985-05-22 Fujitsu Limited Semiconductor device with moulded package
FR2584241A1 (fr) * 1985-06-26 1987-01-02 Nat Semiconductor Corp Bande revetue de nickel
EP0204102A3 (en) * 1985-06-03 1987-11-19 Motorola, Inc. Direct connection of lead frame having flexible, tapered leads and mechanical die support
EP0232108A3 (en) * 1986-01-27 1988-07-20 Olin Corporation Process for manufacturing bumped tape for tape automated bonding and the product produced thereby.
US4812949A (en) * 1986-03-28 1989-03-14 Bull, S.A. Method of and apparatus for mounting an IC chip
EP0366386A3 (en) * 1988-10-24 1991-02-06 Motorola, Inc. Flagless semiconductor package
US5041902A (en) * 1989-12-14 1991-08-20 Motorola, Inc. Molded electronic package with compression structures
US5216283A (en) * 1990-05-03 1993-06-01 Motorola, Inc. Semiconductor device having an insertable heat sink and method for mounting the same
EP0539095A3 (cg-RX-API-DMAC10.html) * 1991-10-23 1994-02-16 Fujitsu Ltd
US8359740B2 (en) 2008-12-19 2013-01-29 3D Plus Process for the wafer-scale fabrication of electronic modules for surface mounting

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3930114A (en) * 1975-03-17 1975-12-30 Nat Semiconductor Corp Integrated circuit package utilizing novel heat sink structure
US4026008A (en) * 1972-10-02 1977-05-31 Signetics Corporation Semiconductor lead structure and assembly and method for fabricating same
FR2360174A1 (fr) * 1976-07-30 1978-02-24 Amp Inc Boitier de circuit integre et son procede de fabrication
FR2375721A1 (fr) * 1976-12-23 1978-07-21 Siemens Ag Support intermediaire prevu pour le soutien et le contactage d'un corps semiconducteur

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4026008A (en) * 1972-10-02 1977-05-31 Signetics Corporation Semiconductor lead structure and assembly and method for fabricating same
US3930114A (en) * 1975-03-17 1975-12-30 Nat Semiconductor Corp Integrated circuit package utilizing novel heat sink structure
FR2360174A1 (fr) * 1976-07-30 1978-02-24 Amp Inc Boitier de circuit integre et son procede de fabrication
FR2375721A1 (fr) * 1976-12-23 1978-07-21 Siemens Ag Support intermediaire prevu pour le soutien et le contactage d'un corps semiconducteur

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2495377A1 (fr) * 1980-11-28 1982-06-04 Western Electric Co Encapsulation pour un circuit integre
DE3046192A1 (de) * 1980-12-08 1982-07-15 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Traegerelement fuer ic-bausteine
EP0090608A3 (en) * 1982-03-30 1985-05-22 Fujitsu Limited Semiconductor device with moulded package
US4698660A (en) * 1982-03-30 1987-10-06 Fujitsu Limited Resin-molded semiconductor device
EP0204102A3 (en) * 1985-06-03 1987-11-19 Motorola, Inc. Direct connection of lead frame having flexible, tapered leads and mechanical die support
FR2584241A1 (fr) * 1985-06-26 1987-01-02 Nat Semiconductor Corp Bande revetue de nickel
EP0232108A3 (en) * 1986-01-27 1988-07-20 Olin Corporation Process for manufacturing bumped tape for tape automated bonding and the product produced thereby.
US4812949A (en) * 1986-03-28 1989-03-14 Bull, S.A. Method of and apparatus for mounting an IC chip
EP0366386A3 (en) * 1988-10-24 1991-02-06 Motorola, Inc. Flagless semiconductor package
US5041902A (en) * 1989-12-14 1991-08-20 Motorola, Inc. Molded electronic package with compression structures
US5216283A (en) * 1990-05-03 1993-06-01 Motorola, Inc. Semiconductor device having an insertable heat sink and method for mounting the same
EP0539095A3 (cg-RX-API-DMAC10.html) * 1991-10-23 1994-02-16 Fujitsu Ltd
US5659200A (en) * 1991-10-23 1997-08-19 Fujitsu, Ltd. Semiconductor device having radiator structure
US8359740B2 (en) 2008-12-19 2013-01-29 3D Plus Process for the wafer-scale fabrication of electronic modules for surface mounting

Also Published As

Publication number Publication date
FR2456390B1 (cg-RX-API-DMAC10.html) 1983-01-21

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Legal Events

Date Code Title Description
ST Notification of lapse